{"id":31709,"date":"2020-02-26T18:24:52","date_gmt":"2020-02-26T18:24:52","guid":{"rendered":"https:\/\/silvaco.com\/%eb%b6%84%eb%a5%98%eb%90%98%ec%a7%80-%ec%95%8a%ec%9d%8c\/esd-simulation\/"},"modified":"2020-02-26T18:24:52","modified_gmt":"2020-02-26T18:24:52","slug":"esd-simulation","status":"publish","type":"post","link":"https:\/\/silvaco.com\/ko\/tcad-ko\/tcad-published-papers-ko\/esd-simulation\/","title":{"rendered":"ESD Simulation"},"content":{"rendered":"<div id='template_overview'  class='avia-section main_color avia-section-small avia-no-border-styling  avia-bg-style-scroll  avia-builder-el-0  el_before_av_section  avia-builder-el-first   container_wrap fullsize' style='background-color: #ffffff;  margin-top:0px; margin-bottom:0px; '  ><div class='container' ><main  role=\"main\" itemprop=\"mainContentOfPage\"  class='template-page content  av-content-full alpha units'><div class='post-entry post-entry-type-page post-entry-31709'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-equal-height-column-flextable -flextable' style='margin-top:20px; margin-bottom:0px; '><div class=\"flex_column av_three_fourth  flex_column_table_cell av-equal-height-column av-align-top first  avia-builder-el-1  el_before_av_one_fourth  avia-builder-el-first  \" style='padding:0px 0px 0px 0px ; border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock  '   itemprop=\"text\" ><h1>ESD Simulation<\/h1>\n<p>The full text for most of these papers may be found at the IEEE website at\u00a0<a href=\"http:\/\/www.ieee.org\/\" target=\"_blank\" rel=\"noopener noreferrer\">www.ieee.org<\/a>.<\/p>\n<p>Guido Notermans, Olivier Quittard, Anco Heringa, \u017deljko Mr\u010darica, Fabrice Blanc, Hans van Zwol, Theo Smedes, Thomas Keller, Peter de Jong,<br \/>\n&#8220;ESD robust high-voltage active clamps&#8221;,<br \/>\nMicroelectronics Reliability, Vol. 49, Issue 12, December 2009, pp. 1433-1439.<\/p>\n<p>J.A. Salcedo, J.J Liou, Z. Liu, J.E. Vinson TCAD,<br \/>\n&#8220;Methodology for Design of SCR Devices for Electrostatic Discharge (ESD) Applications&#8221;,<br \/>\nIEEE Transactions on Electron Devices, Vol. 54, issue 4, April 2007, pp. 822-832.<\/p>\n<p>G. Notermans, O. Quittard, A. Heringa, Z. Mrcarica, F. Blanc, H. van Zwol, T. Smedes, T Keller, and P. de Jong,<br \/>\n&#8220;Designing HV active clamps for HBM robustness&#8221;,<br \/>\n29th Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD), Sept. 2007, pp. 1B.1-1 &#8211; 1B.1-6.<\/p>\n<p>Changkun Park, Seok-Oh Yun, Jeonghu Han, Sang-Hoon Cheon, Jae-Woo Park, and Songcheol Hong,<br \/>\n&#8220;ESD characteristics of GaAs versus silicon diode&#8221;,<br \/>\nGallium Arsenide and Other Semiconductor Application Symposium (EGAAS 2005), Oct. 2005, pp. 273 &#8211; 276.<\/p>\n<p>J. A. Salcedo, J. J. Liou, J. C. Bernier,<br \/>\n&#8220;Design and integration of novel SCR-based devices for ESD protection in CMOS\/BiCMOS technologies&#8221;<br \/>\nIEEE Transactions on Electron Devices, Vol. 52, Issue 12, December 2005, pp. 2682-2689.<\/p>\n<p>Z. Zhu, Y. Hao,<br \/>\n&#8220;Characterization simulation of a deep sub-micron GGNMOSFET under TLP stress&#8221;<br \/>\nPan Tao Ti Hsueh Pao\/Chinese Journal of Semiconductors, Vol. 26, Issue 10, October 2005, pp. 196.<\/p>\n<p>J.-Y. Choi,<br \/>\n&#8220;AC modeling of the ggNMOS ESD protection device&#8221;<br \/>\nETRI Journal, Vol. 27, Issue 5, October 2005, pp. 628-634.<\/p>\n<p>J. -Y. Choi, W. S. Yang, D. Kim, Y. Kim,<br \/>\n&#8220;Thyristor input-protection device suitable for CMOS RF IC&#8217;s&#8221;<br \/>\nAnalog Integrated Circuits and Signal Processing, Vol. 43, Issue 1, April 2005, pp. 5-14.<\/p>\n<p>J. J. Liou and X. Gao,<br \/>\n&#8220;Design and modeling of on-chip electrostatic discharge (ESD) protection structures&#8221;<br \/>\nProceedings of the International Conference on Microelectronics, Vol. 24 II, 2004, pp. 619-624.<\/p>\n<p>A. A. Salman, R. Gauthier, C. Putnam, P. Riess, M. Muhammad, M. Woo, D. E. Ioannou,<br \/>\n&#8220;ESD-induced oxide breakdown on self-protecting GG-nMOSFET in 0.1-&#8221;<br \/>\nIEEE Transactions on Device and Materials Reliability, Vol. 3, Issue 3, September 2003, pp. 79.<\/p>\n<p>X. Gao, J. J. Liou, W. Wong, S. Vishwanathan,<br \/>\n&#8220;An improved electrostatic discharge protection structure for reducing triggering voltage and parasitic capacitance&#8221;<br \/>\nSolid-State Electronics, Vol. 47, June 2003, pp. 1105-1110.<\/p>\n<p>X. Gao, J. J. Liou, J. Bernier, G. Croft, W. Wong, S. Vishwanathan,<br \/>\n&#8220;Optimization of on-chip ESD protection structures for minimal parasitic capacitance&#8221;<br \/>\nMicroelectronics Reliability, Vol. 43, May 2003, pp. 725-733.<\/p>\n<p>A. Guilhaume, P. Galy, J. P. Chante, B. Foucher, S. Bardy, F. Blanc,<br \/>\n&#8220;ESD evaluation of a low voltage triggering SCR (LVTSCR) device submitted to transmission line pulse (TLP) test&#8221;<br \/>\nJournal of Electrostatics, Vol. 56, October 2002, pp. 281-294.<\/p>\n<p>A. Salman, R. Gauthier, E. Wu, P. Riess, C. Putnam, M. Muhammad, M. Woo, D. Ioannou,<br \/>\n&#8220;Electrostatic discharge induced oxide breakdown characterization in a 0.1&#8221;<br \/>\nAnnual Proceedings &#8211; Reliability Physics (Symposium), 2002, pp. 170-174.<\/p>\n<p>Gianluca Boselli, Stan Meeuwsen, Ton Mouthaan and Fred Kuper,<br \/>\n&#8220;Investigations on double-diffused MOS transistors under ESD zap conditions&#8221;<br \/>\nMicroelectronics Reliability, Vol. 41, Issue 3, March 2001, pp. 395-405.<\/p>\n<p>A. Guilhaume et al,<br \/>\n&#8220;Simulation and experimental comparison of GGNMOS and LVTSCR protection cells under ElectroStatic Discharges&#8221;<br \/>\nESREF 2001, pp. 1433-1437.<\/p>\n<p>J. C. Lee, A. Hoque, G. D. Croft, J. J. Liou, R. Young and J. C. Bernier,<br \/>\n&#8220;An electrostatic discharge failure mechanism in semiconductor devices, with applications to electrostatic discharge measurements using transmission line pulsing technique&#8221;<br \/>\nSolid-State Electronics, Vol. 44, Issue 10, 1 October 2000, pp. 1771-1781.<\/p>\n<p>Kevin Palser, Ann Concannon, Ray Duffy and Alan Mathewson,<br \/>\n&#8220;Analysis of external latch-up protection test structure design using numerical simulation&#8221;<br \/>\nMicroelectronics and Reliability, Vol. 39, Issue 5, May 1999, pp. 647-659.<\/p>\n<p>Kyuhyung Kwon et al,<br \/>\n&#8220;A Novel ESD Protection Technique for Submicron CMOS\/BiCMOS Technologies&#8221;<br \/>\nProc. EOS\/ESD Symposium, 1995, pp. 21-26.<\/p>\n<p>Freydin, Strachan,<br \/>\n&#8220;Simulation of Electrothermal Interactions in ESD Protection Devices&#8221;<br \/>\nIn-house paper, 1994.<\/p>\n<p>Hellstrom, Freydin, Velmre, Uda,<br \/>\n&#8220;Numerical Simulation of Electrothermal Effects in ESD Protection Devices&#8221;<br \/>\nESREF, 1992.<\/p>\n<p>Freydin, Velmre, Udal,<br \/>\n&#8220;Numerical Simulation of Electrothermal Interactions in Semiconductor Devices Experiencing ESD Pulses&#8221;<br \/>\nPro. 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