1.0Silvacohttps://silvaco.com/zh-hans/Jamal Smithhttps://silvaco.com/zh-hans/author/jamal-smith/rich600338<blockquote class="wp-embedded-content" data-secret="RtP59jGSgn"><a href="https://silvaco.com/zh-hans/%e8%b5%84%e6%ba%90%e4%b8%ad%e5%bf%83/%e6%9c%af%e8%af%ad%e8%a1%a8/">术语表</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://silvaco.com/zh-hans/%e8%b5%84%e6%ba%90%e4%b8%ad%e5%bf%83/%e6%9c%af%e8%af%ad%e8%a1%a8/embed/#?secret=RtP59jGSgn" width="600" height="338" title="“术语表” — Silvaco" data-secret="RtP59jGSgn" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script> /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://silvaco.com/wp-includes/js/wp-embed.min.js </script> 首页 > 资源 > 术语表 半导体设计与仿真术语表 简明、准确地定义工艺、器件、电路和 IP 工作中的术语，从 TCAD 和 FastSPICE 到 PDK 和 MIPI PHY，并提供涵盖各术语的 Silvaco 页面。 查看晶圆代工厂和 PDK 支持 申请成为合作伙伴 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z # 先进封装 先进封装将两个或多个裸片集成在单一封装中。裸片可并排放置在中介层上，也可垂直堆叠，通过硅通孔、微凸点或混合键合连接。将设计分散到多个裸片后，连接处就成为您需要解决的问题。每个连接处的热、机械应力和信号完整性如今都是设计决策，而非仅仅是组装问题。 Covered on 先进封装 […]https://silvaco.com/wp-content/uploads/2026/09/Group-1171276898-1.png