• Simulation Standard Technical Journal

Simulation Standard

Technical Journal

A Journal for Process and Device Engineers

Numerical Algorithm to Perform Viscoelastic Analysis

Numerical Algorithm to Perform Viscoelastic Analysis Viscous materials exhibit both viscous and elastic characteristics when undergoing deformation. The response of such materials to force is characterized by two distinct phases. The materials first deform instantaneously akin to elastic materials. Following on, the material continues to deform at a relatively slower time scale. Typically, materials undergoing thermal treatment exhibit viscoelastic properties.
SS Aug 2023

2023 TCAD Baseline Release

New Features in the 2023 Baseline Release:
  • Section 1: Process Simulation – New Features in 2023 Baseline Release
  • Section 2: Device Simulation – New Features in 2023 Baseline Release
  • Section 3: Victory Mesh – New Features in 2023 Baseline Release
  • Section 4: New Examples in 2023 Baseline Release

Simulation Framework for Device-packaging Co-design for Power Electronics

The past several years has seen a fast deployment of wide-bandgap power devices in fast chargers, electric vehicles, data centers and renewable energy processing. The performance of power devices is fast progressing towards their intrinsic material limit. As these devices can handle higher voltage and larger current density, packaging and thermal management will become the key limiting factor for exploiting their benefits in power electronic converters and systems.

Understanding of Geometrical Boundary Conditions in Victory Process

It is common to run the process simulation for the part of a larger structure just to reduce the computation time. To account for the influence of parts of the structure outside the simulation domain, Victory Process makes assumptions about overall structure geometry.

Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD Simulations

The utilization of thin material layers is common in modern semiconductor device fabrication. Subsequent etching steps require an accurate modeling of these thin layers. Although level-set based process TCAD simulations are capable of representing flat thin material layers with sub-grid accuracy, topographical changes during etching processes expose the low underlying grid resolution, which leads to detrimental artifacts.

How to Search, View and Use Default Parameters from the Silvaco Material DataBase SMDB with DeckBuild

Silver, DeckBuild’s material database viewer, can be used to examine the default parameters in the Silvaco Material DataBase (SMDB) and to generate MATERIAL commands for Victory Process and Victory Device. Silver can be started by clicking the launch button in DeckBuild.