Every software package contains a full set of examples suitable for that version and are installed with the software. If you see examples here that are not in your installation you should consider updating to a later version of the software. These examples can be used by beginners and advanced users for product evaluation, teaching purposes, and self-training.
Required Modules
Victory Process
- Core Simulator
Victory Mesh
- 3D Meshing
Victory RCx
This example demonstrates the use of VictoryRCx to analyse non-planarized structures such as local interconnects commonly used in current sources and in memory cells. To emphasise the true 3D capability VictoryRCx, a MOSFET with TiN (titanium nitride) local interconnect between drain and gate is implemented using a trench isolation structure together with realistic layer depositions.
The 3D structure is created using the 3D process simulator, and is then loaded into VictoryRCx for the resistance extraction.
At the end of the 3D process simulation, a 2D cutline of the structure is plotted to show a representative cross sectional view of the created device. This 2D cross section may be plotted without running the simulation from the stored structure file called “VRCx_ex13_2D.str “. The 3 dimensional structure file can also be plotted. It should be noted that when using the padding command to create a wider boarder around the masks in conjunction with the cut line statement, a warning in the runtime output will occur informing the user that the cutline defined is larger than the mask area. This is to be expected since the padding command generates a larger simulation volume. This warning can therefore be ignored.
The resistance of the local interconnect is extracted using the Interconnect Resistance Adapt statement in the usual way after defining the conductivity of the TiN material. The value of the extracted resistance is stored in VRCx_ex14.net.
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