PG-Fig10-37.in : Simulation of oxide deposition in a trench

PG-Fig10-37.in : Simulation of oxide deposition in a trench

PG-Fig10-37.in : Simulation of oxide deposition in a trench

Every software package contains a full set of examples suitable for that version and are installed with the software. If you see examples here that are not in your installation you should consider updating to a later version of the software. These examples can be used by beginners and advanced users for product evaluation, teaching purposes, and self-training.

Required Modules

Victory Process

  • Core Simulator

From “Integrated Circuit Fabrication: Science and Technology by Plummer & Griffin, published by Cambridge University Press

Simulation of oxide deposition in a trench
with different ratios of sidewall to planar coverage
The parameters roughly corrsepond to conformal (ratio=1),
sputter (ratio=0.5) and evaporated (ratio=0.1) films
You must specify Si as well as Oxide Rate/Ratio

Images

PG-Fig10-37_conformal.png

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