Casey Molver

Know how your circuit behaves across process variation before silicon tells you, with Monte Carlo-accurate results up to 30X faster. 

The 13th International MOS-AK Workshop will be hosted virtually on December 10 and 11, 2020, and Silvaco R&D will be presenting. The MOS-AK Workshop aims to strengthen a network and

6 years ago

November 12, 2020 Silvaco Inc., a leading supplier of EDA software and design IP, today announced that it has completed the acquisition of the memory compiler technology and standard cell

6 years ago

Martin Mallinson is an experienced analog circuit designer with multiple patents. Over his 40-year career, his audio designs have been used in millions of smartphones. Martin spoke with Graham Bell

6 years ago

MEMS World Summit is the world’s foremost annual meeting and business platform for engaging with political, business, financial, research and industry leaders of the MEMS manufacturing industry. At the Shanghai

6 years ago

Location Atlanta, GA Silvaco seeks an experienced Application Engineer with a strong background in electrical device measurement and characterization, and in SPICE model extraction. This individual will be responsible for

6 years ago

In this webinar, we describe how SmartSpice HPP takes advantage of the modern multicore hardware platforms to speed up all internal aspects of transient simulations of analog circuits by adopting

6 years ago

In this paper the critical design features of a SiC superjunction trench MOS device were optimized using CAD to obtain a high breakdown voltage while minimizing any unnecessary increase in

6 years ago

Conductive Bridge Random Access Memory (CBRAM) is a non-volatile memory device technology that can operate by consuming very low power. Another advantage of the CBRAM devices is its ability to

6 years ago

The qualification of GaN power high-electron-mobilitytransistors (HEMTs) must consider the device ruggedness against out-of-SOA (safe operating area) events [1- 3].

6 years ago

Dry etching is commonly used in semiconductor processing to generate deep trenches with good anisotropy. Dry etching is applied to many semiconductor technologies including Advanced FinFETs, 3D NAND, and vertical