Simulation Standard

Gallium nitride (GaN)-based devices have entered the power electronics market and are showing excellent progress in the medium power conversion application [1]-[5]. For high-power conversion application, devices with vertical geometry

In a previous article in Simulation Standard article entitled “Soft Error Simulations”, we discussed various ways to simulate soft errors using either TCAD, SPICE or a mixture of both. In

Liquid Crystals (LCs) are widely used in the display technology due to the property of optical birefringence. Being sandwiched by two crossed polarizers, an LC medium will work as a

Researchers and designers are looking into a future of ultra-low power and ultra-low voltage (ULV) devices and designs. Portable devices, nodes, and sensors, energy harvesting are all examples of devices

TFT panels have already gained their undisputable reputation in a variety of professional and commercial applications. High quality, ease of customization, and comparably low manufacturing costs position these panels as

Compared with regular MOSFET devices, the body bias effect in HVMOS is usually more pronounced. In addition to the regular threshold voltage increase with body bias, the LDD region of

3D TFT analysis has been getting lots of attention due to issues caused by 3D effects such as the edge effect on the TFT characteristics. The presence of an enhanced

Dual-Gate Thin Film Transistors (DGTFTs) are often used in pixel driver and peripheral circuits for liquid crystal displays. This is because of the reduction of the gate-off state leakage current

The planar bulk Si metal-oxide semiconductor field-effect transistor (MOSFET) has reached its scaling limit due to various short channel effects (SCE). With 20 nm advanced planar technology, the source and

Semiconductor devices such as bipolar power transistors and solar cells may operate over a range of optical or electrical injection levels. In some cases of high injection, this may result

During the last several years, the enhancement of integrated circuits (ICs) performance and power consumption have contributed to the continual scaling down the size of transistors. However, scaling down semiconductor

Q: How do I extract geometric information, such as material thickness or junction depth, from the current 3D process simulation using Victory Process?