Utilizing Silvaco TCAD for 3D Silicon Simulation
May 15, 2025 – Registration Now Open
Using Viso to Investigate, Analyze, and Solve Complex Parasitic Issues
April 24, 2025 – Registration Now Open
Understanding the Modeling Framework for CMOS Technology within Victory Process
Archive Now Available
Learn How to Utilize Victory Analytics and Machine Learning to Calibrate TCAD Data
Archive Now Available
Learn How to Simulate 2D-TMD-Channel FETs with Atomistic Precision
Archive Now Available
Learn How Micron Utilizes Silvaco’s Fab Technology Co-Optimization for Development and Manufacturing of Memory Technologies
Archive Now Available
Applying Artificial Intelligence in Fab Technology Co-Optimization (FTCOTM)
Archive Now Available
Learn How STMicroelectronics Silicon Carbide (SiC) Research Team uses Silvaco TCAD to Analyze the Impact of Surface Defect Dot on Short Circuit Phenomena in SiC Devices
March 28, 2024
During SiC device switching operations, it is possible that devices could be reaching abnormal overload conditions, which is why some applications require “robustness” specifications (e.g., Short Circuit and UIS tests). In this webinar we will show how the impact of a short circuit of a defect localized in the active area has been investigated by means of TCAD simulations performed with Silvaco software.
GaN-based Power Devices Design and Development with Silvaco TCAD Solution
February 29, 2024
Physical-based simulation tools are essential for the development and insight to this new generation of wide bandgap electronic devices in FBH laboratories. In this webinar, we will give examples for the use of Silvaco TCAD simulation tools used to design, predict and analyze the electrical characterization of vertical and lateral GaN based power devices.
Learn How to Use Victory Process TCAD Geometric Etch Models in FinFET and Memory Applications
May 18, 2023
In this webinar, we present geometric etch models in the context of FinFET and memory applications. We demonstrate techniques to realize fin shaping, non-ideal etch profiles (bowing, twisting), and self-aligned processes (multi-patterning).