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VP_Stress_ex02.in : Wafer warpage – stress

VP_Stress_ex02.in : Wafer warpage – stress

VP_Stress_ex02.in : Wafer warpage – stress

Every software package contains a full set of examples suitable for that version and are installed with the software. If you see examples here that are not in your installation you should consider updating to a later version of the software. These examples can be used by beginners and advanced users for product evaluation, teaching purposes, and self-training.

Required Modules

Victory Process

  • 3D Structure Editor
  • 3D Stress

Victory Mesh

  • 3D Meshing

The example demonstrates saddle-shaped wrapping of silicon wafer due to asymmetric bi-axial stress. The stress is introduced by a thin film deposition.

The structure is built in Cell mode using Victory Process and remeshed in Victory Mesh for solver-friendly volume mesh.

Then structure with its stress-mesh (using “LOADSTRESSMESH ” option in LOAD) is reloaded in Victory Process. The example demonstrates how to change material properties, like young’s modulus & Poisson’s ratio, using MATERIAL statement.

Next, the example sets the intrinsic stress in the “film ” using “SETSTRESS ” statement and defines the needed boundary conditions for stress calculation using STRESSBOUNDARYCONDITIONS statement. Then stress is calculated using “STRESS ” statement.

The visualization shows a saddle shaped wafer wrappage.

Images

VP_Stress_ex02_01.png

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