Entries by Erick Castellon
What’s in the New MIPI Alliance I3C V1.1 Standard?
February 27th 2020 | 10:00 am – 11:00 am (PST)
I3C has the advantages in reducing pin count, increasing performance, and decreasing power while achieving some level of backwards compatibility with the long established I2C interface. The new I3C V1.1 announced in January 2020, enables faster interface speeds up to 100 Mhz and has many other new features that will aid the transition from I2C to I3C in applications.
Atomistic Analysis and Next Generation Computing at IEDM 2019
IEDM is THE device conference with more than a thousand participants from major companies and R&D institutes. Many talks were dedicated to new memory devices and circuits, including Ferroelectrics, MRAM, RRAM, driven by the requirements of AI processing. EUV is definitely there for 3nm and beyond. 3D integration was shown for LP-HP logic and RF. Gate-All-Around devices, with nanowires or nanosheets are mature versus FinFET.
TCAD Recommended Textbooks
CMOS: Mixed-Signal Circuit Design, Second Edition R. Jacob Baker. Published Wiley-IEEE Press, 2nd Edition. Published 2009, pp. 330 ISBN 978-0-470-29026-2 Understanding Modern Transistors and Diodes David L. Pulfrey, Cambridge University Press, New York, 2010, pp. 336 ISBN 978-0-521-51460-6 Understanding Signal Integrity Stephen C. Thierauf, Published Artech House, December 2010, pp. 250 ISBN-13: 978-1-59693-981-3