{"id":31715,"date":"2020-02-26T02:07:34","date_gmt":"2020-02-26T02:07:34","guid":{"rendered":"https:\/\/silvaco.com\/%eb%b6%84%eb%a5%98%eb%90%98%ec%a7%80-%ec%95%8a%ec%9d%8c\/cmos-technology\/"},"modified":"2020-02-26T02:07:34","modified_gmt":"2020-02-26T02:07:34","slug":"cmos-technology","status":"publish","type":"post","link":"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/cmos-technology\/","title":{"rendered":"CMOS Technology"},"content":{"rendered":"<div id='template_overview'  class='avia-section main_color avia-section-small avia-no-border-styling  avia-bg-style-scroll  avia-builder-el-0  el_before_av_section  avia-builder-el-first   container_wrap fullsize' style='background-color: #ffffff;  margin-top:0px; margin-bottom:0px; '  ><div class='container' ><main  role=\"main\" itemprop=\"mainContentOfPage\"  class='template-page content  av-content-full alpha units'><div class='post-entry post-entry-type-page post-entry-31715'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-equal-height-column-flextable -flextable' style='margin-top:20px; margin-bottom:0px; '><div class=\"flex_column av_three_fourth  flex_column_table_cell av-equal-height-column av-align-top first  avia-builder-el-1  el_before_av_one_fourth  avia-builder-el-first  \" style='padding:0px 0px 0px 0px ; border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock  '   itemprop=\"text\" ><h1>CMOS Technology<\/h1>\n<p>The full text for most of these papers may be found at the IEEE website at\u00a0<a href=\"http:\/\/www.ieee.org\/\" target=\"_blank\" rel=\"noopener noreferrer\">www.ieee.org<\/a>.<\/p>\n<p>T Uchino<sup>1, 2,<\/sup>\u00a0E Gili<sup>1, 3,<\/sup>\u00a0L Tan<sup>4,<\/sup>\u00a0O Buiu<sup>4,<\/sup>\u00a0S Hall<sup>4<\/sup>\u00a0and P Ashburn<sup>1<\/sup>,<br \/>\n&#8220;Improved vertical MOSFET performance using an epitaxial channel and a stacked silicon-insulator structure&#8221;<\/p>\n<ol>\n<li>School of Electronics and Computer Science, University of Southampton, Southampton, SO17 1BJ, UK<\/li>\n<li>Department of Electronics and Intelligent Systems, Tohoku Institute of Technology, Sendai, 982-8577, Japan<\/li>\n<li>Cavendish Laboratory, University of Cambridge, Cambridge CB3 0HE, UK<\/li>\n<li>Department of Electrical Engineering and Electronics, University of Liverpool, Liverpool, L69 3GJ, UK<\/li>\n<\/ol>\n<p>B. Grandchamp, M.-A. Jaud, P. Scheiblin, K. Romanjek, L. Hutin, C. Le Royer, M. Vinet,<br \/>\n&#8220;In-depth physical investigation of GeOI pMOSFET by TCAD calibrated simulation&#8221;,<br \/>\nSolid-State Electronics, Vol. 57, Issue 1, March 2011, pp. 67\u201372.<\/p>\n<p>Chi-Woo Lee, Isabelle Ferain, Aryan Afzalian, Ran Yan, Nima Dehdashti Akhavan, Pedram Razavi, Jean-Pierre Colinge,<br \/>\n&#8220;Performance estimation of junctionless multigate transistors&#8221;,<br \/>\nSolid-State Electronics, Vol. 54, Issue 2, February 2010, pp. 97-103.<\/p>\n<p>V. Vasireddy, S. Parke,<br \/>\n&#8220;Simulation and Experimental Results of a 0.15\u00b5m Independent Double Gated CMOS Transistor&#8221;,<br \/>\n2010 18th Biennial University\/Government\/Industry Micro\/Nano Symposium (UGIM), 2010, pp. 1 &#8211; 3.<\/p>\n<p>F. Salehuddin, I. Ahmad, F.A Hamid, A. Zaharim,<br \/>\n&#8220;Analyze and optimize the silicide thickness in 45nm CMOS technology using Taguchi method&#8221;,<br \/>\n2010 IEEE International Conference on Semiconductor Electronics (ICSE), 2010, pp. 19 &#8211; 24.<\/p>\n<p>A. Abdul Aziz, S. S. Osman,<br \/>\n&#8220;A Simulation based study on C-V characteristics of oxide thickness for NMOS&#8221;,<br \/>\n2010 Intl Conf on Electronic Devices, Systems and Applications (ICEDSA), 2010, pp. 404 &#8211; 407.<\/p>\n<p>Sarvesh Dubey, Pramod Kumar Tiwari, S. Jit,<br \/>\n&#8220;A two-dimensional model for the potential distribution and threshold voltage of short-channel double-gate metal-oxide-semiconductor field-effect transistors with a vertical Gaussian-like doping profile&#8221;,<br \/>\nJournal of Applied Physics, Vol. 108 , Issue: 3, 2010, pp. 034518 &#8211; 034518-7.<\/p>\n<p>P. Rakesh Kumar, Santanu Mahapatra,<br \/>\n&#8220;Analytical modeling of quantum threshold voltage for triple gate MOSFET&#8221;,<br \/>\nSolid-State Electronics, Vol. 54, Issue 12, December 2010, pp. 1586-1591.<\/p>\n<p>A. Tsormpatzoglou, D.H. Tassis, C.A. Dimitriadis, G. Ghibaudo, G. Pananakakis, N. Collaert,<br \/>\n&#8220;Analytical modelling for the current\u2013voltage characteristics of undoped or lightly-doped symmetric double-gate MOSFETs&#8221;,<br \/>\nMicroelectronic Engineering, Vol. 87, Issue 9, November 2010, pp. 1764-1768.<\/p>\n<p>M. Cheralathan, A. Cerdeira, B. I\u00f1iguez,<br \/>\n&#8220;Compact model for long-channel cylindrical surrounding-gate MOSFETs valid from low to high doping concentrations&#8221;,<br \/>\nSolid-State Electronics, In Press, Corrected Proof, Available online 23 September 2010.<\/p>\n<p>M. Najmzadeh, K. Boucart, W. Riess, A.M. Ionescu,<br \/>\n&#8220;Asymmetrically strained all-silicon multi-gate n-Tunnel FETs&#8221;,<br \/>\nSolid-State Electronics, Vol. 54, Issue 9, September 2010, pp. 935-941.<\/p>\n<p>Munawar A. Riyadi, Ismail Saad, Razali Ismail,<br \/>\n&#8220;Investigation of pillar thickness variation effect on oblique rotating implantation (ORI)-based vertical double gate MOSFET&#8221;,<br \/>\nMicroelectronics Journal, In Press, Corrected Proof, Available online 22 July 2010.<\/p>\n<p>U. Monga, H. B\u00f8rli, T. A. Fjeldly,<br \/>\n&#8220;Compact subthreshold current and capacitance modeling of short-channel double-gate MOSFETs&#8221;,<br \/>\nMathematical and Computer Modelling, Vol. 51, Issues 7-8, April 2010, pp. 901-907.<\/p>\n<p>K. Park, P. Nayak, D.K. Schroder,<br \/>\n&#8220;Role of the substrate during pseudo-MOSFET drain current transients&#8221;,<br \/>\nSolid-State Electronics, Vol. 54, Issue 3, March 2010, pp. 316-322.<\/p>\n<p>Woo Young Choi,<br \/>\n&#8220;Applications of impact-ionization metal\u2013oxide-semiconductor (I-MOS) devices to circuit design&#8221;,<br \/>\nCurrent Applied Physics, Vol. 10, Issue 2, March 2010, pp. 444-451.<\/p>\n<p>K. Romanjek, E. Augendre, W. Van Den Daele, B. Grandchamp, L. Sanchez, C. Le Royer, J.-M. Hartmann, B. Ghyselen, E. Guiot, K. Bourdelle, S. Cristoloveanu, F. Boulanger, L. Clavelier,<br \/>\n&#8220;Improved GeOI substrates for pMOSFET off-state leakage control Microelectronic Engineering&#8221;,<br \/>\nIn Press, Corrected Proof, Available online 16 March 2009.<\/p>\n<p>Ravneet Kaur, Rishu Chaujar, Manoj Saxena, R. S. Gupta,<br \/>\n&#8220;cwith gate stack configuration&#8221;,<br \/>\nMicroelectronic Engineering, In Press, Corrected Proof, Available online 17 January 2009.<\/p>\n<p>P. Martin, M. Cavelier, R. Fascio, G. Ghibaudo, M. Bucher,<br \/>\n&#8220;EKV3 compact modeling of MOS transistors from a 0.18\u00a0\u03bcm CMOS technology for mixed analog\u2013digital circuit design at low temperature Cryogenics&#8221;,<br \/>\nIn Press, Corrected Proof, Available online 1 January 2009.<\/p>\n<p>Ravneet Kaur, Rishu Chaujar, Manoj Saxena, R.S. Gupta,<br \/>\n&#8220;Two dimensional simulation and analytical modeling of a novel ISE MOSFET with gate stack configuration&#8221;,<br \/>\nMicroelectronic Engineering, Vol. 86, Issue 10, October 2009, pp. 2005-2014.<\/p>\n<p>Rishu Chaujar, Ravneet Kaur, Manoj Saxena, Mridula Gupta, R.S. Gupta,<br \/>\n&#8220;TCAD assessment of Gate Electrode Workfunction Engineered Recessed Channel (GEWE-RC) MOSFET and its multi-layered gate architecture, Part II: Analog and large signal performance evaluation&#8221;,<br \/>\nSuperlattices and Microstructures, Vol. 46, Issue 4, October 2009, pp. 645-655.<\/p>\n<p>Xi Liu, Xiaoshi Jin, Jong-Ho Lee,<br \/>\n&#8220;A compact model of fringing field induced parasitic capacitance for deep sub-micrometer MOSFETs&#8221;,<br \/>\nSolid-State Electronics, Vol. 53, Issue 9, September 2009, pp. 1041-1045.<\/p>\n<p>Ravneet Kaur, Rishu Chaujar, Manoj Saxena, R.S. Gupta,<br \/>\n&#8220;Two dimensional simulation and analytical modeling of a novel ISE MOSFET with gate stack configuration&#8221;,<br \/>\nMicroelectronic Engineering, Vol. 86, Issue 10, October 2009, pp. 2005-2014.<\/p>\n<p>Rishu Chaujar, Ravneet Kaur, Manoj Saxena, Mridula Gupta, R. S. Gupta,<br \/>\n&#8220;TCAD assessment of Gate Electrode Workfunction Engineered Recessed Channel (GEWE-RC) MOSFET and its multi-layered gate architecture, Part II: Analog and large signal performance evaluation&#8221;,<br \/>\nSuperlattices and Microstructures, Vol. 46, Issue 4, October 2009, pp. 645-655.<\/p>\n<p>Xi Liu, Xiaoshi Jin, Jong-Ho Lee,<br \/>\n&#8220;A compact model of fringing field induced parasitic capacitance for deep sub-micrometer MOSFETs&#8221;,<br \/>\nSolid-State Electronics, Vol. 53, Issue 9, September 2009, pp. 1041-1045.<\/p>\n<p>B. Ayub, M. Rusop,<br \/>\n&#8220;The effect of gate dielectric thickness on PMOS performance&#8221;,<br \/>\nAIP Conference Proceedings, Vol. 1136, 2009, pp. 560-564.<\/p>\n<p>O. Suziana, B. Ayub, M. Redzuan, A. R. Shahrir, M. Y. Yunus, M. H. Abdullah, U. M. Noor, M. Rusop,<br \/>\n&#8220;Effect of doping concentration on electrical characteristics of NMOS structure&#8221;,<br \/>\nAIP Conference Proceedings, Vol. 1136, 2009, pp. 575-580.<\/p>\n<p>M. Redzuan, B. Ayub, M. Shahrir, O. Suziana, M. Yunus, M. H. Abdullah, U. M. Noor, M. Rusop,<br \/>\n&#8220;Mesh grid of SILVACO TCAD effect on net doping profile for NMOS structures&#8221;,<br \/>\nAIP Conference Proceedings, Vol. 1136, 2009, pp. 581-585.<\/p>\n<p>A. R. Shahrir, M. Rusop,<br \/>\n&#8220;The threshold voltage properties of NMOS structure etched with different etching methods&#8221;,<br \/>\nAIP Conference Proceedings, Vol. 1136, 2009, pp. 555-559.<\/p>\n<p>Woo Young Choi,<br \/>\n&#8220;Applications of impact-ionization metal-oxide-semiconductor (I-MOS) devices to circuit design&#8221;,<br \/>\nCurrent Applied Physics, In Press, Corrected Proof, Available online 3 July 2009.<\/p>\n<p>Chang-Hoon Kim<sup>1<\/sup>, Cheulhee Jung<sup>2<\/sup>, Hyun Gyu Park<sup>2<\/sup>\u00a0&amp; Yang-Kyu Choi<sup>1<\/sup><br \/>\n&#8220;<a href=\"\/wp-content\/uploads\/content\/kbase\/novel_dielectric-modulated_field-effect_transistor_for_label-gree-dna_detection.pdf\">Novel Dielectric-Modulated Field-Effect Transistor for Label-Free DNA Detection<\/a>&#8221;<\/p>\n<ol>\n<li>Division of Electrical Engineering, School of Electrical Engineering and Computer Science, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 305-701, Republic of Korea<\/li>\n<li>Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 305-701, Republic of Korea<br \/>\nBiochip Journal, Vol. 2, No. 2, 127-134, June 2008<\/li>\n<\/ol>\n<p>Ratul Kumar Baruah, Santanu Mahapatra,<br \/>\n&#8220;Justifying threshold voltage definition for undoped body transistors through \u201ccrossover point\u201d concept&#8221;,<br \/>\nPhysica B: Condensed Matter, Vol. 404, Issues 8-11, 1 May 2009, pp. 1029-1032.<\/p>\n<p>Rishu Chaujar, Ravneet Kaur, Manoj Saxena, Mridula Gupta and R.S. Gupta,<br \/>\n&#8220;Laterally amalgamated DUal Material GAte Concave (L-DUMGAC) MOSFET for ULSI&#8221;,<br \/>\nMicroelectronic Engineering, Vol. 85, Issue 3, March 2008, pp. 566-576.<\/p>\n<p>Rishu Chaujar, Ravneet Kaur, Manoj Saxena, Mridula Gupta and R.S. Gupta,<br \/>\n&#8220;Laterally amalgamated DUal Material GAte Concave (L-DUMGAC) MOSFET for ULSI&#8221;,<br \/>\nMicroelectronic Engineering, Vol. 85, Issue 3, March 2008, pp. 566-576.<\/p>\n<p>Lizhe Tan, Octavian Buiu, Stephen Hall, Enrico Gili, Takashi Uchino, Peter Ashburn,<br \/>\n&#8220;The influence of junction depth on short channel effects in vertical sidewall MOSFETs&#8221;,<br \/>\nSolid-State Electronics, Vol. 52, Issue 7, July 2008, pp. 1002-1007.<\/p>\n<p>F. Lime, B. Iniguez, O. Moldovan,<br \/>\n&#8220;A quasi-two-dimensional compact drain-current model for undoped symmetric double-gate MOSFETs including short-channel effects&#8221;,<br \/>\nIEEE Transactions on Electron Devices, Vol. 55, No. 6, June 2008, pp. 1441-1448.<\/p>\n<p>S. Capraro<sup>1<\/sup>, C. Bermond<sup>1<\/sup>, T.T. Vo<sup>1<\/sup>, J. Piquet<sup>1<\/sup>, B. Fl\u00e9chet<sup>1<\/sup>, M. Thomas<sup>2<\/sup>, A. Farcy<sup>2<\/sup>, J. Torres<sup>2<\/sup>, S. Cremer2, E. Guichard<sup>3<\/sup>, A. Haen<sup>3<\/sup>,<br \/>\n&#8221;\u00a0&#8220;Design Improvement of RF 3D MIM Damascene Capacitor &#8220;&#8221;<\/p>\n<ol>\n<li>LAHC, IMEP-LAHC, Universit\u00e9 de Savoie, Campus Scientifique, 73736 Le Bourget du Lac, France<\/li>\n<li>STMicroelectronics, 850 rue J. Monnet, 38926 Crolles cedex, France<\/li>\n<li>Silvaco Data Sytems, 55 rue Pascal Blaise, 38330 Montbonnot St Martin, France<\/li>\n<\/ol>\n<p>Yu. P. Snitovsky, M. G. Krasikov,<br \/>\n&#8220;New CMOS process using a thermal-oxide mask for making n<sup>&#8211;<\/sup>\u00a0&#8211; and p<sup>&#8211;<\/sup>\u00a0&#8211; wells&#8221;,<br \/>\nRussian Microelectronics, Vol. 37, No. 3, May 2008, pp. 166-174.<\/p>\n<p>A. S. Zoolfakar, H. Hashim,<br \/>\n&#8220;Comparison between Experiment and Process Simulation Results for Converting Enhancement to Depletion Mode NMOS Transistor&#8221;,<br \/>\nSecond Asia International Conference on Modeling &amp; Simulation,<br \/>\n2008. AICMS 08. 13-15 May 2008 pp. 1061 &#8211; 1064.<\/p>\n<p>S. F. W. M. Hatta, N. Soin,<br \/>\n&#8220;Design of a low voltage CMOS LNA at 2 GHz with substrate-bias&#8221;,<br \/>\nAIP Conference Proceedings, Vol. 1060, 2008, pp. 244-249<\/p>\n<p>Rishu Chaujar, Ravneet Kaur, Manoj Saxena, Mridula Gupta, R.S. Gupta,<br \/>\n&#8220;Laterally amalgamated DUal Material GAte Concave (L-DUMGAC) MOSFET for ULSI&#8221;,<br \/>\nMicroelectronic Engineering, Vol. 85, Issue 3, Mar. 2008, pp. 566-576.<\/p>\n<p>Zoolfakar A. S., Hashim H.,<br \/>\n&#8220;Comparison between Experiment and Process Simulation Results for Converting Enhancement to Depletion Mode NMOS Transistor&#8221;,<br \/>\nSecond Asia International Conference on Modeling &amp; Simulation, AICMS 2008. 13-15 May 2008, pp. 1061-1064.<\/p>\n<p>Harsupreet Kaur, Sneha Kabra, Subhasis Haldar and R.S. Gupta,<br \/>\n&#8220;An analytical drain current model for graded channel cylindrical\/surrounding gate MOSFET&#8221;,<br \/>\nMicroelectronics Journal, Vol. 38, Issue 3, March 2007, pp. 352-359.<\/p>\n<p>Kathy Boucart and Adrian Mihai Ionescu,<br \/>\n&#8220;Double-Gate Tunnel FET With High- k Gate&#8221;<br \/>\nIEEE Transactions on Electron Devices, VOL 54, NO 7, July 2007<\/p>\n<p>F. Mayer, C. Le Royer, G. Le Carval, C. Tabone, L. Clavelier and S. Deleonibus,<br \/>\n&#8220;Comparative study of the fabricated and simulated Impact Ionization MOS (IMOS)&#8221;,<br \/>\nSolid-State Electronics, Vol. 51, Issue 4, April 2007, pp. 579-584.<\/p>\n<p>X. Loussier, D. Munteanu and J. L. Autran,<br \/>\n&#8220;Impact of high-permittivity dielectrics on speed performances and power consumption in double-gate-based CMOS circuits&#8221;,<br \/>\nJournal of Non-Crystalline Solids, Vol. 353, Issues 5-7, 1 April 2007, pp. 639-644.<\/p>\n<p>Jong Pil Kim, Woo Young Choi, Jae Young Song, Seongjae Cho, Sang Wan Kim, Jong Duk Lee, Byung-Gook Park,<br \/>\n&#8220;Design and simulation of asymmetric MOSFETs &#8220;,<br \/>\nIEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, Vol. E90-C, No. 5, May 2007, p 978-982.<\/p>\n<p>Ulrich Abelein, Andreas Assmuth, Peter Iskra, Markus Schindler, Torsten Sulima and Ignaz Eisele,<br \/>\n&#8220;Doping profile dependence of the vertical impact ionization MOSFET\u00b4s (I-MOS) performance&#8221;,<br \/>\nSolid-State Electronics, Vol. 51, Issue 10, October 2007, pp. 1405-1411.<\/p>\n<p>Jong Pil Kim (Seoul Nat. Univ., Seoul, South Korea), Woo Young Choi, Jae Young Song, Sang Wan Kim, Jong Duk Lee; Byung-Gook Park,<br \/>\n&#8220;Design and fabrication of asymmetric MOSFETs using a novel self-aligned structure&#8221;,<br \/>\nIEEE Transactions on Electron Devices, Vol. 54, No. 11, Nov. 2007, pp. 2969-2974.<\/p>\n<p>P. K. Ooi, K. Ibrahim,<br \/>\n&#8220;Simulation of single channel length vertical silicon MOSFET&#8221;,<br \/>\nAIP Conference Proceedings, Vol. 1017, 2007, pp. 154-158.<\/p>\n<p>S. Michael, L.T.B. Canfield,<br \/>\n&#8220;The design and optimization of advanced thermophotovoltaic devices for deep space applications using a new modeling approach&#8221;,<br \/>\nAIP Conference Proceedings, Vol. 890, No. 1, 2007, pp.s 213-226.<\/p>\n<p>G. M. Buiatti, F. Cappelluti, G. Ghione,<br \/>\n&#8220;Physics-based PiN diode SPICE model for power-circuit simulation&#8221;,<br \/>\nIEEE Transactions on Industry Applications, Vol. 43, No. 4, July-August 2007, pp. 911-919.<\/p>\n<p>I. V. Kotova, T. J. Humanica, D. Nouaisb, J. Randela, A. Rashevskyc,<br \/>\n&#8220;Electric fields in nonhomogeneously doped silicon. Summary of simulations&#8221;<br \/>\nNuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 568 (1), pp. 41-45, July 10 2006.<\/p>\n<p>M. Elgin, D. Russell, M. Katula, R. Paulsen, S. Parke,<br \/>\n&#8220;CMOS imager pixel design for space applications&#8221;,<br \/>\nMicroelectronics and Electron Devices, 2006. WMED &#8217;06. 2006 IEEE Workshop on 14 April 2006, pp. 1.<\/p>\n<p>Vaskar Sarkara and Aloke K. Dutta,<br \/>\n&#8220;An accurate, analytical, and technology-mapped definition of the surface potential at threshold and a new postulate for the threshold voltage of MOSFETs&#8221;<br \/>\nSolid-State Electronics Vol. 50, Issues 11-12, November-December 2006, pp. 1814-1821.<\/p>\n<p>M. Masahara, Y. Liu, K. Ishii, K. Sakamoto, T. Matsukawa, H. Tanoue, S. Kanemaru, E. Suzuki,<br \/>\n&#8220;Fabrication and characterization of vertical-type, self-aligned asymmetric double-gate metal-oxide-semiconductor field-effect-transistors&#8221;<br \/>\nApplied Physics Letters, Vol. 86, Issue 12, 21 March 2005, pp. 1-3.<\/p>\n<p>K. K. Bhuwalka, J. Schulze, I. Eisele,<br \/>\n&#8220;Scaling the vertical tunnel FET with tunnel bandgap modulation and gate workfunction engineering&#8221;<br \/>\nIEEE Transactions on Electron Devices Vol. 52, Issue 5, May 2005, pp. 909-917.<\/p>\n<p>K. Chong, X. Zhang, K.-N. Tu, D. Huang, M.-C. Chang, Y.-H. Xie,<br \/>\n&#8220;Three-dimensional substrate impedance engineering based on p-\/p+ Si substrate for mixed-signal system-on-chip (SoC)&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 52, Issue 11, November 2005, pp. 2440-2446.<\/p>\n<p>P. Kasturi, M. Saxena, R. S. Gupta,<br \/>\n&#8220;Modeling and simulation of STacked Gate Oxide (STGO) architecture in Silicon-On-Nothing (SON) MOSFET&#8221;<br \/>\nSolid-State Electronics, Vol. 49, Issue 10, October 2005, pp. 1639-1648.<\/p>\n<p>M. De Souza, M. A. Pavanello, B. Iniguez, D. Flandre,<br \/>\n&#8220;A charge-based continuous model for submicron graded-channel nMOSFET for analog circuit simulation&#8221;<br \/>\nSolid-State Electronics, Vol. 49, Issue 10, October 2005, pp. 1683-1692.<\/p>\n<p>G. Nicholas, T. J. Grasby, E. H. C. Parker, T. E. Whall, T. Skotnicki,<br \/>\n&#8220;Evidence of reduced self-heating in strained Si MOSFETs&#8221;<br \/>\nIEEE Electron Device Letters, Vol. 26, Issue 9, September 2005, pp. 684-686.<\/p>\n<p>M. Masahara, Y. Liu, K. Sakamoto, K. Endo, T. Matsukawa, K. Ishii, T. Sekigawa, H. Yamauchi, H. Tanoue, S. Kanemaru, H. Koike, E. Suzuki,<br \/>\n&#8220;Demonstration, analysis, and device design considerations for independent DG MOSFETs&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 52, Issue 9, September 2005, pp. 2046-2053.<\/p>\n<p>G. Curatola, G. Doornbos, J. Loo, Y. V. Ponomarev, G. Iannaccone,<br \/>\n&#8220;Detailed modeling of sub- 100-nm MOSFETs based on Schrodinger DD per subband and experiments and evaluation of the performance gap to ballistic transport&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 52, Issue 8, August 2005, pp. 1851-1858.<\/p>\n<p>D. Munteanu, J. L. Autran, S. Harrison,<br \/>\n&#8220;Quantum short-channel compact model for the threshold voltage in double-gate MOSFETs with high-permittivitty gate dielectrics&#8221;<br \/>\nJournal of Non-Crystalline Solids, Vol. 351, Issue 21-23, 15 July 2005, pp. 1911-1918.<\/p>\n<p>V. D&#8217;Alessandro, P. Spirito,<br \/>\n&#8220;Achieving accuracy in modeling the temperature coefficient of threshold voltage in MOS transistors with uniform and horizontally nonuniform channel doping&#8221;<br \/>\nSolid-State Electronics, Vol. 49, Issue 7, July 2005, pp. 1098-1106.<\/p>\n<p>A. R. Saha, S. Chattopadhyay, C. Bose, C. K. Maiti,<br \/>\n&#8220;Technology CAD of silicided Schottky barrier MOSFET for elevated source-drain engineering&#8221;<br \/>\nMaterials Science and Engineering B: Solid-State Materials for Advanced Technology, 2005, Vol. 124-125, pp. 424-430.<\/p>\n<p>J. Yuan, J. C. S. Woo,<br \/>\n&#8220;A novel split-gate MOSFET design realized by a fully silicided gate process for the improvement of transconductance and output&#8221;<br \/>\nIEEE Electron Device Letters, Vol. 26, Issue 11, November 2005, pp. 829-831<\/p>\n<p>E. J. Preisler, S. Guha, B. R. Perkins, D. Kazazis, A., Zaslavsky,<br \/>\n&#8220;Ultrathin epitaxial germanium on crystalline oxide metal-oxide-semiconductor-field-effect transistors&#8221;<br \/>\nApplied Physics Letters, Vol. 86, Issue 22, 2005, pp. 1-3.<\/p>\n<p>K. Goel, M. Saxena, M. Gupta, R. S. Gupta,<br \/>\n&#8220;Two-dimensional analytical threshold voltage model for DMG Epi-MOSFET&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 52, Issue 1, January 2005, pp. 23-29.<\/p>\n<p>A. Gokirmak, S. Tiwari,<br \/>\n&#8220;Threshold voltage tuning and suppression of edge effects in narrow channel MOSFETs using surrounding buried side-gate&#8221;<br \/>\nElectronics Letters, Vol. 41, Issue 3, 3 February 2005, pp. 157-158.<\/p>\n<p>I. Nam, K. Lee,<br \/>\n&#8220;High-performance RF mixer and operational amplifier BiCMOS circuits using parasitic vertical bipolar transistor in CMOS technology&#8221;<br \/>\nIEEE Journal of Solid-State Circuits, Vol. 40, Issue 2, February 2005, pp. 392-402.<\/p>\n<p>A. Ohata,<br \/>\n&#8220;Evaluation of performance degradation factors for high-k gate dielectrics in N-channel MOSFETs&#8221;<br \/>\nSolid-State Electronics, Vol. 48, Feb. 2004, pp. 345 &#8211; 349.<\/p>\n<p>S. -E. Tan,<br \/>\n&#8220;Velocity saturation in PMOSFET: Using different inversion layer mobility models&#8221;<br \/>\n10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Sys.<\/p>\n<p>S. -E. Tan,<br \/>\n&#8220;Effects of normal electric field on submicrometer PMOSFET&#8221;<br \/>\n10th International Symposium on Integrated Circuits, Devices and Systems, ISIC-2004: Integrated Sys.<\/p>\n<p>Y. David and U. Efron,<br \/>\n&#8220;Design and analysis of an image transceiver device with a low cross-talk level&#8221;<br \/>\nIEEE Convention of Electrical and Electronics Engineers in Israel, Proceedings 2004, pp. 41-43.<\/p>\n<p>T. Uchino, P. Ashburn, Y. Kiyota, T. Shiba,<br \/>\n&#8220;A CMOS-compatible rapid vapor-phase doping process for CMOS scaling&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 51, Issue 1, January 2004, pp. 14-19<\/p>\n<p>H. Lee, H. Shin, J. Lee,<br \/>\n&#8220;Design of a 20 nm T-gate MOSFET with a Source\/Drain-to-Gate Non-Overlapped Structure&#8221;<br \/>\nJournal of the Korean Physical Society, Vol. 44, Issue 1, January 2004, pp. 65-68.<\/p>\n<p>M. -A. Jaud, S. Barraud, G. Le Carval,<br \/>\n&#8220;Impact of quantum mechanical tunneling on off-leakage current in double-gate MOSFET using a quantum drift-diffusion model&#8221;<br \/>\n2004 NSTI Nanotechnology Conference and Trade Show &#8211; NSTI Nanotech 2004 Vol. 2, 2004, pp. 17-20.<\/p>\n<p>M. Masahara, Y. Liu, S. Hosokawa, T. Matsukawam K. Ishii, H. Tanoue, K. Sakomoto, T. Sekigawa, H. Yamauchi, S. Kanemaru, and E. Suzuki,<br \/>\n&#8220;Ultrathin Channel Vertical DG MOSFET Fabricated by using Ion-Bombardment-Retarded Etching&#8221;<br \/>\nIEEE Trans, Electron Devices, Vol. 51, Dec 2004, pp. 2078-2085.<\/p>\n<p>Pascal Scheiblin and Johann Foucher,<br \/>\n&#8220;Three-Dimensional Simulation of the Effect of E-Beam Lithography Induced Line-Edge Roughness on N-Type Metal-Oxide Semiconductor Transistor Electrical Characteristics for a 50nm Technology&#8221;<br \/>\nJapanese Journal of Applied Physics Vol. 43 No. 6B, 2004, pp. 3838-3842.<\/p>\n<p>S. C. Kelly, J. A. Power, M. O&#8217;Neill,<br \/>\n&#8220;Selection and modeling of integrated RF varactors on a 0.35-\u03bcm BiCMOS technology &#8221;<br \/>\nIEEE Transactions on Semiconductor Manufacturing, Vol. 17, No. 2, May, 2004, The International Co.<\/p>\n<p>J. Yuan and J. C. S. Woo,<br \/>\n&#8220;Nanoscale MOSFET with split-gate design for RF\/analog application&#8221;<br \/>\nJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, Vol. 43, No. 4B, pp. 1742-1745 (2004).<\/p>\n<p>E. Gili, V. D. Kunz, C. H. De Groot, T. Uchino, P. Ashburn, D. C. Donaghy, S. Hall, Y. Wang, P. L. F. Hemment,<br \/>\n&#8220;Single, double and surround gate vertical MOSFETs with reduced parasitic capacitance&#8221;<br \/>\nSolid-State Electronics, Vol. 48, Issue 4, April 2004, pp. 511-519.<\/p>\n<p>N. D. Jankovic and G. A. Armstrong,<br \/>\n&#8220;Comparative analysis of the DC performance of DG MOSFETs on highly-doped and near-intrinsic silicon layers&#8221;<br \/>\nMicroelectronics Journal, Vol. 35, Issue 8, August 2004, pp. 647-653.<\/p>\n<p>N. G. Gunther, I. I. Pesic, A. A. Mutlu, M. Rahman,<br \/>\n&#8220;Modeling C &#8211; V characteristics of deep sub-0.1 micron mesoscale MOS devices&#8221;<br \/>\nSolid-State Electronics, Vol. 48, Issue 10-11 SPEC. ISS., October 2004, pp. 1883-1890.<\/p>\n<p>N. P. Hong, J. -W Hong,<br \/>\n&#8220;Charge storage characteristics of SiO2\/Si3N 4 double layer electret&#8221;<br \/>\nProceedings of the 2004 IEEE International Conference on Solid Dielectrics ICSD 2004, Vol. 1, Pro.<\/p>\n<p>G. Pei, E. C. -C. Kan,<br \/>\n&#8220;Independently driven DG MOSFETs for mixed-signal circuits: Part I &#8211; Quasi-static and nonquasi-static channel coupling&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 51, Issue 12, December 2004, pp. 2086-2093.<\/p>\n<p>G. Pei, E. C. C. Kan,<br \/>\n&#8220;Independently driven DG MOSFETs for mixed-signal circuits: Part II &#8211; Applications on cross-coupled feedback and harmonics generation&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 51, Issue 12, December 2004, pp. 2094-2101.<\/p>\n<p>M. Masahara, Y. Liu, S. Hosokawa, T. Matsukawa, K. Ishii, H. Tanoue, K. Sakamoto, T. Sekigawa, H. Yamauchi, S. Kanemaru, E. Suzuki,<br \/>\n&#8220;Ultrathin channel vertical DG MOSFET fabricated by using ion-bombardment-retarded etching&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 51, Issue 12, December 2004, pp. 2078-2085.<\/p>\n<p>A. Y. Kovalgin, J. Holleman, G. Iordache, T. Jenneboer, F. Falke, V. Zieren, M. Goossens,<br \/>\n&#8220;Low-power micro-scale CMOS-compatible silicon sensor on a suspended membrane&#8221;<br \/>\nElectrochemical Society Proceedings, Vol. 9, 2004, pp. 173-183.<\/p>\n<p>M. Stadele, R. J. Luyken, M. Roosz, M. Specht, W. Rasner, L. Dreeskornfeld, J. Hartwich, F. Hofmann, J. Kretz, E. Landgraf, L. Risch,<br \/>\n&#8220;A comprehensive study of corner effects in tri-gate transistors&#8221;<br \/>\nESSCIRC 2004 &#8211; Proceedings of the 34th European Solid-State Device Research Conference, 2004.<\/p>\n<p>F. -L. Chang, M. -J. Lin, C. W. Liaw, T. -C. Liao, H. -C. Cheng,<br \/>\n&#8220;Investigation of A 450 V rating silicon-on-insulator lateral-double-diffused-metal-oxide-semiconductor fabrication by 12\/25\/5\/40 V bipolar-complementary metal-oxide-semiconductor double-diffused metal-oxide-semiconductor process on bulk silicon substrate&#8221;<br \/>\nJapanese Journal of Applied Physics, 2004, Vol. 43, pp. 4119-4123.<\/p>\n<p>U. Efron, I. David, V. Sinelnikov, B. Apter,<br \/>\n&#8220;A CMOS\/LCOS image transceiver chip for smart goggle applications&#8221;<br \/>\nIEEE Transactions on Circuits and Systems for Video Technology, Vol. 14, Issue 2, February 2004,<\/p>\n<p>A. K. Sharma, S. H. Zaidi, S. Lucero, S. R. J. Brueck, N. E. Islam,<br \/>\n&#8220;Mobility and transverse electric field effects in channel conduction of wrap-around-gate nanowire MOSFETs&#8221;<br \/>\nIEE Proceedings: Circuits, Devices and Systems, Vol. 151, Issue 5, October 2004, pp. 422-430.<\/p>\n<p>M. Lemme, et al.,<br \/>\n&#8220;Influence of channel width on n- and p-type nano-wire-MOSFETs on silicon on insulator substrate&#8221;<br \/>\nMicroelectronic Engineering, Vol. 67-68, June 2003, pp. 810-817.<\/p>\n<p>T. S. Park, E. Yoon, J. H. Lee,<br \/>\n&#8220;A 40 nm body-tied FinFET (OMEGA MOSFET) using bulk Si wafer&#8221;<br \/>\nPhysica E: Low-dimensional Systems and Nanostructures, Vol. 19, Jul. 2003, pp. 6 -12.<\/p>\n<p>R. Granzner, V. M. Polyakov, F. Schwierz, M. Kittler, T. Doll,<br \/>\n&#8220;On the suitability of DD and HD models for the simulation of nanometer double-gate MOSFETs&#8221;<br \/>\nPhysica E: Low-dimensional Systems and Nanostructures, Vol. 19, Jul. 2003, pp. 33 &#8211; 38.<\/p>\n<p>A. Mannargudi, D. Vasileska,<br \/>\n&#8220;Quantum confinements in highly asymmetric sub-micrometer device structures&#8221;<br \/>\nSuperlattices and Microstructures, Vol. 34 (3-6), Sep-Dec 2003, pp. 347-354.<\/p>\n<p>R. B. Beck,<br \/>\n&#8220;Formation of ultrathin silicon oxides-modeling and technological constraints&#8221;<br \/>\nMaterials Science in Semiconductor Processing, Vol. 6, February-June 2003, pp. 49-57.<\/p>\n<p>J. Urresti, S. Hidalgo, D. Flores, J. Roig, J. Rebollo, I. Mazarredo,<br \/>\n&#8220;Optimisation of very low voltage TVS protection devices&#8221;<br \/>\nMicroelectronics Journal, Vol. 34, September 2003, pp. 809-813.<\/p>\n<p>S. K. Han, Y. I. Choi and S. K. Chung,<br \/>\n&#8220;An analytic model for breakdown voltage of gated diodes&#8221;<br \/>\nMicroelectronics Journal, Vol. 34, May-Aug. 2003, pp. 525-527.<\/p>\n<p>Iliya Pesic, Norman Gunther, Ayhan Mutlu, and Mahmud Rahman,<br \/>\n&#8220;Modeling C-V Characterisitics of Deep Sub &#8211; 0.1 Micron Mesoscale MOS Devices&#8221;<br \/>\nProceedings of 2003 International Semiconductor Device Research Symposium, Washington DC, December 1.<\/p>\n<p>A. Breed and K. P. Roenker,<br \/>\n&#8220;Dual-gate (FinFET) and Tri-Gate MOSFETs: Simulation and Design&#8221;<br \/>\nProceedings of 2003 International Semiconductor Device Research Symposium, Washington DC, December 1.<\/p>\n<p>M. Saxena, S. Haldar, M. Gupta, R. S. Gupta,<br \/>\n&#8220;Modeling and simulation of asymmetric gate stack (ASYMGAS)-MOSFET&#8221;<br \/>\nSolid-State Electronics, Vol. 47, November 2003, pp. 2131-2134.<\/p>\n<p>T. Ivanov, T. Gotszalk, T. Sulzbach, I. W. Rangelow,<br \/>\n&#8220;Quantum size aspects of the piezoresistive effect in ultra thin piezoresistors&#8221;<br \/>\nUltramicroscopy, Vol. 97, October-November 2003, pp. 377-384.<\/p>\n<p>M. Masahara, T. Matsukawa, H. Tanoue and et al.,<br \/>\n&#8220;Novel process for vertical double-gate (DG) metal-oxide-semiconductor field-effect-transistor (MOSFET) fabrication&#8221;<br \/>\nJpn. J. Appl. Phys. 1, Vol. 42, Jun. 2003, pp. 4138 &#8211; 4141.<\/p>\n<p>G. M. Laws, T. J. Thornton, J. Yanga, L. de la Garza, M. Kozicki, D. Gust, J. Gu, D. Sorid,<br \/>\n&#8220;Drain current control in a hybrid molecular\/MOSFET device&#8221;<br \/>\nPhysica E: Low-dimensional Systems and Nanostructures, Vol. 17, April 2003, pp. 659 &#8211; 663.<\/p>\n<p>M. Masahara, T. Matsukawa, K. 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Shur,<br \/>\n&#8220;Analysis of the anomalous drain current characteristics of halo MOSFETs&#8221;<br \/>\nSolid-State Electronics, Vol. 47, January 2003, pp. 99-106.<\/p>\n<p>Anand Mannargudi and Dragica Vasileska,<br \/>\n&#8220;Monte Carlo and Energy Balance Simulations of Deep-micrometer Conventional and Asymmetric MOSFET Device Structures&#8221;<br \/>\nNanotech 2003, Vol. 2, pp. 1-4.<\/p>\n<p>M. Saxena, S. Haldar, M. Gupta and et al.,<br \/>\n&#8220;Physics-based modelling and simulation of dual material gate stack (DUMGAS) MOSFET&#8221;<br \/>\nElectron Letter, Vol. 39, Jan. 2003, pp. 155-157.<\/p>\n<p>C. Cavallaro, S. Musumeci, R. Pagano, A. Raciti, K. Shenai,<br \/>\n&#8220;Analysis Modeling and Simulation of Low-Voltage MOSFETs in Synchronous-Rectifier Buck-Converter Applications&#8221;<br \/>\nIECON Proceedings (Industrial Electronics Conference), Vol. 2, 2003, pp. 1697-1702.<\/p>\n<p>R. R. Whiteman, A. P. Knights, D. George, I. E. Day, A. Vonsovici, A. A. House, G. F. Hopper, M. Asghari,<br \/>\n&#8220;Recent progress in the design, simulation and fabrication of small cross-section silicon-on-insulator VOAs&#8221;<br \/>\nProceedings of SPIE &#8211; The International Society for Optical Engineering, Vol. 4997, 2003, pp. 1.<\/p>\n<p>Sheehan, D.P., A.R. Putnam and J.H. Wright,<br \/>\n&#8220;A solid-state Maxwell demon&#8221;;<br \/>\nFoundations of Physics, October 2002, Vol. 32, No. 10.<\/p>\n<p>D. Munteanu, G. Le Carval, G. Guegan,<br \/>\n&#8220;<a href=\"\/wp-content\/uploads\/\/content\/kbase\/NonStationaryTransportEffects.pdf\">Non-Stationary Transport Effects: Impact on Performances of Realistic 50nm MOSFET Technology<\/a>&#8221;<br \/>\nLETI, CEA \/ Grenoble, Microelectronics Department 17 rue des Martyrs, 38054 Grenoble, France<\/p>\n<p>H. V\u00e4in\u00f6l\u00e4, J. Storgards, M. Yli-Koski, and J. Sinkkonen,<br \/>\n&#8220;Light induced change on the built-in potential of p\/p<sup>+<\/sup>\u00a0structures and its effect on carrier lifetime measurements&#8221;<br \/>\nMaterial Science and Engineering, B91-92, 2002, pp. 421-424.<\/p>\n<p>X. F. Gao, J. J. Liou, A. Ortiz-Conde, J. Bernier and G. Croft,<br \/>\n&#8220;A physics-based model for the substrate resistance of MOSFETs&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 6, June 2002, pp. 853-857.<\/p>\n<p>P. Masson, J. -L. Autran and D. Munteanu,<br \/>\n&#8220;DYNAMOS: a numerical MOSFET model including quantum-mechanical and near-interface trap transient effects&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 7, July 2002, pp. 1051-1059.<\/p>\n<p>Wai-Kay Yip, Min Shen, Ming-C. Cheng, Robert Fithen and Goodarz Ahmadi,<br \/>\n&#8220;Hydrodynamic modeling of short-channel devices using an upwind flux vector splitting scheme&#8221;<br \/>\nComputer Methods in Applied Mechanics and Engineering, Vol. 191, Issue 47-48, Nov. 2002, pp. 5427-5445.<\/p>\n<p>M. Masahara, T. Matsukawa, K. -I. Ishii, Y. Liu, H. Tanoue, K. Sakamoto, T. Sekigawa, H. Yamauchi, S. Kanemaru, E. Suzuki,<br \/>\n&#8220;15-nm-thick Si channel wall vertical double-gate MOSFET&#8221;<br \/>\nTechnical Digest &#8211; International Electron Devices Meeting, 2002, pp. 949-951.<\/p>\n<p>G. M. Laws, T. J. Thornton, J. Yang, L. De La Garza, M. Kozicki, D. Gust,<br \/>\n&#8220;Molecular control of the drain current in a buried channel MOSFET&#8221;<br \/>\nPhysica Status Solidi (B) Basic Research, Vol. 233, Issue 1, September 2002, pp. 83-89.<\/p>\n<p>F. Pregaldiny, C. Lallement, D. Mathiot,<br \/>\n&#8220;A simple efficient model of parasitic capacitances of deep-submicron LDD MOSFETs&#8221;<br \/>\nSolid-State Electronics, Vol. 46, December 2002, pp. 2191-2198.<\/p>\n<p>S. Persson, P. -E. Hellberg and S. -L. Zhang,<br \/>\n&#8220;A charge sheet model for MOSFETs with an abrupt retrograde channel: Part II. Charges and intrinsic capacitances&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 12, Dec. 2002, pp. 2217-2225.<\/p>\n<p>M. Saxena, S. Haldar and M. Gupta, et al.,<br \/>\n&#8220;Physics-based analytical modeling of potential and electrical field distribution in dual material gate (DMG)-MOSFET for improved hot electron effect and carrier transport efficiency&#8221;<br \/>\nIEEE Trans. Electron Devices, Vol. 49, Nov. 2002, pp. 1928-1938.<\/p>\n<p>Fernando Gonz?z, Sr. , Suraj J. Mathew and J. Alex Chediak,<br \/>\n&#8220;A dynamic source-drain extension MOSFET using a separately biased conductive spacer&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 10, Oct. 2002, pp. 1525-1530.<\/p>\n<p>X. Gao, J. J. Liou, J. Bernier and G. Croft,<br \/>\n&#8220;An improved model for substrate current of submicron MOSFETs&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 9, Sep. 2002, pp. 1395-1398.<\/p>\n<p>L. Vestling, J. Olsson and K. -H. Eklund,<br \/>\n&#8220;Drift region optimization of lateral RESURF devices&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 8, Aug. 2002, pp. 1177-1184.<\/p>\n<p>D. Munteanu, G. Le Carval and G. Guegan,<br \/>\n&#8220;Impact of technological parameters on non-stationary transport in realistic 50 nm MOSFET technology&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 7, Jul. 2002, pp. 1045-1050.<\/p>\n<p>Seong-Dong Kim, et al.,<br \/>\n&#8220;Advanced model and analysis of series resistance for CMOS scaling into nanometer regime &#8211; part 1: theoretical derivation&#8221;<br \/>\nIEEE Trans. Electron Devices, vol.49, No.3, March 2002, pp.457 &#8211; 466.<\/p>\n<p>C. Caillat, S. Deleonibus, G. Guegan, M. Heitzmann, M. E. Nier, S. Tedesco, B. Dal&#8217;zotto, F. Martin, P. Mur, A. M. Papon et al.,<br \/>\n&#8220;A 20 nm physical gate length NMOSFET with a 1.2 nm gate oxide fabricated by mixed dry and wet hard mask etching&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 3, March 2002, pp. 349-352.<\/p>\n<p>Juin J. Liou, R. Shireen, A. Ortiz-Conde, F. J. Garcia Sanchez, A. Cerdeira, X. Gao, Xuecheng Zou and C. S. Ho,<br \/>\n&#8220;Influence of polysilicon-gate depletion on the subthreshold behavior of submicron MOSFETs&#8221;<br \/>\nMicroelectronics Reliability, Vol. 42, Issue 3, March 2002, pp. 343-347.<\/p>\n<p>Yee-Chia Yeo, Subramanian V. Kedzierski J., Peiqi Xuan, Tsu-Jae King, Bokor J., Chenming Hu,<br \/>\n&#8220;Design and Fabrication of 50-nm Thin-Body p-MOSFETs With a SiGe Heterostructure Channel&#8221;<br \/>\nIEEE Trans. Electron Devices, Vol. 49, Feb. 2002, pp. 279 &#8211; 286.<\/p>\n<p>L. Mao, H. Nian, P. Gao, S. Zhang, W. Guo, S. Zhang,<br \/>\n&#8220;Mixed-mode circuit and device simulation for an optoelectronic integrated receiver&#8221;<br \/>\nProceedings of SPIE &#8211; The International Society for Optical Engineering, Vol. 4919, 2002, pp. 507.<\/p>\n<p>S. Persson, P. -E. Hellberg and S. -L. Zhang,<br \/>\n&#8220;A charge sheet model for MOSFETs with an abrupt retrograde channel: Part I. Drain current and body charge&#8221;<br \/>\nSolid-State Electronics, Vol. 46, Issue 12, Dec. 2002, pp. 2209-2216.<\/p>\n<p>B. Villard, F. Calmon, C. Gontrand,<br \/>\n&#8220;Design and characterization of high voltage devices integrated in a standard CMOS technology&#8221;<br \/>\nEPJ Applied Physics, Vol. 16, Issue 2, November 2001, pp. 113-120.<\/p>\n<p>Milne PR,<br \/>\n&#8220;Design, Simulation, and Fabrication of a BiCMOS VLSI Digitally Programmable GIC Filter&#8221;<br \/>\nNaval Postgraduate School, Monterey, CA. Sep 2001. 97p. NTIS ADA397177.<\/p>\n<p>G. Kamoulakos, Y. Tsiatouhas, A. Chrisanthopoulos and et al.,<br \/>\n&#8220;A high-density DRAM cell with built-in gain stage&#8221;<br \/>\nIEEE Trans. Electron Devices, Vol. 48, Jun. 2001, pp. 1194 &#8211; 1199.<\/p>\n<p>D. Munteanu, G. Le Carval, G. Guegan,<br \/>\n&#8220;Impact of non-stationary transport effects on realistic 50nm MOS technology&#8221;<br \/>\n2001 International Conference on Modeling and Simulation of Microsystems &#8211; MSM 2001, 2001, pp. 46.<\/p>\n<p>N. Takaura, R. Nagai, H. Asakura, S. Yamada, S. Kimura,<br \/>\n&#8220;A new method for analyzing boron penetration and gate depletion using dual-gate PMOSFETs for high performance G-bit DRAM design&#8221;<br \/>\nIEEE International Conference on Microelectronic Test Structures, 2001, pp. 171-176.<\/p>\n<p>J. Kang, X. He, D. Vasileska and D. K. Schroder,<br \/>\n&#8220;Optimization of FIBMOS through 2D Silvaco ATLAS and 2D Monte Carlo particle-based device simulations&#8221;<br \/>\nVLSI Design, Vol. 13, No. 1-4, 2001, pp. 251-256.<\/p>\n<p>F. Duvivier, E. Guichard,<br \/>\n&#8220;Worst-case SPICE model generation for a process in development using ATHENA, ATLAS, UTMOST and SPAYN&#8221;<br \/>\nThe 13th IEEE International Conference on Microelectronics (ICM 2001), pp. 11 -18.<\/p>\n<p>W. Zagozdzon-Wosik, L. Shao, M. Menon, E. Arroyo-Castelazo, I. Rusakova, X. Wang, P. van der Heide, J. Liu, W. K. Chu and J. Bennet,<br \/>\n&#8220;Device and material issues related to integration of junctions with contacts in deep 0.1 \/spl mu\/m MOSFETs&#8221;<br \/>\nAdvanced Thermal Processing of Semiconductors 9th IEEE International Conference on RTP 2001, pp. 82.<\/p>\n<p>Allibert F. Zaslavsky A. Pretet J. Cristoloveanu S.,<br \/>\n&#8220;Double-Gate MOSFETS : Is Gate alignment Mandatory?&#8221;<br \/>\nProc. ESSDERC 2001.<\/p>\n<p>Schwantes S. Krautschneider W.,<br \/>\n&#8220;Relevance of Gate Current for the Functionnality of Deep Submicron CMOS Circuits&#8221;<br \/>\nProc. ESSDERC 2001.<\/p>\n<p>Landgraf E. R\u00f6sner W. Luyken R.J.,<br \/>\n&#8220;High On Current in Quasi Double Gate Transistors with Undoped Channel Region&#8221;<br \/>\nProc. ESSDERC 2001.<\/p>\n<p>D. Y. Chung and J. H. Lee,<br \/>\n&#8220;Design consideration of self-aligned recessed channel (RC) devices in sub-100 nm CMOS technology&#8221;<br \/>\nJournal Korean Phys. Soc., Vol. 37, Nov. 2000, pp. 617 &#8211; 623.<\/p>\n<p>C. W. Liu and T. X. Hsieh,<br \/>\n&#8220;Analytic modeling of the subthreshold behavior in MOSFET&#8221;<br \/>\nSolid-State Electronics, Vol. 44, Issue 9, 1 September 2000, pp. 1707-1710.<\/p>\n<p>C. Fink, K. G. Anil, H. Geiger, W. Hansch, J. Schulze, T. Sulima and I. Eisele,<br \/>\n&#8220;Optimization of breakdown behaviour and short channel effects in MBE-grown vertical MOS-devices with local channel doping&#8221;<br \/>\nThin Solid Films, Vol. 369, Issues 1-2, 3 July 2000, pp. 383-386<\/p>\n<p>J. Kang, J, X. He, D Vasileska, D.K. Schroder,<br \/>\n&#8220;Optimization of FIBMOS through 2-D device simulations&#8221;<br \/>\nBook of Abstracts. IWCE Glasgow 2000. 22-25 May 2000 pp. 87 -88.<\/p>\n<p>S. Williams and K. Varahramyan,<br \/>\n&#8220;New TCAD-based statistical methodology for the optimization and sensitivity analysis of semiconductor technologies&#8221;<br \/>\nIEEE Trans. Semiconductor Manufacturing, Vol. 13, May 2000, pp. 208-218.<\/p>\n<p>Yun-Gueon Shin and Jong-Hwa Lee,<br \/>\n&#8220;A study of electrical characteristics and reliability on flash EEPROM cell&#8221;<br \/>\nProceedings of the 4th IEEE Korea-Russia International Symposium on Science and Tech, Vol. 2, 2000.<\/p>\n<p>V. Narayanan et al,<br \/>\n&#8220;Reduction of Metal-Semiconductor Contact Resistance by Embedded Nanocrystals&#8221;<br \/>\nProc. IEDM 2000.<\/p>\n<p>K. G. Anil et al,<br \/>\n&#8220;Role of Inversion Layer Quantization on Sub-Bandgap Impact Ionization in Deep-Sub-Micron n-channel MOSFETs&#8221;<br \/>\nProc. IEDM 2000.<\/p>\n<p>Monfray S. Autran J.L. Jurczak M. Skotnicki T.,<br \/>\n&#8220;Self-Consistent Optimization and Performance Analysis of Double-Gate MOS Transistor&#8221;<br \/>\nProc. ESSDERC 2000, pp. 336-339.<\/p>\n<p>Tsamis C. Tsoukalas D. Tserepi A.and Tsoi E.,<br \/>\n&#8220;The Influenceof Silicon Intersticial Clusters on the Reverse Short Channel Effect&#8221;<br \/>\nProc. ESSDERC 2000, pp. 172-175.<\/p>\n<p>F. Roger et al,<br \/>\n&#8220;New Calibration Method Of Analytical Models For Ion Implantation&#8221;<br \/>\nIWSM 2000, Honolulu, pp. 18-21.<\/p>\n<p>A. Armigliato, R. Balboni, S. Balboni, S. Frabboni, A. Tixier, G. P., Carnevale, P. Colpani, G. Pavia, A. Marmiroli,<br \/>\n&#8220;TEM\/CBED determination of strain in silicon-based submicrometric electronic devices&#8221;<br \/>\nMicron, Vol. 31, Issue 3, June 2000, pp. 203-209.<\/p>\n<p>He, Xiaojiang,<br \/>\n&#8220;Two-dimensional Monte Carlo particle-based simulations of ultra-small MOSFETs&#8221;<br \/>\nMS, Arizona State Univ, 2000, 75 pp. AAT 1398445.<\/p>\n<p>Williams S. and Varahramyan K.,<br \/>\n&#8220;New TCAD-based statistical methodology for the optimization and sensitivity analysis of semiconductor technologies&#8221;<br \/>\nIEEE Transactions on Semiconductor Manufacturing, Vol. 13, Issue 2, May, 2000, pp. 208-218.<\/p>\n<p>A. Inani, R. V. Rao, B. Cheng, J. Woo,<br \/>\n&#8220;Gate Stack architecture analysis and channel engineering in deep sub-micron MOSFETs&#8221;<br \/>\nJapanese Journal of Applied Physics, Part 2: Letters, Vol. 38, Issue 4 B, 1999, pp. 2266-2271.<\/p>\n<p>M. Kataoka, K. Komuro, K. Fujita and A. Taniguchi,<br \/>\n&#8220;Analysis of 0.5 m channel Al\/WSix\/Poly-Si gate performance in high-frequency band Si power MOSFETs with process\/device\/circuit continuous simulation&#8221;<br \/>\nSolid-State Electronics, Vol. 43, Issue 9, September 1999, pp. 1689-1694.<\/p>\n<p>G. Schrag, G. Zelder, H. Kapels and G. Wachutka,<br \/>\n&#8220;Numerical and experimental analysis of distributed electromechanical parasitics in the calibration of a fully BiCMOS-integrated capacitive pressure sensor&#8221;<br \/>\nSensors and Actuators A: Physical, Vol. 76, Issues 1-3, 30 August 1999, pp. 19-25.<\/p>\n<p>D. Munteanu, S. Cristoloveanu, and E. Guichard,<br \/>\n&#8220;Numerical simulation of the pseudo-mosfet characterization technique&#8221;<br \/>\nSolid-State Electronics, 43(3):547-554, March 1999.<\/p>\n<p>G. -F. Dalla Betta, P. Bellutti, M. Boscardin, L. Ferrario, G. Soncini and N. Zorzi,<br \/>\n&#8220;An all-implanted p-channel Si JFET fully compatible with CMOS technology&#8221;<br \/>\nMicroelectronics Journal, Vol. 30, Issue 3, March 1999, pp. 281-285.<\/p>\n<p>J. Moers, et al.,<br \/>\n&#8220;Vertical p-MOSFETs with gate oxide deposition before selective epitaxial growth&#8221;<br \/>\nSolid-State Electronics, Vol. 43, March 1999, pp. 529-535.<\/p>\n<p>A. Inani et al,<br \/>\n&#8220;Capacitance degradation dur to fringing fields in deep sub-micron MOSFETs with high-k gate dielectrics&#8221;<br \/>\nESSDERC 1999, pp. 160-163.<\/p>\n<p>W. Vanderbauwhede et al,<br \/>\n&#8220;Efficient methodologies for statistical characterisation of analogue designs for submicron CMOS technologies&#8221;<br \/>\nESSDERC 1999, pp. 468-471.<\/p>\n<p>Kun. H. To and Jason Woo,<br \/>\n&#8220;60nm T-gate MOSFETs with self-aligned drain extension formed by solid phase diffusion&#8221;<br \/>\nProc. DRC&#8217;99, pp. 24-25.<\/p>\n<p>D. Y. Chung and J. H. Lee,<br \/>\n&#8220;Effects of recess channel (RC) depth in super self-aligned RC nMOSFET&#8217;s for sub-100 nm device technology&#8221;<br \/>\nJournal Korean Phys. Soc., Vol. 33, Nov. 1998, pp. 216 &#8211; 219.<\/p>\n<p>B. Szelag and F. Balestra,<br \/>\n&#8220;Substrate bias dependence of the transconductance of deep submicron silicon NMOSFETs&#8221;<br \/>\nSolid-State Electronics, Vol. 42, October 1998, pp. 1827-1829.<\/p>\n<p>B. Szelag, and F. Balestra,<br \/>\n&#8220;Transconductance enhancement at low temperatures in deep submicrometre MOSFETs&#8221;<br \/>\nElectron Letter, Vol. 34, Sep. 1998, pp. 1793-1794.<\/p>\n<p>W. Hansch, V. Ramgopal Rao, C. Fink, F. Kaesen and I. Eisele,<br \/>\n&#8220;Electric field tailoring in MBE-grown vertical sub-100 nm MOSFETs&#8221;<br \/>\nThin Solid Films, Vol. 321, Issues 1-2, 26 May 1998, pp. 206-214.<\/p>\n<p>B. You and A. Q. Huang,<br \/>\n&#8220;Theoretical limitation of the RBSOA of MOS-controlled thyristors&#8221;<br \/>\nSolid-State Electronics, Vol. 42, Issue 5, May 1998, pp. 785-794.<\/p>\n<p>G. A. Armstrong and Chinmay K. Maiti,<br \/>\n&#8220;Strained-Si channel heterojunction p-mosfets&#8221;<br \/>\nSolid-State Electronics, Vol. 42, Issue 4, April 1998, pp. 487-498.<\/p>\n<p>T. Gaillard, H. Lhermite, O. Bonnaud and K. Kis-Sion,<br \/>\n&#8220;Calibration of polycrystalline silicon deposition and etching machine inside a technological simulator&#8221;<br \/>\nComputational Materials Science, Vol. 11, April 1998, pp. 109-112.<\/p>\n<p>B. Cheng, V. Ramgopal Rao, et al,<br \/>\n&#8220;Realization of 0.1um asymmetric channel MOSFETs with excellent short-channel performance and reliability&#8221;<br \/>\nESSDERC 1998, pp. 520-523.<\/p>\n<p>I. Ban, M. C. Ozturk and E. K. Demirlioglu,<br \/>\n&#8220;Suppression of oxidation-enhanced boron diffusion in silicon by carbon implantation and characterization of MOSFET&#8217;s with carbon implanted channels&#8221;<br \/>\nIEEE Trans. Electron Devices, Vol. 44, Sep. 1997, pp. 1544 &#8211; 1551.<\/p>\n<p>P. A. Clifton, S. J. Lavelle and A. G. O&#8217;Neill,<br \/>\n&#8220;Sub-micron strained Si:SiGe heterostructure MOSFETs&#8221;<br \/>\nMicroelectronics Journal, Vol. 28, Issues 6-7, 9 August 1997, pp. 691-701.<\/p>\n<p>T. Endoh, T. Nakamura and F. Masuoka,<br \/>\n&#8220;An accurate model of fully-depleted surrounding gate transistor (FD-SGT)&#8221;<br \/>\nIEICE Trans. Electron, E80C, Jul. 1997, pp. 905 &#8211; 910.<\/p>\n<p>T. Endoh, T. Nakamura and F. Masuoka,<br \/>\n&#8220;An analytic steady-state current-voltage characteristics of short channel fully-depleted surrounding gate transistor (FD-SGT)&#8221;<br \/>\nIEICE Trans. Electron, E80C, Jul. 1997, pp. 911 &#8211; 917.<\/p>\n<p>C. Leveugle, P. K. Hurley, A. Mathewson, S. Moran, E. Sheehan, A. Kalnitsky, A. Lepert, I. Beinglass and M. Venkatesan,<br \/>\n&#8220;Impact of the polysilicon doping level on the properties of the silicon\/oxide interface in polysilicon\/oxide\/silicon capacitor structures&#8221;<br \/>\nMicroelectronic Engineering, Vol. 36, June 1997, pp. 215-218.<\/p>\n<p>B. Szelag and F. Balestra,<br \/>\n&#8220;On the transconductance enhancement at low temperature in deep submicron MOSFETs&#8221;<br \/>\nProc. ESSDERC&#8217;97, pp. 384-387.<\/p>\n<p>P. Sallagoity, M. Ada-Hanifi and A. Poncet,<br \/>\n&#8220;Cost effective simulation of three dimensional effects in the shallow trench isolation process&#8221;<br \/>\nProc. ESSDERC 1997, pp. 468-471.<\/p>\n<p>A. Sridharan et al,<br \/>\n&#8220;Mechanism of localized charge injection: A technique to characterize gate edge damage in MOS transistors&#8221;<br \/>\nProc. ESSDERC 1997, pp. 560-563.<\/p>\n<p>W. Hansch, V. Ramgopal Rao and I. Eisele,<br \/>\n&#8220;The planar-doped-barrier-FET: MOSFET overcomes conventional limitations&#8221;<br \/>\nProc. ESSDERC 1997, pp. 624-627.<\/p>\n<p>G. Lecarval et al,<br \/>\n&#8220;Methodology for predictive Calibration of TCAD Simulators&#8221;<br \/>\nProc. SISPAD 1997, pp. 177-180.<\/p>\n<p>V. Ramgopal, W. Hansch and I. Eisele,<br \/>\n&#8220;Simulation, Fabrication and Characterisation of High Performance Planar-Doped-Barrier Sub 100nm Channel MOSFETs&#8221;<br \/>\nProc. IEDM, pp. 1997.<\/p>\n<p>P. Fouillat, H. Lapuyade, Y. Maidon and J. P. Dom,<br \/>\n&#8220;Analysis of Latchup susceptibility to internal logical states by using a Laser beam&#8221;<br \/>\nMicroelectronic Engineering, Vol. 31, Issues 1-4, February 1996, pp. 79-86.<\/p>\n<p>P. Sallagoity, M. AdaHanifi, M. Paoli and et al.,<br \/>\n&#8220;Analysis of width edge effects in advanced isolation schemes for deep submicron CMOS technologies&#8221;<br \/>\nIEEE Trans. Electron Devices, Vol. 43, Nov. 1996, pp. 1900-1906.<\/p>\n<p>V. R. Rao, F. Wittmann, H. Gossner and et al.,<br \/>\n&#8220;Hysteresis behavior in 85-nm channel length vertical n-MOSFET&#8217;s grown by MBE&#8221;<br \/>\nIEEE Trans. Electron Devices, Vol. 43, Jun. 1996, pp. 973 &#8211; 976.<\/p>\n<p>E. Vandenbossche,<br \/>\n&#8220;Analysis of S\/D engineering through short channel effect and hot carrier injection behavior in a 0.35um CMOS technology&#8221;<br \/>\nESSDERC 1996, pp. 491-494.<\/p>\n<p>P. A. Clifton,<br \/>\n&#8220;A process for strained silicon n-channel HMOSFETs&#8221;<br \/>\nESSDERC 1996, pp. 519-522.<\/p>\n<p>L. Risch et al.,<br \/>\n&#8220;Channel engineering using RP-CVD epitaxy for high performance CMOS transistors&#8221;<br \/>\nESSDERC 1996, pp. 321-324.<\/p>\n<p>A. Kl,<br \/>\n&#8220;A new analytical method of solving 2D Poisson&#8217;s equation in MOS devices applied to threshold voltage and subthreshold modeling&#8221;<br \/>\nSolid-State Electronics, Vol. 39, December 1996, pp. 1761-1775.<\/p>\n<p>I. Eisele, H. Baumgatner and W. Hansch,<br \/>\n&#8220;Silicon nanostructure devices&#8221;<br \/>\nJournal of Crystal Growth, Vol. 157, Issues 1-4, December 1995, pp. 248-254.<\/p>\n<p>L. Perron et al,<br \/>\n&#8220;Electron Mobility in highly doped MOSFET&#8217;s with standard and nitrided gate oxide&#8221;<br \/>\nProc ESSDERC 95, The Hague, Netherlands, pp. 113-116.<\/p>\n<p>Dr. Bruno Baccus, ISEN and Peter Hopper, Silvaco<br \/>\n&#8221;\u00a0&#8220;ISEN Advanced Diffusion and Oxidation Models Slated for Inclusion in ATHENA &#8220;&#8221;<\/p>\n<p>Michael Duane, Advanced Micro Devices (AMD), FAB 25<br \/>\n&#8221;\u00a0&#8220;A User\u2019s Perspective on Simulator Calibration &#8220;&#8221;<\/p>\n<p>Jarvis B. Jacobs, Dimitri Antoniadis,<br \/>\n&#8220;Channel Profile Engineers for MOSFET\u00b4s with 100 nm Channel Lenghts&#8221;<br \/>\nIEEE Trans on Electron Devices Vol. 42, No. 5, May 1995.<\/p>\n<p>D. Uffmann et al.,<br \/>\n&#8220;Latchup design precautions for 1.0 micron junction isolated CMOS ASICs operating at temperatures up to 525K&#8221;<br \/>\nProc. ESSDERC 1994, pp. 675-678.<\/p>\n<p>G. Le Carval et al.,<br \/>\n&#8220;Advantages of the methodology using DOE and simulation for optimising advanced technologies &#8211; application to a real 0.35um PMOS architecture&#8221;<br \/>\nProc. ESSDERC 1994, pp. 841-844.<\/p>\n<p>T. Skotnicki et al.,<br \/>\n&#8220;A new analog\/digital CAD model for sub-half micron MOSFETs&#8221;<br \/>\nProc. IEDM Tech. Dig., 1994, pp. 165-168.<\/p>\n<\/div><\/section><\/div><div class='av-flex-placeholder'><\/div><div class=\"flex_column av_one_fourth  flex_column_table_cell av-equal-height-column av-align-top av-zero-column-padding   avia-builder-el-3  el_after_av_three_fourth  avia-builder-el-last  \" style='border-radius:0px; '><div  class='avia-builder-widget-area clearfix  avia-builder-el-4  avia-builder-el-no-sibling '><div id=\"nav_menu-28\" class=\"widget clearfix widget_nav_menu\"><div class=\"menu-tcad-published-papers-side-menu-korean-container\"><ul id=\"menu-tcad-published-papers-side-menu-korean\" class=\"menu\"><li id=\"menu-item-25038\" class=\"menu-item menu-item-type-post_type menu-item-object-page menu-item-has-children menu-item-25038\"><a href=\"https:\/\/silvaco.com\/ko\/technical-library\/tcad-published-papers\/\">TCAD &#8211; \uad00\ub828 \ub17c\ubb38<\/a>\n<ul class=\"sub-menu\">\n\t<li id=\"menu-item-34492\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34492\"><a href=\"https:\/\/silvaco.com\/ko\/published-papers\/bipolar-technology\/\">Bipolar Technology<\/a><\/li>\n\t<li id=\"menu-item-34493\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34493\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/cmos-technology\/\">CMOS Technology<\/a><\/li>\n\t<li id=\"menu-item-34494\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34494\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/compound-devices\/\">Compound Devices<\/a><\/li>\n\t<li id=\"menu-item-34495\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34495\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/interconnect-simulation\/\">Interconnect Simulation<\/a><\/li>\n\t<li id=\"menu-item-34496\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34496\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/esd-simulation\/\">ESD Simulation<\/a><\/li>\n\t<li id=\"menu-item-34497\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34497\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/memory-devices\/\">Memory Devices<\/a><\/li>\n\t<li id=\"menu-item-34498\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34498\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/mems\/\">MEMS<\/a><\/li>\n\t<li id=\"menu-item-34499\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34499\"><a href=\"https:\/\/silvaco.com\/ko\/published-papers\/nanoscale-devices\/\">Nanoscale Devices<\/a><\/li>\n\t<li id=\"menu-item-34500\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34500\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/optoelectronics\/\">Optoelectronics<\/a><\/li>\n\t<li id=\"menu-item-34501\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34501\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/organic-device-technology\/\">Organic Device Technology<\/a><\/li>\n\t<li id=\"menu-item-34502\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34502\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/power-device-simulation\/\">Power Device Simulation<\/a><\/li>\n\t<li id=\"menu-item-34503\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34503\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/process-simulation\/\">Process Simulation<\/a><\/li>\n\t<li id=\"menu-item-34504\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34504\"><a href=\"https:\/\/silvaco.com\/ko\/published-papers\/radiation-seu-and-reliability\/\">Radiation, SEU and Reliability<\/a><\/li>\n\t<li id=\"menu-item-34505\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34505\"><a href=\"https:\/\/silvaco.com\/ko\/published-papers\/soi-technology\/\">SOI Technology<\/a><\/li>\n\t<li id=\"menu-item-34506\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34506\"><a href=\"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/solar-cells\/\">Solar Cells<\/a><\/li>\n\t<li id=\"menu-item-34507\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34507\"><a href=\"https:\/\/silvaco.com\/ko\/published-papers\/tft-technology\/\">TFT Technology<\/a><\/li>\n<\/ul>\n<\/li>\n<\/ul><\/div><\/div><\/div><\/div><\/div><!--close column table wrapper. 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