Requires: CLEVER

CLEVER is used in this example to simulate a more complex interconnect metal path. Such a complex shape adds additional problems to the extraction of the parasitics, especially the resistance along the metal lines.

The metal regions defined in this example have a number of electrodes, specified within their boundaries. As such it is clear that when the simulator extracts the resistance between electrodes certain regions along the metal path could be taken into account more than once.

To overcome this problem Clever will automatically subdivide the metal line into individual electrodes so that no region is included more than once in the parasitic resistances. These additional nodes are then back annotated onto the layout which is then re-saved at the end of the simulation.

To load and run this example, select the Load button in DeckBuild > Examples. This will copy the input file and any support files to your current working directory. Select the Run button in DeckBuild to execute the example.

Output Results

These examples are for reference only. Every software package contains a full set of examples suitable for that version and are installed with the software. If you see examples here that are not in your installation
you should consider updating to a later version of the software.

Input Files

Input Deck

go VictoryProcess

## Process Description ##

Init Layout=clex05.lay Material=Silicon Depth=1

Deposit Material=Oxide Thickness=0.5 Max

Deposit Material=Aluminum Thickness=0.58 Max

Etch Material=Aluminum Mask=M1

Electrodes Mask=M1 Material=Aluminum

Deposit Material=Oxide Thickness=0.5 Max

Save Name=clex05_0

## Parasitic Extraction ##

go Clever

Init Structure="clex05_0.str"

Electrodes Substrate

Material Aluminum Conductivity=1e6

Interconnect Adapt=(0.04, 0.04)

Save Spice="clex05.net" Layout="clex05_1.lay"

quit