{"id":29871,"date":"2020-02-26T18:36:08","date_gmt":"2020-02-26T18:36:08","guid":{"rendered":"https:\/\/silvaco.com\/uncategorized\/memory-devices\/"},"modified":"2020-02-26T18:36:08","modified_gmt":"2020-02-26T18:36:08","slug":"memory-devices","status":"publish","type":"post","link":"https:\/\/silvaco.com\/ja\/published-papers\/memory-devices\/","title":{"rendered":"Memory Devices"},"content":{"rendered":"<div id='template_overview'  class='avia-section main_color avia-section-small avia-no-border-styling  avia-bg-style-scroll  avia-builder-el-0  el_before_av_section  avia-builder-el-first   container_wrap fullsize' style='background-color: #ffffff;  margin-top:0px; margin-bottom:0px; '  ><div class='container' ><main  role=\"main\" itemprop=\"mainContentOfPage\"  class='template-page content  av-content-full alpha units'><div class='post-entry post-entry-type-page post-entry-29871'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-equal-height-column-flextable -flextable' style='margin-top:20px; margin-bottom:0px; '><div class=\"flex_column av_three_fourth  flex_column_table_cell av-equal-height-column av-align-top first  avia-builder-el-1  el_before_av_one_fourth  avia-builder-el-first  \" style='padding:0px 0px 0px 0px ; border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/BlogPosting\" itemprop=\"blogPost\" ><div class='avia_textblock  '   itemprop=\"text\" ><h1>Memory Devices<\/h1>\n<p>The full text for most of these papers may be found at the IEEE website at\u00a0<a href=\"http:\/\/www.ieee.org\/\" target=\"_blank\" rel=\"noopener noreferrer\">www.ieee.org<\/a>.<\/p>\n<p>Daewoong Kang, Hyungcheol Shin,<br \/>\n&#8220;Improving the cell characteristics using arch-active profile in NAND flash memory having 60 nm design-rule&#8221;,<br \/>\nSolid-State Electronics, Vol. 54, Issue 11, November 2010, pp. 1263-1268.<\/p>\n<p>Seongjae Cho, Jung-Dal Choi, Byung-Gook Park, Il Hwan Cho,<br \/>\n&#8220;Effects of channel doping concentration and fin dimension variation on self-boosting of channel potential in NAND-type SONOS flash memory array based on bulk-FinFETs&#8221;,<br \/>\nCurrent Applied Physics, Vol. 10, Issue 4, July 2010, pp. 1096-1102.<\/p>\n<p>M.A. Garcia-Ramirez, Yoshishige Tsuchiya, Hiroshi Mizuta,<br \/>\n&#8220;Hybrid circuit analysis of a suspended gate silicon nanodot memory (SGSNM) cell&#8221;,<br \/>\nMicroelectronic Engineering, Vol. 87, Issues 5-8, May-August 2010, pp. 1284-1286.<\/p>\n<p>Kyoung-Rok Han, Min-Kyu Jeong, Ilwhan Cho, Jong-Ho Lee,<br \/>\n&#8220;5-bit\/cell Characteristics using mixed program\/erase mechanism in recessed channel non-volatile memory cells&#8221;,<br \/>\nCurrent Applied Physics, Vol. 10, Issue 1, Supplement 1, January 2010, pp. e2-e4.<\/p>\n<p>A. Abdul Aziz, N. Soin,<br \/>\n&#8220;Dependency of threshold voltage on floating gate and inter-polysilicon dielectric thickness for nonvolatile memory devices&#8221;,<br \/>\n2010 IEEE International Conference on Semiconductor Electronics (ICSE), 2010, pp. 83 &#8211; 87.<\/p>\n<p>A. Yesayan, N. Chevillon, F. Pr\u00e9galdiny, C. Lallement,<br \/>\n&#8220;Compact physics-based model for ultrashort FinFETs&#8221;,<br \/>\n2010 Proceedings of the 17th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES), 2010, pp. 75 &#8211; 80.<\/p>\n<p>Seongjae Cho, Jung Hoon Lee, Shinichi O\u2019uchi, Kazuhiko Endo, Meishoku Masahara, Byung-Gook Park,<br \/>\n&#8220;Design of SOI FinFET on 32 nm technology node for low standby power (LSTP) operation considering gate-induced drain leakage (GIDL)&#8221;,<br \/>\nSolid-State Electronics, Vol. 54, Issue 10, October 2010, pp. 1060-1065.<\/p>\n<p>M. Moreau, D. Munteanu, J.L. Autran,<br \/>\n&#8220;Simulation study of Short-Channel Effects and quantum confinement in double-gate FinFET devices with high-mobility materials&#8221;,<br \/>\nMicroelectronic Engineering, In Press, Corrected Proof, Available online 6 September 2010.<\/p>\n<p>M.A. Pavanello, J.A. Martino, E. Simoen, C. Claeys,<br \/>\n&#8220;Cryogenic operation of FinFETs aiming at analog applications&#8221;,<br \/>\nCryogenics, Vol. 49, Issue 11, November 2009, pp. 590-594.<\/p>\n<p>Yoon Kim, Seongjae Cho, Gil Sung Lee, Il Han Park, Jong Duk Lee, Hyungcheol Shin, Byung-Gook Park,<br \/>\n&#8220;3-dimensional terraced NAND (3D TNAND) flash memory-stacked version of folded NAND array&#8221;,<br \/>\nIEICE Transactions on Electronics, Vol. E92-C, Issue 5, May 2009, pp. 653-658.<\/p>\n<p>Shin-ichi O\u2019uchi, Kazuhiko Endo, Meishoku Masahara, Kunihiro Sakamoto, Yongxun Liu, Takashi Matsukawa, Toshihiro Sekigawa, Hanpei Koike, Eiichi Suzuki,<br \/>\n&#8220;Flex-pass-gate SRAM for static noise margin enhancement using FinFET-based technology&#8221;,<br \/>\nSolid-State Electronics, Vol. 52, Issue 11, November 2008, pp. 1694-1702.<\/p>\n<p>Jang-Gn Yun, Yoon Kim, Il Han Park, Jung Hoon Lee, Sangwoo Kang, Dong-Hua Lee, Seongjae Cho, Doo-Hyun Kim, Gil Sung Lee, Won-Bo Sim, Younghwan Son, Hyungcheol Shin, Jong Duk Lee, Byung-Gook Park,<br \/>\n&#8220;Fabrication and characterization of fin SONOS flash memory with separated double-gate structure&#8221;,<br \/>\nSolid-State Electronics, Vol. 52, Issue 10, October 2008, pp. 1498-1504.<\/p>\n<p>Mohammad Gh. Mohammad, Kewal K. Saluja,<br \/>\n&#8220;Analysis and test procedures for NOR flash memory defects&#8221;,<br \/>\nMicroelectronics Reliability, Vol. 48, Issue 5, May 2008, pp. 698-709.<\/p>\n<p>P. Magnone, V. Subramanian, B. Parvais, A. Mercha, C. Pace, M. Dehan, S. Decoutere, G. Groeseneken, F. Crupi, S. Pierro,<br \/>\n&#8220;Gate Vol.tage and geometry dependence of the series resistance and of the carrier mobility in FinFET devices&#8221;,<br \/>\nMicroelectronic Engineering, Vol. 85, Issue 8, August 2008, pp. 1728-1731.<\/p>\n<p>A. Kranti, et.al.,<br \/>\n&#8220;Optimizing FinFET geometry and parasitics for RF applications&#8221;,<br \/>\nIEEE International SOI Conference, 2008, pp.123-124, Oct. 2008.<\/p>\n<p>Ismail Saad, Razali Ismail,<br \/>\n&#8220;Self-aligned vertical double-gate MOSFET (VDGM) with the oblique rotating ion implantation (ORI) method&#8221;,<br \/>\nMicroelectronics Journal, In Press, Corrected Proof, Available online 7 May 2008.<\/p>\n<p>L. Perniola, J. Razafi ndramora, P. Scheiblin, F. Daug\u00b4e, C. Jahan, B. De Salvo, G. Reimbold, F. Boulanger,<br \/>\n&#8220;A Semi-Analytical Model for the Subthreshold Behavior of FinFLASH Structures&#8221;,<br \/>\nCEA-LETI 17, Rue des Martyrs, F &#8211; 38054, Grenoble, France, luca.perniola@cea.fr<br \/>\nG. Ghibaudo INP Grenoble MINATEC 3, Parvis Louis N\u00b4eel, BP 257, 38016 Grenoble Cedex 1<\/p>\n<p>S. Jacob\u00a0<sup>1, 2<\/sup>, L. Perniola<sup>1<\/sup>, P. Scheiblin<sup>1<\/sup>, B. De Salvo<sup>1<\/sup>, G. Lecarval<sup>1<\/sup>, E. Jalaguier<sup>1<\/sup>, G. Festes<sup>2<\/sup>, R. Coppard<sup>2<\/sup>, F. Boulanger<sup>1<\/sup>, S. Deleonibus<sup>1<\/sup>,<br \/>\n&#8220;TCAD Modeling and Data of NOR Nanocrystal Memories&#8221;,<sup><br \/>\n1<\/sup>CEA-LETI, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France, stephanie.jacob@cea.fr<br \/>\n<sup>2<\/sup>ATMEL Rousset, Zone industrielle, 13790 Rousset, France<\/p>\n<p>A. Kranti et al.,<br \/>\n&#8220;Significance of gate underlap architecture in FinFETs for low\u2013Vol.tage Analog\/RF applications&#8221;,<br \/>\n211th Electrochemical Society Meeting (Chicago, USA), In Proc. ECS Transactions (SOI Device Technology), Vol. 6, Issue 4, pp. 375-380, 2007.<\/p>\n<p>J. Yu, K. Aflatooni,<br \/>\n&#8220;Leakage current in DRAM memory cell&#8221;,<br \/>\n2006 16th Biennial University \/ Goverment \/ Industry Microelectronics Symposium, 2007, pp. 191-194.<\/p>\n<p>Byung-Kil Choi, Kyoung-Rok Han, Young Min Kim, Young June Park, Jong-Ho Lee,<br \/>\n&#8220;Threshold-Voltage Modeling of Body-Tied FinFETs (Bulk FinFETs) Electron Devices&#8221;<br \/>\nIEEE Transactions on Vol. 54, Issue 3, March 2007 pp. 537 &#8211; 545.<\/p>\n<p>A. Kranti et al.,<br \/>\n&#8220;Comparative analysis of nanoscale MOS device architectures for RF applications&#8221;,<br \/>\nSemiconductor Science and Technology, Vol. 22, No. 5, pp. 481-491, 2007.<\/p>\n<p>Hiroaki Yamazaki, Hiroki Nakamura, Hiroshi Sakuraba, Fujio Masuoka,<br \/>\n&#8220;Analysis of the subthreshold characteristics for the FC-SGT flash memory cell&#8221;,<br \/>\nElectronics and Communications in Japan (Part II: Electronics), Vol. 89, Issue 8, August 2006, pp. 34-41.<\/p>\n<p>Kuk-Hwan KIM, Hyunjin LEE, and Yang-Kyu CHOI,<br \/>\n&#8220;Novel Structures for a 2-Bit per Cell of Nonvolatile Memory Using an Asymmetric Double Gate&#8221;<br \/>\nIEICE Transaction on Electronics, Vol. E89-C, NO.5 MAY 2006.<\/p>\n<p>A. Kranti et al.,<br \/>\n&#8220;Device design considerations for nanoscale double and triple gate FinFETs&#8221;,<br \/>\nIn Proc. 2005 IEEE SOI Conference, Honolulu, Hawaii, USA, pp. 96-98, 2005.<\/p>\n<p>R. Duane, M. F. Beug, A. Mathewson,<br \/>\n&#8220;Novel capacitance coupling coefficient measurement methodology for floating gate nonvolatile memory devices&#8221;<br \/>\nIEEE Electron Device Letters, Vol. 26, Issue 7, July 2005, pp. 507-509.<\/p>\n<p>L. Perniola, S. Bernardini, G. Iannaccone, P. Masson, B. De Salvo, G. Ghibaudo, C. Gerardi,<br \/>\n&#8220;Analytical model of the effects of a nonuniform distribution of stored charge on the electrical characteristics of discrete-trap nonvolatile memories&#8221;<br \/>\nIEEE Transactions on Nanotechnology, Vol. 4, Issue 3, May 2005, pp. 360-368.<\/p>\n<p>L. Perniola<sup>1,2<\/sup>*, S. Bernardini<sup>3<\/sup>, G. Iannaccone<sup>1, 6<\/sup>, B. De Salvo\u00a0<sup>4<\/sup>, G. Ghibaudo<sup>2<\/sup>, P. Masson<sup>3<\/sup>, C. Gerardi<sup>5<\/sup>,<br \/>\n&#8220;Electrostatic Effect of Localized Charge in Dual Bit Memory Cells with DiscreteTraps&#8221;,<br \/>\n<sup>1<\/sup>Dipartimento di Ingegneria dell\u2019Informazione, Universit\u00e0 degli Studi di Pisa, Via Caruso, 56122 Pisa, Italy, *perniola@enserg.fr<br \/>\n<sup>2<\/sup>IMEP-CNRS\/INPG, Avenue de Martyrs 32, 38016 Grenoble, France<br \/>\n<sup>3<\/sup>L2MP-Polytech \u2013 IMT Technop\u00f4le de Ch\u00e2teau Gombert, 13451 Marseille Cedex 20 France<br \/>\n<sup>4<\/sup>CEA-LETI, Avenue de Martyrs 16, 38054 Grenoble, France<br \/>\n<sup>5<\/sup>STMicroelectronics, Catania, Italy<br \/>\n<sup>6<\/sup>IEIIT-CNR, Via Caruso, 56122 Pisa, Italy.<\/p>\n<p>A. Gorur-Seetharam, C. Lee, E. C. Kan,<br \/>\n&#8220;The effect of gate geometry on the charging characteristics of metal nanocrystal memories&#8221;<br \/>\nMaterials Research Society Symposium &#8211; Proceedings, Vol. 789, 2003, pp. 71-76.<\/p>\n<p>M. Hahad, P. Hopper,<br \/>\n&#8220;High performance semiconductor device simulation on shared memory parallel computers&#8221;<br \/>\nSISPAD Sept. 2-4, 1996 pp. 137 -138.<\/p>\n<p>Chimoon Huang and Tahui Wang,<br \/>\n&#8220;Transient simulation of EPROM writing characteristics, with a novel hot electron injection model&#8221;<br \/>\nSolid-State Electronics, Vol. 38, Issue 2, February 1995, pp. 461-464.<\/p>\n<\/div><\/section><\/div><div class='av-flex-placeholder'><\/div><div class=\"flex_column av_one_fourth  flex_column_table_cell av-equal-height-column av-align-top av-zero-column-padding   avia-builder-el-3  el_after_av_three_fourth  avia-builder-el-last  \" style='border-radius:0px; '><div  class='avia-builder-widget-area clearfix  avia-builder-el-4  avia-builder-el-no-sibling '><div id=\"nav_menu-28\" class=\"widget clearfix widget_nav_menu\"><div class=\"menu-tcad-published-papers-side-menu-japanese-container\"><ul id=\"menu-tcad-published-papers-side-menu-japanese\" class=\"menu\"><li id=\"menu-item-25134\" class=\"menu-item menu-item-type-post_type menu-item-object-page menu-item-has-children menu-item-25134\"><a href=\"https:\/\/silvaco.com\/ja\/support\/technical-library\/tcad-published-papers\/\">TCAD &#8211; \u516c\u958b\u8ad6\u6587<\/a>\n<ul class=\"sub-menu\">\n\t<li id=\"menu-item-34476\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34476\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/bipolar-technology\/\">Bipolar Technology<\/a><\/li>\n\t<li id=\"menu-item-34477\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34477\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/cmos-technology\/\">CMOS Technology<\/a><\/li>\n\t<li id=\"menu-item-34478\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34478\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/compound-devices\">Compound Devices<\/a><\/li>\n\t<li id=\"menu-item-34479\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34479\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/interconnect-simulation\/\">Interconnect Simulation<\/a><\/li>\n\t<li id=\"menu-item-34480\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34480\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/esd-simulation\/\">ESD Simulation<\/a><\/li>\n\t<li id=\"menu-item-34481\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34481\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/memory-devices\/\">Memory Devices<\/a><\/li>\n\t<li id=\"menu-item-34482\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34482\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/mems\/\">MEMS<\/a><\/li>\n\t<li id=\"menu-item-34483\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34483\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/nanoscale-devices\/\">Nanoscale Devices<\/a><\/li>\n\t<li id=\"menu-item-34484\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34484\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/optoelectronics\/\">Optoelectronics<\/a><\/li>\n\t<li id=\"menu-item-34485\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34485\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/organic-device-technology\/\">Organic Device Technology<\/a><\/li>\n\t<li id=\"menu-item-34486\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34486\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/power-device-simulation\/\">Power Device Simulation<\/a><\/li>\n\t<li id=\"menu-item-34487\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34487\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/process-simulation\">Process Simulation<\/a><\/li>\n\t<li id=\"menu-item-34488\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34488\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/radiation-seu-and-reliability\/\">Radiation, SEU and Reliability<\/a><\/li>\n\t<li id=\"menu-item-34489\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34489\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/soi-technology\/\">SOI Technology<\/a><\/li>\n\t<li id=\"menu-item-34490\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34490\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/solar-cells\/\">Solar Cells<\/a><\/li>\n\t<li id=\"menu-item-34491\" class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-34491\"><a href=\"https:\/\/silvaco.com\/ja\/published-papers\/tft-technology\/\">TFT Technology<\/a><\/li>\n<\/ul>\n<\/li>\n<\/ul><\/div><\/div><\/div><\/div><\/div><!--close column table wrapper. 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