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VRCx_ex20.in : Simulating Micro-Loading Effects using Advanced Etching

VRCx_ex20.in : Simulating Micro-Loading Effects using Advanced Etching

VRCx_ex20.in : Simulating Micro-Loading Effects using Advanced Etching

Every software package contains a full set of examples suitable for that version and are installed with the software. If you see examples here that are not in your installation you should consider updating to a later version of the software. These examples can be used by beginners and advanced users for product evaluation, teaching purposes, and self-training.

Required Modules

Victory Process

  • 3D Physical Etch & Deposit

Victory Mesh

  • 2D Meshing
  • 3D Meshing

Victory RCx

Micro-loading etching effects describe the phenomenon whereby the effective material etch rate depends on the hole size of the pattern masking layer.

This can be simulated using the advanced etching module in Victory Process. Once the structure is created, it is loaded into VictoryRCx to simulate back end parasitics.

The etch machine characteristics are described by the Fux, Topography and EtchDepoProperties statements. Once the etch machine has been described, the wafer is loaded into this virtual etch machine and is etched for 4 minutes. The created trench structures are then filled with aluminium.

For ease of observation of the micro-loading effects, a 2D cut line of the 3D structure is created and plotted, where it can be clearly seen that the depth of each trench is dependent on the width of the trench.

Images

VRCx_ex20_01.png
VRCx_ex20_02.png

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