The degradation of MOSFET devices having relatively thin oxide layers is generally accepted as being mainly associated with the depassivation of silicon dangling bonds at the Si/SiO2 interface. These dangling bonds are initially passivated during the fabrication process by heating in hydrogen or, more rarely, a deuterium environment. The interface trap density is typically reduced by two orders of magnitude by this passivation process, to around 1010cm-2 or even less[1].

VICTORY Process is a 3D process simulation tool which employs the LevelSet technique for manipulating and deforming structures. The structure’s geometry is stored implicitly on the hierarchy of regular (constant mesh size along each direction) Cartesian meshes.

The Insulated Gate Bipolar Transistor (IGBT), is a power device that combines the high-power characteristics of bipolar transistors with the fast-switching and voltage-drive characteristics of MOSFETs. It is used in a wide variety of applications, ranging from electric vehicles, industrial applications such as general-purpose inverters and switching power supplies, to consumer applications such as air conditioners and washing machines, making it a key device of the modern power electronics. From the viewpoints of lowering the loss and enhancing the efficiency of the application devices to which it is incorporated, the structure of the IGBT is being continuously improved. To illustrate the effectiveness of TCAD simulations in designing a power device structure, high-voltage structures of planar type and trench type, which are typical IGBT cell structure types, were designed using ATLAS 2D device simulator and then compared to each other.

The problem of discretising the semiconductor drift-diffusion equations in the presence of a uniform magnetic field using the Box Method has previously been addressed in the literature. For the case of a rectangular non-uniform grid in 2D see[1], and for a general triangular mesh see[2]. These methods have also been extended to 3D [3],[4]. We have implemented and analysed these methods and found them all to be flawed in some way. In this paper we describe the established discretisations and elaborate on their flaws. We then briefly describe the new discretisation developed by Silvaco, and give some examples of its use.

Solar cells manufactured from wafers of crystalline or polycrystalline silicon are today the dominant technology in the commercial market. Solar cells based on thin film semiconductor are another technology with great potential. One such technology is based on a compound of the elements copper, indium, gallium and selenium abbreviated Cu(in,Ga)Se2 or CIGS. Two advantages of this technology are the low material consumption and the high efficiency that has been demonstrated, which both make it economically competitive. The objective of this article is to simulate a CIGS Solar cell module taking into account electrical, optical and geometrical parameters in order to optimize his design.