Learn About the Latest Advances in Device Modeling Using Silvaco Utmost IV
2023年1月27日
本ウェビナーでは、シルバコのUtmost IVデバイス・モデリング・ツールの2022年ベースラインの機能強化の一部をご紹介します。
エントリー - Gigi Boss
3D TCAD Simulation of Gallium Nitride Tri-gate Junction HEMT
The GaN high electron mobility transistor (HEMT) has been commercialized as a power device with performance superior to Si devices in the voltage classes from 15 V to 900 V [1]. Most of commercial enhancement-mode (E-mode) HEMTs comprise a planar p-GaN gate. Recently, 3-D gate stacks, such as FinFET and tri-gate structures, have been introduced to lateral GaN HEMTs. They can realize superior gate controllability and E-mode operation with a higher current on/off ratio and lower gated channel resistance [2].
Writing an Impurity Activation Model with the Open Model Library
Accuracy of Impurity Activation is essential in correctly modeling and simulating Silicon Carbide devices. For high concentrations of dopants, it is well known that less than 100% of dopants will be electrically active. To address this effect, Silvaco Victory Process models dopant activation in Silicon Carbide in 3 ways.
User Probes and Arbitrary Parameter Sweeps in Victory Device
One of the new features in Victory Device is the ability to add user managed parameters to a log file. This can be used when sweeping parameters (manually or in a Deckbuild loop), such as doping, stress, or layer thicknesses, to add the swept parameter to a log file. To do so, simply create a USER probe (with an optional name), and set the parameter USER on the MODELS statement to some value. This parameter (and value) will be added to the log file. The available user parameters are USER1, USER2, USER3, and USER4. The following shows a DeckBuild loop (go victoryd) to simulate the effect of varying STRESS_XX on the mobility.
Learn About Victory Visual, Silvaco’s New Graphical Visualization Solution for TCAD
2022年9月23日 | 2:00-2:30 JST
本ウェビナーでは、シルバコのTCAD可視化ツールの最新世代であるVictory Visualの機能を順を追って説明します。本ウェビナーは、Victory Visualの主要な機能を理解するためのハウツーガイドであると同時に、Victory AtomisticおよびVictory Mesh – Solid Modeling向けの機能についても簡単に紹介することを目的としています。これまでのシルバコTCADツールのユーザおよび新しいユーザの視点から、多くの質問を取り上げます。
Quantum Transport Simulation at Atomistic Accuracy of a Nanowire FET
The FET physical dimensions continue to shrink to five nm node and below, characterized by new types of architectures with nanosheet (NS) and nanowire (NW) shapes [3]. The present choice of material is made of Si, Ge, or SiGe alloy thanks to their high carrier concentrations. In compliment to III-V technology envisaged for a while, new 2D materials are also investigated (for example, the TMDs monolayers1). Such nanomaterials and nano-architectures require atomistic simulations for at least two crucial reasons: 1) bulk parameters like the effective masses and forbidden bandgap are no longer pertinent quantities, and 2) the wave nature of charge carriers becomes predominant for predicting transport characteristics including scattering events.
Learn How Victory Atomistic TCAD Solution Can Help You Succeed at Prototyping Atomistic Nanoscale Devices
2022年9月9日 | 2:00-2:30 JST
超微細電界効果トランジスタ（FET）技術は、5nmノード以下の最先端技術アーキテクチャを設計するために、原子スケールでのシミュレーションを必要としています。Victory Atomisticは、非平衡グリーン関数（NEGF）と最先端のバンド構造計算を組み合わせることで、汎用的で予測性の高い高速シミュレーションを可能にします。
2022 TCAD Baseline Release
New Features in the 2022 Baseline Release:
- Section 1: Process Simulation – New Features in 2022 Baseline Release
- Section 2: Device Simulation – New Features in 2022 Baseline Release
- Section 3: Victory Mesh – New Features in 2022 Baseline Release
- Section 4: Silver – New Features in 2022 Baseline Release
Learn How to Efficiently Achieve Accurate Experimental Etch Profiles in FinFET and Memory Applications with Victory TCAD Solution
2022年8月12日 | 2:00-2:30 JST
本ウェビナーでは、FinFETとメモリデバイスへの適用を例に、これらの幾何学エッチング・モデルを紹介します。フィンの形状制御や、非理想的なエッチング形状（ボーイング、ツイスト）、セルフ・アライン・プロセス（マルチパターニング）を実現する技術を紹介します。