엔트리 Gigi Boss

Optoelectronic Component Design for Photonic Integrated Circuits

Photonic integrated circuits (PICs) are a key enabling technology for a broad range of current and next-generation products. Combining semiconductor materials and manufacturing processes common to microelectronics with the encoding, transmission and detection of light, PICs are transforming communication in datacenters by bringing bandwidth closer to compute cores, and are accelerating emerging applications like LiDAR for autonomy and quantum computing for the future of information processing.

STMicroelectronics, SiC 소자의 단락 현상에 대한 표면 결함 점의 영향 분석에 실바코 TCAD 활용

2024년 3월 28일
SiC 소자의 스위칭 동작 중에, 소자가 과부하 비정상 상태에 도달할 수 있으므로, 일부 애플케이션에서는 강력한 사양이 필요합니다 (예: 단락 회로 및 UIS 테스트). 믹스드 모드 회로에서 이러한 현상을 시뮬레이션할 수 있으며, 시뮬레이션과 실험 정보를 교환하여 시뮬레이션 파라미터의 정확한 튜닝을 통해 동적 단계에서 전기 열의 움직임을 예측할 수 있습니다. 단락 회로의 현상에 대한 연구를 예시로 살펴봅니다. 실바코의 TCAD 시뮬레이션으로 활성 영역에 한정된 결함의 단락 회로에 대한 영향을 연구하였습니다.

Advanced TCAD Modeling of HfO2-based ReRAM:Coupling Redox Reactions and Thermal Effects

This paper presents a TCAD modeling approach for HfO2-based ReRAM (Resistive Random Access Memory). For describing the switching and retention behaviors of a ReRAM cell, the proposed model includes the essential redox reactions coupled to an electron transport model and to heat generation. The effects of various parameters such as sweep time, and device geometry on the switching behavior are investigated. Simulation results demonstrate that thermal management is crucial both for the reliable operation of ReRAM cells and retention. The proposed TCAD model provides insight into the design and optimization of HfO2-based ReRAM devices.

Numerical Algorithm to Perform Viscoelastic Analysis

Numerical Algorithm to Perform Viscoelastic Analysis

Viscous materials exhibit both viscous and elastic characteristics when undergoing deformation. The response of such materials to force is characterized by two distinct phases. The materials first deform instantaneously akin to elastic materials. Following on, the material continues to deform at a relatively slower time scale. Typically, materials undergoing thermal treatment exhibit viscoelastic properties.

2023 TCAD Baseline Release

New Features in the 2023 Baseline Release:

  • Section 1: Process Simulation – New Features in 2023 Baseline Release
  • Section 2: Device Simulation – New Features in 2023 Baseline Release
  • Section 3: Victory Mesh – New Features in 2023 Baseline Release
  • Section 4: New Examples in 2023 Baseline Release