Every software package contains a full set of examples suitable for that version and are installed with the software. If you see examples here that are not in your installation you should consider updating to a later version of the software. These examples can be used by beginners and advanced users for product evaluation, teaching purposes, and self-training.
Required Modules
Victory Process
- 2D Stress
This example demonstrates how intrinsic stress can be defined in different material layers and how to calculate the propagation of this stress through the material layers.
The example starts by building a simple material stack in Victory Process. The structure is then loaded into Victory Mesh to build a mesh suitable for stress calculations. Whilst in Victory Mesh, the structure is mirrored.
The Youngs Modulus and Poisson ratio are set for two of the materials in the stack as they use arbitrary names and are therefore not included in the standard database. The same syntax could be used to overwrite the default parameters on standard materials.
Intrinsic stress is then defined for all of the layers included in the structure. Arbitrary values are given here for demonstration purposes only and should not be considered realistic. Different fabrication processes can cause different levels of stress for the same materials.
The boundary conditions are then defined. They are split into two statements to help with clarity. The first sets if a boundary is free to move or not, and if it is, in what direction(s). We are considering that this example is a single cell at the surface of a wafer, the full wafer is not included and the cell is repeated many times. As such we have set ZM.FREE – this means that the Z boundary on the minus axis is free to move – this is the surface of the device. We have then also set X.FREE.Z, this means that the faces on the x boundaries are free to move in the z direction. A face is fixed by default unless you explicitly free it.
The second boundary condition invokes periodic boundary conditions, meaning the (mirrored) cell is repeated. Caution is required and you must ensure for periodic that the left edge will align with the right edge.
The boundary conditions are then called (METHOD) and stress solved for before finally the stressed and deformed devices are saved and plotted.
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