Requires: Utmost IV, SmartSpice, SmartView
Minimum Versions: Utmost IV 1.10.6.R, SmartSpice 4.10.2.R, SmartView 2.28.2.R
This example shows how to optimize extracted data in order to extract a
mosfet SPICE model. Rather than optimizing the measured data directly, an
extraction is performed on each of a number of datasets and the results
from this extraction is then used to perform the optimization.
The project file
opt_ex03.prj
and the data file
opt_ex03.uds
for this example should both be loaded into your database. When opened, the
project will look as shown in
opt_ex03_01.png
.
First, the extraction must be defined in the extractions dialog shown in
opt_ex03_02.png
. Then this extraction must be referenced in the optimization setup shown in
opt_ex03_03.png
. The special ‘extr’ syntax lets Utmost IV know that an extraction is to
be performed on the datasets which are specified by the data subset. The
special ‘attr’ syntax lets Utmost IV know that the extracted threshold
voltage is to be plotted against the length of the transistor. Before
optimization the plot of threshold voltage versus transistor width is as
shown in
opt_ex03_04.png
.
When the optmization sequence is run, it is the extracted threshold values
which will be used, rather than the measured currents or voltages and the
results of the optimization are displayed in the viewer as shown in
opt_ex03_05.png
and are also written to the project as shown in
opt_ex03_06.png
.
Graphics
Files
opt_ex03.uds
Utmost IV CSV Data Logfile
Format Version 1
Copyright (c) 1984-2016 Silvaco, Inc. All rights reserved
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x0p2
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 2e-07
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
6.579e-08 5.5956e-07 4.05282e-06 2.21062e-05 7.12745e-05
0.000142457 0.000219111 0.000295254 0.00036978 0.000442656
0.000513974 0.000583797 0.000652163 0.000719103 0.000784645
0.000848817 0.000911648 0.000973168 0.00103341 0.00109239
0.00115016 0.00120673 0.00126214 0.00131641 0.00136956
0.00142164 0.00147266 0.00152265 0.00157162 0.00161962
0.00166665 0.00171274 0.00175792 0.0018022 0.0018456
0.00188815 0.00192987 0.00197076 0.00201086 0.00205018
0.00208874 0.00212654 0.00216362 0.00219999 0.00223566
0.00227064 0.00230496 0.00233862 0.00237164 0.00240404
0.00243582
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x0p3
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 3e-07
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
7.28462e-09 7.14297e-08 6.1896e-07 4.44087e-06 2.18595e-05
5.95822e-05 0.000106638 0.000155006 0.000202597 0.000249101
0.000294534 0.000338934 0.000382329 0.000424741 0.000466191
0.0005067 0.000546291 0.000584985 0.000622805 0.000659774
0.000695913 0.000731245 0.00076579 0.000799569 0.000832603
0.000864911 0.000896511 0.000927423 0.000957663 0.00098725
0.0010162 0.00104453 0.00107225 0.00109939 0.00112595
0.00115195 0.0011774 0.00120232 0.00122672 0.00125061
0.00127401 0.00129692 0.00131936 0.00134135 0.00136288
0.00138397 0.00140463 0.00142488 0.00144471 0.00146414
0.00148319
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x0p4
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 4e-07
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
1.41701e-09 1.51223e-08 1.4722e-07 1.21519e-06 7.73149e-06
2.85842e-05 6.07036e-05 9.57e-05 0.000130551 0.000164665
0.000197983 0.000230524 0.000262307 0.000293348 0.000323664
0.00035327 0.000382182 0.000410419 0.000437997 0.000464935
0.000491249 0.000516956 0.000542073 0.000566616 0.0005906
0.000614041 0.000636953 0.000659351 0.000681249 0.000702659
0.000723596 0.00074407 0.000764095 0.000783682 0.000802843
0.000821588 0.000839928 0.000857874 0.000875435 0.000892621
0.000909441 0.000925905 0.000942021 0.000957798 0.000973244
0.000988367 0.00100318 0.00101768 0.00103187 0.00104578
0.0010594
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x0p5
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 5e-07
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
4.42307e-10 4.96559e-09 5.19488e-08 4.68374e-07 3.39868e-06
1.56594e-05 3.88916e-05 6.60058e-05 9.34278e-05 0.000120345
0.000146642 0.00017232 0.000197392 0.000221871 0.000245769
0.000269099 0.000291873 0.000314106 0.000335811 0.000357004
0.000377698 0.000397907 0.000417645 0.000436923 0.000455756
0.000474156 0.000492134 0.000509702 0.000526871 0.000543653
0.000560057 0.000576094 0.000591773 0.000607105 0.000622098
0.000636761 0.000651103 0.000665132 0.000678856 0.000692283
0.00070542 0.000718275 0.000730855 0.000743167 0.000755217
0.000767012 0.000778558 0.00078986 0.000800926 0.00081176
0.000822368
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x0p6
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 6e-07
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
1.93162e-10 2.2388e-09 2.44938e-08 2.34203e-07 1.82941e-06
9.70117e-06 2.73224e-05 4.929e-05 7.18558e-05 9.40744e-05
0.00011579 0.000136994 0.000157695 0.000177902 0.000197625
0.000216874 0.00023566 0.000253995 0.000271891 0.000289359
0.000306412 0.000323062 0.000339318 0.000355193 0.000370698
0.000385842 0.000400635 0.000415088 0.00042921 0.000443009
0.000456496 0.000469677 0.000482563 0.000495159 0.000507475
0.000519518 0.000531294 0.000542811 0.000554076 0.000565094
0.000575873 0.000586419 0.000596736 0.000606832 0.000616712
0.00062638 0.000635843 0.000645105 0.000654171 0.000663047
0.000671735
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x0p7
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 7e-07
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
1.06232e-10 1.25725e-09 1.41553e-08 1.40772e-07 1.15112e-06
6.6655e-06 2.06174e-05 3.90095e-05 5.81637e-05 7.7076e-05
9.55689e-05 0.000113626 0.000131253 0.000148457 0.000165246
0.000181629 0.000197615 0.000213215 0.000228439 0.000243296
0.000257798 0.000271953 0.000285773 0.000299266 0.000312441
0.000325308 0.000337876 0.000350152 0.000362144 0.000373862
0.000385311 0.000396501 0.000407437 0.000418126 0.000428576
0.000438792 0.000448781 0.000458549 0.000468102 0.000477445
0.000486583 0.000495522 0.000504267 0.000512823 0.000521194
0.000529386 0.000537402 0.000545248 0.000552926 0.000560442
0.000567799
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x0p8
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 8e-07
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
6.83998e-11 8.21015e-10 9.42072e-09 9.62027e-08 8.10806e-07
4.96569e-06 1.64312e-05 3.2225e-05 4.88582e-05 6.53193e-05
8.14219e-05 9.71451e-05 0.000112493 0.00012747 0.000142085
0.000156345 0.000170258 0.000183832 0.000197078 0.000210003
0.000222617 0.000234928 0.000246945 0.000258677 0.000270132
0.000281317 0.00029224 0.000302908 0.000313329 0.00032351
0.000333457 0.000343177 0.000352675 0.000361959 0.000371033
0.000379904 0.000388576 0.000397056 0.000405347 0.000413456
0.000421387 0.000429143 0.000436731 0.000444154 0.000451416
0.000458522 0.000465475 0.000472279 0.000478938 0.000485455
0.000491834
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x0p9
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 9e-07
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
4.90939e-11 5.95055e-10 6.91637e-09 7.19193e-08 6.18757e-07
3.93135e-06 1.36469e-05 2.74827e-05 4.21806e-05 5.67529e-05
7.10123e-05 8.49358e-05 9.85258e-05 0.000111787 0.000124727
0.00013735 0.000149665 0.00016168 0.000173401 0.000184839
0.000195999 0.000206891 0.000217522 0.000227899 0.00023803
0.000247921 0.00025758 0.000267013 0.000276226 0.000285226
0.000294019 0.000302609 0.000311004 0.000319208 0.000327226
0.000335064 0.000342726 0.000350217 0.000357541 0.000364703
0.000371708 0.000378558 0.000385259 0.000391813 0.000398225
0.000404499 0.000410637 0.000416643 0.000422521 0.000428273
0.000433903
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x1
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 1e-06
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
3.80123e-11 4.6391e-10 5.44037e-09 5.72854e-08 4.99958e-07
3.25601e-06 1.16931e-05 2.40073e-05 3.71745e-05 5.02471e-05
6.30419e-05 7.55355e-05 8.77291e-05 9.96274e-05 0.000111235
0.000122559 0.000133606 0.000144381 0.000154894 0.00016515
0.000175157 0.000184923 0.000194454 0.000203756 0.000212837
0.000221703 0.000230359 0.000238813 0.000247069 0.000255133
0.000263011 0.000270708 0.000278228 0.000285577 0.000292759
0.000299779 0.000306641 0.000313349 0.000319908 0.000326321
0.000332593 0.000338726 0.000344725 0.000350592 0.000356332
0.000361947 0.000367441 0.000372817 0.000378077 0.000383224
0.000388262
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x10
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 1e-05
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
2.77411e-12 3.44715e-11 4.12678e-10 4.45637e-09 4.00312e-08
2.73955e-07 1.05208e-06 2.24001e-06 3.52398e-06 4.80124e-06
6.05133e-06 7.27133e-06 8.46122e-06 9.62141e-06 1.07524e-05
1.18549e-05 1.29294e-05 1.39768e-05 1.49979e-05 1.59933e-05
1.69638e-05 1.79101e-05 1.8833e-05 1.97331e-05 2.06112e-05
2.14679e-05 2.23038e-05 2.31195e-05 2.39157e-05 2.46928e-05
2.54514e-05 2.61922e-05 2.69155e-05 2.76219e-05 2.83118e-05
2.89858e-05 2.96441e-05 3.02874e-05 3.0916e-05 3.15302e-05
3.21306e-05 3.27173e-05 3.32909e-05 3.38517e-05 3.43999e-05
3.49359e-05 3.54601e-05 3.59727e-05 3.64741e-05 3.69645e-05
3.74441e-05
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x2
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 2e-06
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
1.32522e-11 1.64608e-10 1.97276e-09 2.13903e-08 1.93056e-07
1.32934e-06 5.17416e-06 1.11327e-05 1.76061e-05 2.40539e-05
3.03676e-05 3.65316e-05 4.25457e-05 4.84119e-05 5.41327e-05
5.97112e-05 6.51507e-05 7.04547e-05 7.5627e-05 8.06712e-05
8.5591e-05 9.039e-05 9.50717e-05 9.96396e-05 0.000104097
0.000108447 0.000112693 0.000116838 0.000120884 0.000124835
0.000128694 0.000132462 0.000136143 0.000139738 0.000143251
0.000146684 0.000150038 0.000153316 0.00015652 0.000159652
0.000162714 0.000165707 0.000168634 0.000171496 0.000174295
0.000177032 0.000179709 0.000182328 0.000184891 0.000187397
0.000189849
DataSetFinish
DataSetStart
DataSetName, idvglin
MeasurementType, DC
BatchName, opt_ex03
WaferName, wafer1
DieName, x0y0
DeviceName, n10x5
Temperature, 27
FabDate, 18 Jan 2013
UserDate, 18 Jan 2013
WaferDiameter, 0.2
DieLayout, FOUR_CROSSING
DieSize, 0.02, 0.02
Attribute, L, 5e-06
Attribute, W, 1e-05
NodeNames, d g s b
Sweep, 1, V, G, LIN, 0, 5, 0.1, CALCULATED, 0.1, 0
Constant, V, D, 0.1, 0.1, 0
Constant, V, S, 0, 0.1, 0
Constant, V, B, 0, 0.1, 0
Target, I, D
Function, gm, derivative (vg, id)
Plot, idvg, XYY (LIN LIN LIN), VG, ID, gm
DataArray, ID
5.44466e-12 6.76715e-11 8.10708e-10 8.7691e-09 7.89192e-08
5.41512e-07 2.09024e-06 4.46681e-06 7.0398e-06 9.60036e-06
1.21068e-05 1.45532e-05 1.69394e-05 1.92662e-05 2.15347e-05
2.37462e-05 2.5902e-05 2.80035e-05 3.00522e-05 3.20496e-05
3.39973e-05 3.58967e-05 3.77491e-05 3.95561e-05 4.13189e-05
4.30389e-05 4.47173e-05 4.63553e-05 4.79541e-05 4.95149e-05
5.10386e-05 5.25265e-05 5.39795e-05 5.53986e-05 5.67848e-05
5.81389e-05 5.94618e-05 6.07545e-05 6.20177e-05 6.32522e-05
6.44588e-05 6.56382e-05 6.67912e-05 6.79185e-05 6.90207e-05
7.00984e-05 7.11524e-05 7.21832e-05 7.31914e-05 7.41775e-05
7.51422e-05
DataSetFinish