Casey Molver

This article presents a standard case of transmission line: the microstrip structure. First, the structure is described and then the results extracted from QUEST are compared with measurements. We thank

ATLAS allows the user to define a contact with a number of different boundary conditions; ohmic, Schottky, current controlled, floating or reflecting. The Schottky contact boundary condition realizes that at

We give in this article an introduction to the Verilog-A SmartSpice interface. This new feature in SmartSpice allows the user to write their own physical models in the Verilog-A language.

Ramtron International Corporation has developed a ferroelectric capacitance model with a new concept of double distributions of domain reversal voltages.

Acknowledging the need for more flexibility, SmartSpice now provides three numerical methods for linear system solution. The additional solvers provide for greater capacity by minimizing memory requirements and reducing the

The BSIM4 model provides a RF CMOS modeling capability. Prior to the BSIM4 model the RF modeling was accomplished by using macro models. The macro models were complex, contained many

It is well known that analyzing LVS reports is often a difficult and brain-teasing task because the "global" nature of connectivity. Unlike DRC reports, where geometrical violations are usually restricted

Antenna rules is a common name for rules that check ratios of amounts of material in two layers from the same node. They are used to limit the damage of

Expert API is intended for customizing and extending the existing software functionality by functions written by the users of Expert using C/C++.

A simple way to add custom commands to Expert's menu is implemented. It is possible to add menu items that execute xi-commands or procedures. To do this, you must put

We analyze quantitatively the real impact of technology on the needed level for carrier transport modeling. The results, based on theoretical analyses, are applied to existing devices. This work shows

Signals propagated in actual and future IC's interconnections are spreading, in terms of spectrum frequency, from DC to microwave domain because of the continually increasing clock frequencies of circuits. So,