Hints, Tips and Solutions – July, August, September 2019
Q. Is it possible to emulate a deep reactive ion etch process (e.g. deep trench with scalloped sidewalls) without using a physical based process simulation, such as Victory Process?
To study a non-ideal geometry and its impact on device performance, TCAD device engineers may want to generate structures with complex geometries quickly, without the added details of physically-based process simulation.