9 years ago

Lower conduction loss and fast switching characteristics for power devices are increasingly required in the more and more energy-conscious world. For the low to medium voltage ranges (12 V ~

9 years ago

It is often the case, that an Engineer is required to simulate environmental effects on a device manufactured by a third party. In such an event, the first issue that

9 years ago

In recent years, radio-frequency (RF) CMOS on Silicon-on-Insulator (SOI) has rapidly evolved as a mainstream technology for switches used in wireless applications such as tuners and power amplifiers [1, 2].

9 years ago

일시: 2017년 12월 8일 | 3:00am-3:30am (한국 시각) Gateway 툴 플로우에 iPDK 디자인 키트를 통합하는 것에 대해 논의합니다.

9 years ago

2017년 10월 26일 | 3:00am-3:30am (한국 시각) 이번 시간에 반도체 소자의 이온 수송과 전기 화학 시뮬레이션에 대해 논의합니다.

9 years ago

In connection with the reduction in the size of electronic elements and the increase in operating frequencies, it becomes necessary to transmit signals between the nodes of the circuit using

9 years ago

SmartSpice API, shared mode, was developed in order to provide an easy to use solution for products requiring the analog SPICE core engine as an integral part of their functionality.

9 years ago

Amorphous In-Ga-Zn-O (a-IGZO), which is a typical amorphous oxide conductor (AOS), is considered to be one of the most promising channel materials of thin-film transistors (TFTs) for new flat-panel displays

9 years ago

Victory Process now includes the Victory Stress library directly within the process simulator, which removes the necessity to keep switching from process to stress simulators when invoking stress simulations at

9 years ago

Gallium nitride (GaN)-based devices have entered the power electronics market and are showing excellent progress in the medium power conversion application [1]-[5]. For high-power conversion application, devices with vertical geometry

9 years ago

새로운 MIPI Alliance I3CSM 표준에 대해 소개 오늘날 모바일 기기는 최저 전력으로 더 빨리 정보를 전달하기 위해 다양한 종류의 센서를 포함합니다. 이를 위해 MIPI Alliance는 업계의 선도 업체와 함께 주변

9 years ago

In a previous article in Simulation Standard article entitled “Soft Error Simulations”, we discussed various ways to simulate soft errors using either TCAD, SPICE or a mixture of both. In