Testimonials

Know how your circuit behaves across process variation before silicon tells you, with Monte Carlo-accurate results up to 30X faster. 

10 years ago

Power integrity issues must be addressed as early in the design cycle as possible to avoid expensive design iterations. Layout engineers can use Silvaco’s InVar Prime to estimate EM, IR

10 years ago

Compared with regular MOSFET devices, the body bias effect in HVMOS is usually more pronounced. In addition to the regular threshold voltage increase with body bias, the LDD region of

10 years ago

3D TFT analysis has been getting lots of attention due to issues caused by 3D effects such as the edge effect on the TFT characteristics. The presence of an enhanced

10 years ago

Dual-Gate Thin Film Transistors (DGTFTs) are often used in pixel driver and peripheral circuits for liquid crystal displays. This is because of the reduction of the gate-off state leakage current

10 years ago

The planar bulk Si metal-oxide semiconductor field-effect transistor (MOSFET) has reached its scaling limit due to various short channel effects (SCE). With 20 nm advanced planar technology, the source and

10 years ago

Parasitic extraction is a mandatory step for physical design sign off, and at advanced nodes, parasitics substantially impact the behavior of circuit design. Any analysis must consider the interconnect parasitic

10 years ago

This webinar will provide specific approaches for simulating electronic device behavioral changes, including oxide charging and physical damage, during their exposure to four of the most common radiation environments that

10 years ago

This webinar will introduce Radiant developed as an integrated simulation environment of LED and OLED devices and will focus on an OLED, which is getting much attention in the field

10 years ago

Semiconductor devices such as bipolar power transistors and solar cells may operate over a range of optical or electrical injection levels. In some cases of high injection, this may result

10 years ago

During the last several years, the enhancement of integrated circuits (ICs) performance and power consumption have contributed to the continual scaling down the size of transistors. However, scaling down semiconductor

10 years ago

Q: How do I extract geometric information, such as material thickness or junction depth, from the current 3D process simulation using Victory Process?

10 years ago

Two-dimensional process simulators based on SUPREM-IV from Stanford University have been used in semiconductor research and industry for almost 30 years. Tremendous progress in the semiconductor technology requires transition to