The shrinking critical dimensions of modern technology place a heavy requirement on optimizing the etching of narrow mask opening. In addition the aspect ratio of etches has been increased requiring deeper etches along with the small CDs. The simulation of these process requires more advanced techniques than the directional rate-based etching found in the current versions of Elite. A more complete treatment involving calculation of the plasma distribution is required.

CLEVER is designed to model interconnect parasitics by simulating the back end processing steps of custom cells in three dimensions. A 3D process simulator is used to realisticly reproduce the effects of photolithography, deposition and etching on the resulting structure topography

Following the log file conversion tool for TonyPlot introduced with UTMOST 12.3.14.R1, new file formats have been added to UTMOST III’s printing and plotting options to make manipulating UTMOST generated data even easier.

Silvaco now offers the EKV (ENZ, KRUMMENACHER, VITTOZ) MOSFET model version 2.6 originally developed in EPFL (“Ecole Polytechnique Federale de Lausanne” – Switzerland), as part of the SmartLib product-independent model library. This model is available within SmartSpice and UTMOST as level 44.

Q: Can I draw tangents to circles in EXPERT?

A: Expert supports several options for drawing sophisticated shapes. There are three ways to accomplish this task.