Local Optimization Templates for Extracting
BSIM3v3.1 Parameters in UTMOST III

Introduction

The BSIM3v3.1 SPICE model has become an industry standard for modeling deep-submicron MOS technologies. The model is suitable for both digital and analog applications because of the better modeling of the output conductances and the physics based scaling which is embedded in the model equations. The model offers binning parameters for improving the model fits for certain devices. The BSIM3v3.1 model has been implemented in UTMOST III and SmartSpice since its first introduction.

The UTMOST user group has continuous interest in creating better BSIM3v3.1 models for their customers. This article is written to provide the latest local optimization templates perfected in Silvaco’s model characterization lab.