IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 26 is to be held on April 19-21, 2023 in Tokyo.

With an annual attendance of 500 engineers, scientists, and students, IEEE ISPSD serves as a frontier for reporting the latest breakthrough device technologies before their commercial proliferation into energy-efficient power electronic applications.

The Design Automation Conference (DAC) is recognized as the premier event for the design and design automation of electronic chips to systems.  DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors. The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM’s Special Interest Group on Design Automation (SIGDA) and IEEE’s Council on Electronic Design Automation (CEDA).

IMID 2023 will include prestigious keynote addresses, invited talks, regular sessions (oral & poster presentations), tutorials & workshops, a young leaders conference (YLC), women in display (WID), and Merck Science Connect etc. This year, two special sessions; “AI & Computational Technologies for Display” and “Display with Free Form Factor” will be featured as well as other traditional main topics of display and industrial forum linked with the special exhibition. I sincerely hope that all of the participants take this opportunity to have profound discussions on every field of information display and also make lasting friendships and new future colleagues with all of the outstanding researchers.