IIC 2022 brings together annual innovative product demonstrations, technical exchanges, high-end forums, and industry summits, focusing on cutting-edge technologies in international “carbon neutral” industry development, China’s IC design achievements, commending global industry advancements, and promoting domestic and overseas industry-university-research exchanges in various fields. At the same time, the exhibition will set up high-end exhibition areas such as “SoC design, IC design achievements, high-efficiency power management and wide-bandgap semiconductor technology, excellent distribution and supply chain, etc.” Emerging technologies and products will surely become an industry event for industry insiders to exchange technologies and find business opportunities for cooperation.

This summit provides the opportunity to gain insights into the newest MEMS & Imaging technologies and how they can impact future product developments and applications.

Thanks to rapid advances in the development, manufacturing and integration of MEMS and image sensors, many promising new applications are on the horizon. With a focus on critical application, innovative companies talk about new opportunities and their vision of how miniaturized sensors can change the future.

The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the field of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano-electronic structures.

The International Conference on Silicon Carbide and Related Materials (ICSCRM) is the most important technical conference series on silicon carbide (SiC) and related materials. Started in Washington, D.C. in 1987, the conference series developed into a bi-annual global forum on SiC from its crystal growth to the reliability in application. After five conferences in the U.S., ICSCRM has been held every two years alternating between USA, Europe, and Japan. The last three Conferences were held in Giardini Naxos, Italy (2015), Washington, D.C. , USA (2017) and Kyoto, Japan (2019).

The aim of ESSDERC and ESSCIRC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.