{"id":35831,"date":"2020-02-26T18:24:52","date_gmt":"2020-02-26T18:24:52","guid":{"rendered":"https:\/\/silvaco.com\/%e6%9c%aa%e5%88%86%e7%b1%bb\/esd-simulation\/"},"modified":"2026-10-02T08:51:27","modified_gmt":"2026-10-02T15:51:27","slug":"esd-simulation","status":"publish","type":"post","link":"https:\/\/silvaco.com\/zh-hans\/tcad-zh-hans\/tcad-published-papers-zh-hans\/esd-simulation\/","title":{"rendered":"ESD Simulation"},"content":{"rendered":"<h1>ESD Simulation<\/h1>\n<p>The full text for most of these papers may be found at the IEEE website at\u00a0<a href=\"http:\/\/www.ieee.org\/\" target=\"_blank\" rel=\"noopener noreferrer\">www.ieee.org<\/a>.<\/p>\n<p>Guido Notermans, Olivier Quittard, Anco Heringa, \u017deljko Mr\u010darica, Fabrice Blanc, Hans van Zwol, Theo Smedes, Thomas Keller, Peter de Jong,<br \/>\n&#8220;ESD robust high-voltage active clamps&#8221;,<br \/>\nMicroelectronics Reliability, Vol. 49, Issue 12, December 2009, pp. 1433-1439.<\/p>\n<p>J.A. Salcedo, J.J Liou, Z. Liu, J.E. Vinson TCAD,<br \/>\n&#8220;Methodology for Design of SCR Devices for Electrostatic Discharge (ESD) Applications&#8221;,<br \/>\nIEEE Transactions on Electron Devices, Vol. 54, issue 4, April 2007, pp. 822-832.<\/p>\n<p>G. Notermans, O. Quittard, A. Heringa, Z. Mrcarica, F. Blanc, H. van Zwol, T. Smedes, T Keller, and P. de Jong,<br \/>\n&#8220;Designing HV active clamps for HBM robustness&#8221;,<br \/>\n29th Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD), Sept. 2007, pp. 1B.1-1 &#8211; 1B.1-6.<\/p>\n<p>Changkun Park, Seok-Oh Yun, Jeonghu Han, Sang-Hoon Cheon, Jae-Woo Park, and Songcheol Hong,<br \/>\n&#8220;ESD characteristics of GaAs versus silicon diode&#8221;,<br \/>\nGallium Arsenide and Other Semiconductor Application Symposium (EGAAS 2005), Oct. 2005, pp. 273 &#8211; 276.<\/p>\n<p>J. A. Salcedo, J. J. Liou, J. C. Bernier,<br \/>\n&#8220;Design and integration of novel SCR-based devices for ESD protection in CMOS\/BiCMOS technologies&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 52, Issue 12, December 2005, pp. 2682-2689.<\/p>\n<p>Z. Zhu, Y. Hao,<br \/>\n&#8220;Characterization simulation of a deep sub-micron GGNMOSFET under TLP stress&#8221;<br \/>\nPan Tao Ti Hsueh Pao\/Chinese Journal of Semiconductors, Vol. 26, Issue 10, October 2005, pp. 196.<\/p>\n<p>J.-Y. Choi,<br \/>\n&#8220;AC modeling of the ggNMOS ESD protection device&#8221;<br \/>\nETRI Journal, Vol. 27, Issue 5, October 2005, pp. 628-634.<\/p>\n<p>J. -Y. Choi, W. S. Yang, D. Kim, Y. Kim,<br \/>\n&#8220;Thyristor input-protection device suitable for CMOS RF IC&#8217;s&#8221;<br \/>\nAnalog Integrated Circuits and Signal Processing, Vol. 43, Issue 1, April 2005, pp. 5-14.<\/p>\n<p>J. J. Liou and X. Gao,<br \/>\n&#8220;Design and modeling of on-chip electrostatic discharge (ESD) protection structures&#8221;<br \/>\nProceedings of the International Conference on Microelectronics, Vol. 24 II, 2004, pp. 619-624.<\/p>\n<p>A. A. Salman, R. Gauthier, C. Putnam, P. Riess, M. Muhammad, M. Woo, D. E. Ioannou,<br \/>\n&#8220;ESD-induced oxide breakdown on self-protecting GG-nMOSFET in 0.1-&#8221;<br \/>\nIEEE Transactions on Device and Materials Reliability, Vol. 3, Issue 3, September 2003, pp. 79.<\/p>\n<p>X. Gao, J. J. Liou, W. Wong, S. Vishwanathan,<br \/>\n&#8220;An improved electrostatic discharge protection structure for reducing triggering voltage and parasitic capacitance&#8221;<br \/>\nSolid-State Electronics, Vol. 47, June 2003, pp. 1105-1110.<\/p>\n<p>X. Gao, J. J. Liou, J. Bernier, G. Croft, W. Wong, S. Vishwanathan,<br \/>\n&#8220;Optimization of on-chip ESD protection structures for minimal parasitic capacitance&#8221;<br \/>\nMicroelectronics Reliability, Vol. 43, May 2003, pp. 725-733.<\/p>\n<p>A. Guilhaume, P. Galy, J. P. Chante, B. Foucher, S. Bardy, F. Blanc,<br \/>\n&#8220;ESD evaluation of a low voltage triggering SCR (LVTSCR) device submitted to transmission line pulse (TLP) test&#8221;<br \/>\nJournal of Electrostatics, Vol. 56, October 2002, pp. 281-294.<\/p>\n<p>A. Salman, R. Gauthier, E. Wu, P. Riess, C. Putnam, M. Muhammad, M. Woo, D. Ioannou,<br \/>\n&#8220;Electrostatic discharge induced oxide breakdown characterization in a 0.1&#8221;<br \/>\nAnnual Proceedings &#8211; Reliability Physics (Symposium), 2002, pp. 170-174.<\/p>\n<p>Gianluca Boselli, Stan Meeuwsen, Ton Mouthaan and Fred Kuper,<br \/>\n&#8220;Investigations on double-diffused MOS transistors under ESD zap conditions&#8221;<br \/>\nMicroelectronics Reliability, Vol. 41, Issue 3, March 2001, pp. 395-405.<\/p>\n<p>A. Guilhaume et al,<br \/>\n&#8220;Simulation and experimental comparison of GGNMOS and LVTSCR protection cells under ElectroStatic Discharges&#8221;<br \/>\nESREF 2001, pp. 1433-1437.<\/p>\n<p>J. C. Lee, A. Hoque, G. D. Croft, J. J. Liou, R. Young and J. C. Bernier,<br \/>\n&#8220;An electrostatic discharge failure mechanism in semiconductor devices, with applications to electrostatic discharge measurements using transmission line pulsing technique&#8221;<br \/>\nSolid-State Electronics, Vol. 44, Issue 10, 1 October 2000, pp. 1771-1781.<\/p>\n<p>Kevin Palser, Ann Concannon, Ray Duffy and Alan Mathewson,<br \/>\n&#8220;Analysis of external latch-up protection test structure design using numerical simulation&#8221;<br \/>\nMicroelectronics and Reliability, Vol. 39, Issue 5, May 1999, pp. 647-659.<\/p>\n<p>Kyuhyung Kwon et al,<br \/>\n&#8220;A Novel ESD Protection Technique for Submicron CMOS\/BiCMOS Technologies&#8221;<br \/>\nProc. EOS\/ESD Symposium, 1995, pp. 21-26.<\/p>\n<p>Freydin, Strachan,<br \/>\n&#8220;Simulation of Electrothermal Interactions in ESD Protection Devices&#8221;<br \/>\nIn-house paper, 1994.<\/p>\n<p>Hellstrom, Freydin, Velmre, Uda,<br \/>\n&#8220;Numerical Simulation of Electrothermal Effects in ESD Protection Devices&#8221;<br \/>\nESREF, 1992.<\/p>\n<p>Freydin, Velmre, Udal,<br \/>\n&#8220;Numerical Simulation of Electrothermal Interactions in Semiconductor Devices Experiencing ESD Pulses&#8221;<br \/>\nPro. Int Workshop on Computational Electronics.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>ESD Simulation The full text for most of these papers may be found at the IEEE website at\u00a0www.ieee.org. Guido Notermans, Olivier Quittard, Anco Heringa, \u017deljko Mr\u010darica, Fabrice Blanc, Hans van Zwol, Theo Smedes, Thomas Keller, Peter de Jong, &#8220;ESD robust high-voltage active clamps&#8221;, Microelectronics Reliability, Vol. 49, Issue 12, December 2009, pp. 1433-1439. J.A. Salcedo, [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"inline_featured_image":false,"footnotes":""},"categories":[7765,7759,7913],"tags":[],"class_list":["post-35831","post","type-post","status-publish","format-standard","hentry","category-esd-simulation-zh-hans","category-tcad-published-papers-zh-hans","category-technical-libraries","entry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v28.7 (Yoast SEO v28.7) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>ESD Simulation - Silvaco<\/title>\n<meta name=\"description\" content=\"Publications on ESD Simulation\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/silvaco.com\/zh-hans\/tcad-zh-hans\/tcad-published-papers-zh-hans\/esd-simulation\/\" \/>\n<meta property=\"og:locale\" content=\"zh_CN\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ESD Simulation\" \/>\n<meta property=\"og:description\" content=\"Publications on ESD Simulation\" \/>\n<meta property=\"og:url\" content=\"https:\/\/silvaco.com\/zh-hans\/tcad-zh-hans\/tcad-published-papers-zh-hans\/esd-simulation\/\" \/>\n<meta property=\"og:site_name\" content=\"Silvaco\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/SilvacoSoftware\/\" \/>\n<meta property=\"article:published_time\" content=\"2020-02-26T18:24:52+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-10-02T15:51:27+00:00\" \/>\n<meta name=\"author\" content=\"Erick Castellon\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@SilvacoSoftware\" \/>\n<meta name=\"twitter:site\" content=\"@SilvacoSoftware\" \/>\n<meta name=\"twitter:label1\" content=\"\u4f5c\u8005\" \/>\n\t<meta name=\"twitter:data1\" content=\"Erick Castellon\" \/>\n\t<meta name=\"twitter:label2\" content=\"\u9884\u8ba1\u9605\u8bfb\u65f6\u95f4\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/silvaco.com\\\/zh-hans\\\/tcad-zh-hans\\\/tcad-published-papers-zh-hans\\\/esd-simulation\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/silvaco.com\\\/zh-hans\\\/tcad-zh-hans\\\/tcad-published-papers-zh-hans\\\/esd-simulation\\\/\"},\"author\":{\"name\":\"Erick Castellon\",\"@id\":\"https:\\\/\\\/silvaco.com\\\/#\\\/schema\\\/person\\\/e1dfed88a8f7a514e8e8414ad093e4f8\"},\"headline\":\"ESD Simulation\",\"datePublished\":\"2020-02-26T18:24:52+00:00\",\"dateModified\":\"2026-10-02T15:51:27+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/silvaco.com\\\/zh-hans\\\/tcad-zh-hans\\\/tcad-published-papers-zh-hans\\\/esd-simulation\\\/\"},\"wordCount\":641,\"articleSection\":[\"ESD Simulation\",\"TCAD Published Papers\",\"Technical Libraries\"],\"inLanguage\":\"zh-CN\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/silvaco.com\\\/zh-hans\\\/tcad-zh-hans\\\/tcad-published-papers-zh-hans\\\/esd-simulation\\\/\",\"url\":\"https:\\\/\\\/silvaco.com\\\/zh-hans\\\/tcad-zh-hans\\\/tcad-published-papers-zh-hans\\\/esd-simulation\\\/\",\"name\":\"ESD Simulation - 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