Every software package contains a full set of examples suitable for that version and are installed with the software. If you see examples here that are not in your installation you should consider updating to a later version of the software. These examples can be used by beginners and advanced users for product evaluation, teaching purposes, and self-training.

Required Modules

Victory Process

• 3D Diffusion & Implantation
• 3D Stress

Victory Mesh

• 3D Meshing

Victory Device

• 3D Simulator

This example is for a 14nm FinFET simulation and includes complete simulation flow from process to device modeling. In the process part, various process modules are integrated into a single flow. In the device part, transfer characterization and parameters extraction are included.
Structure Creation:
Process simulation flow of a 14nm FinFET structure, various process modules are integrated into this flow.
Process parameter extraction
Mirroring structure at the end of Process simulation
Remeshing in Victory Mesh
Electrical Simulation:
Transfer characterization:
-IdVglin and IdVgsat Simulation
Parameter extraction: Vtgm/Vtlin/Idlin/Vtsat/Idsat/Idoff/SSsat/DIBL Extraction
Reference paper:
Natarajan S, Agostinelli M, Akbar S, et al. “A 14nm logic technology featuring 2nd-generation finfet, air-gapped interconnects, self-aligned double patterning and a 0.0588 µm 2 sram cell size. ” 2014 IEEE international electron devices meeting.

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