Casey Molver

Know how your circuit behaves across process variation before silicon tells you, with Monte Carlo-accurate results up to 30X faster. 

29 years ago

This article describes a method of reporting DRC errors implemented in Savage, applicable to multi-million transistor layouts. The method of hierarchical information inheritance is a perspective approach in an extension

29 years ago

One of the most challenging and time consuming tasks in VLSI design automation is Layout Versus Schematic (LVS). The problem is to test the consistency between the actual circuit, represented

29 years ago

Q: Is it possible to perform a DRC check on portions rather than on the whole circuit useful when only 2 or 3 errors to fix ?

29 years ago

Recent additions to the ATLAS device simulation framework have added the ability to simulate 3D electrothermal effects in Giga3D and mixed circuit simulation with 3D device simulation in MixedMode3D. The

29 years ago

With mounting concern for energy conservation and nature preservation, power electronics is becoming increasingly dominant in everyday life.

29 years ago

It is usually assumed that the poly gate in a MOSFET is doped at a concentration such that depletion in the gate either does not occur or that any depletion

29 years ago

Mesh control in process simulators is one of the major issues tackled by any user. Over the years the meshing algorithms with SSuprem4 and ATHENA have been improved to the

29 years ago

Q: How can external tools be run inside of Silvaco's run-time environment DeckBuild? Is it possible to include UNIX commands along with simulator syntax inside an input file?

29 years ago

The SmartSpice interface to the Cadence Design Framework II has been substantially improved in its latest release (version 1.0.8.R), following feedback from a number of existing users.

29 years ago

Taveren Technology, Inc., a startup company based in Austin, Texas is busy developing the next generation performance characterization tool suite.

29 years ago

SmartSpice provides many unique and powerful features to facilitate parametric analysis in general and cell characterization in particular.

29 years ago

The BSIM3v3.1 SPICE model has become an industry standard for modeling deep-submicron MOS technologies. The model is suitable for both digital and analog applications because of the better modeling of