Monthly Archives: October 2020

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October 2020

Know how your circuit behaves across process variation before silicon tells you, with Monte Carlo-accurate results up to 30X faster.

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6 years ago

Customer Interview: Why I Rely on SmartSpice

Martin Mallinson is an experienced analog circuit designer with multiple patents. Over his 40-year career, his audio designs have been used in millions of smartphones. Martin spoke with Graham Bell

6 years ago

Silvaco’s Babak Taheri Speaking @ MEMS World Summit Shanghai, Nov. 17

MEMS World Summit is the world’s foremost annual meeting and business platform for engaging with political, business, financial, research and industry leaders of the MEMS manufacturing industry. At the Shanghai

6 years ago

Simulate 40X Faster with SmartSpice HPP

In this webinar, we describe how SmartSpice HPP takes advantage of the modern multicore hardware platforms to speed up all internal aspects of transient simulations of analog circuits by adopting

6 years ago

Optimizing a 2um, 1,500 Volt SiC Superjunction Trench-MOS Device Using TCAD

In this paper the critical design features of a SiC superjunction trench MOS device were optimized using CAD to obtain a high breakdown voltage while minimizing any unnecessary increase in

6 years ago

TCAD Simulation of CBRAM Devices

Conductive Bridge Random Access Memory (CBRAM) is a non-volatile memory device technology that can operate by consuming very low power. Another advantage of the CBRAM devices is its ability to

6 years ago

TCAD Mixed-Mode Simulation for GaN Power HEMTs in Unclamped Inductive Switching

The qualification of GaN power high-electron-mobilitytransistors (HEMTs) must consider the device ruggedness against out-of-SOA (safe operating area) events [1- 3].

6 years ago

Using Victory Process Open Model Interface to Customize Etch Emulation Model – Example

Dry etching is commonly used in semiconductor processing to generate deep trenches with good anisotropy. Dry etching is applied to many semiconductor technologies including Advanced FinFETs, 3D NAND, and vertical