International Forum on Wide Bandgap Semiconductors China (IFWS) is a global high level forum sponsored by the China Advanced Semiconductor Industry Innovation Alliance (CASA). The forum aims to promote collaborative innovation of industries including wide bandgap semiconductor materials, equipment, devices and related applications. Connecting research and industry, the forum focuses on the roadmap, application needs, integrated innovation of wide bandgap semiconductor technology and other topics, divided into several sessions for in-depth discussions. In the past two years, IFWS invites the world’s top academic speakers in the field of wide bandgap semiconductors to share the most advanced technological trends. The forum has developed into a comprehensive professional forum with industry influence.
Join us at DesignCon where Silvaco will participate in a panel on Deploying ML in EDA Context: Operation & Organization.
IEEE Electron Devices Technology and Manufacturing (IEEE EDTM) Conference was established by the IEEE Electron Devices Society (EDS) to enable further performance/functionality enhancement of semiconductor devices and systems with manufacturing innovations to overcome scaling challenges. IEEE EDTM provides the forum where device, process, material, and tool communities gather and discuss their novel ideas for technological breakthrough. IEEE EDTM rotates among Asian countries where hot-hubs of semiconductor manufacturing are located. Launched in 2017 in Toyama, Japan, IEEE EDTM was subsequently held in Kobe, Japan (2018), in Singapore (2019), in Penang, Malaysia (2020), in Chengdu, China (2021), in Oita, Japan – Full virtual (2022), and will take place first time in Seoul, Korea this year. IEEE EDTM is a premier conference, providing a unique forum for discussions on a broad range of device/manufacturing-related topics.
Hosted by the Society for Information Display (SID), ICDT is an annual international display technology event that aims to strengthen international exchanges and cooperation in display technology, improve the overall level of China’s display technology and display industry, and achieve leadership in display technology in China.
The conference will cover a range of topics, including new display technology, intelligent manufacturing technology, advanced thin film transistor display technology, printed display technology, VR/AR/MR and metaverse, Mini/Micro-LED and semiconductor information display, flexible electronics, quantum dot and related display technology, vehicle display, and green intelligent manufacturing technology.
The conference will include technical seminars, business conferences, exhibitions, innovation zones, and other events such as a “Display Future Star Cup” Debate Competition and a Display Industry Future Technology Strategy Summit.
CS International 2023 provides timely, comprehensive coverage of every important sector within the compound semiconductor industry.
The CS International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning 5 sectors.
Several great speakers have accepted the invitation to speak at CS International 2023, the must-attend event for the compound semiconductor industry.
IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 26 is to be held on April 19-21, 2023 in Tokyo.
With an annual attendance of 500 engineers, scientists, and students, IEEE ISPSD serves as a frontier for reporting the latest breakthrough device technologies before their commercial proliferation into energy-efficient power electronic applications.