{"id":29868,"date":"2020-02-26T19:05:55","date_gmt":"2020-02-26T19:05:55","guid":{"rendered":"https:\/\/silvaco.com\/uncategorized\/mems\/"},"modified":"2026-10-15T14:59:45","modified_gmt":"2026-10-15T21:59:45","slug":"mems","status":"publish","type":"post","link":"https:\/\/silvaco.com\/ja\/tcad-ja\/tcad-published-papers-ja\/mems\/","title":{"rendered":"MEMS"},"content":{"rendered":"

The full text for most of these papers may be found at the IEEE website at\u00a0www.ieee.org<\/a>.<\/p>\n

Yonghyun Shim, Member, IEEE, Jean-Pierre Raskin, Member, IEEE, C\u00e9sar Roda Neve, Member, IEEE, and Mina Rais-Zadeh, Senior Member, IEEE
\n“RF MEMS Passives on High-Resistivity Silicon Substrates”
\nIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 23, NO. 12, DECEMBER 2013<\/p>\n

A. Baharin, M. R. Hashim,
\n“Study of electrical characteristics of Ge islands MSM photodetector structure grown on Si substrate using conventional methods”
\nSemiconductor Science and Technology, Vol. 22, No. 8, Aug. 2007, pp. 905-910.<\/p>\n

T. Schmidt, K. Hahna, T. Binderc, J. Poppb, A. Wagener, R. Br\u00fcck,
\n“Optimization of MEMS fabrication process design by virtual experiments”
\nProceedings of SPIE – The International Society for Optical Engineering Vol. 5-8 Dec. 20, 2006<\/p>\n

Yong Qing Fu1<\/sup>, Jack Luo1<\/sup>, Stuart Milne1<\/sup>, Andrew Flewitt1<\/sup>, Ahmed Nejim2<\/sup>
\n“Process Flow Simulation and Manufacture of Variable RF MEMS Capacitors\u00a0“,
\n1<\/sup>Engineering Department, University of Cambridge, Cambridge UK
\n2<\/sup>Silvaco, St Ives, Cambridgeshire PE27 5JL, UK<\/p>\n

T. Bourouina, T. Masuzawa, H. Fujita,
\n“The MEMSNAS process: Microloading effect for micromachining 3-D structures of nearly all shapes”
\nJournal of Microelectromechanical Systems, Vol. 13, Issue 2, April 2004, pp. 190-199.<\/p>\n","protected":false},"excerpt":{"rendered":"

The full text for most of these papers may be found at the IEEE website at\u00a0www.ieee.org. Yonghyun Shim, Member, IEEE, Jean-Pierre Raskin, Member, IEEE, C\u00e9sar Roda Neve, Member, IEEE, and Mina Rais-Zadeh, Senior Member, IEEE “RF MEMS Passives on High-Resistivity Silicon Substrates” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 23, NO. 12, DECEMBER 2013 A. […]<\/p>\n","protected":false},"author":12,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"inline_featured_image":false,"footnotes":""},"categories":[7627,7625,7911],"tags":[],"class_list":["post-29868","post","type-post","status-publish","format-standard","hentry","category-mems-ja","category-tcad-published-papers-ja","category-technical-libraries","entry"],"yoast_head":"\nMEMS - Silvaco<\/title>\n<meta name=\"description\" content=\"Published papers on MEMS\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/silvaco.com\/ja\/tcad-ja\/tcad-published-papers-ja\/mems\/\" \/>\n<meta property=\"og:locale\" content=\"ja_JP\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"MEMS\" \/>\n<meta property=\"og:description\" content=\"Published papers on MEMS\" \/>\n<meta property=\"og:url\" content=\"https:\/\/silvaco.com\/ja\/tcad-ja\/tcad-published-papers-ja\/mems\/\" \/>\n<meta property=\"og:site_name\" content=\"Silvaco\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/SilvacoSoftware\/\" \/>\n<meta property=\"article:published_time\" content=\"2020-02-26T19:05:55+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-10-15T21:59:45+00:00\" \/>\n<meta name=\"author\" content=\"Casey Molver\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@SilvacoSoftware\" \/>\n<meta name=\"twitter:site\" content=\"@SilvacoSoftware\" \/>\n<meta name=\"twitter:label1\" content=\"\u57f7\u7b46\u8005\" \/>\n\t<meta name=\"twitter:data1\" content=\"Casey Molver\" \/>\n\t<meta name=\"twitter:label2\" content=\"\u63a8\u5b9a\u8aad\u307f\u53d6\u308a\u6642\u9593\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/silvaco.com\\\/ja\\\/tcad-ja\\\/tcad-published-papers-ja\\\/mems\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/silvaco.com\\\/ja\\\/tcad-ja\\\/tcad-published-papers-ja\\\/mems\\\/\"},\"author\":{\"name\":\"Casey Molver\",\"@id\":\"https:\\\/\\\/silvaco.com\\\/#\\\/schema\\\/person\\\/2763eb741ca5ac04477fdff50ed84c80\"},\"headline\":\"MEMS\",\"datePublished\":\"2020-02-26T19:05:55+00:00\",\"dateModified\":\"2026-10-15T21:59:45+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/silvaco.com\\\/ja\\\/tcad-ja\\\/tcad-published-papers-ja\\\/mems\\\/\"},\"wordCount\":185,\"articleSection\":[\"MEMS\",\"TCAD Published Papers\",\"Technical Libraries\"],\"inLanguage\":\"ja\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/silvaco.com\\\/ja\\\/tcad-ja\\\/tcad-published-papers-ja\\\/mems\\\/\",\"url\":\"https:\\\/\\\/silvaco.com\\\/ja\\\/tcad-ja\\\/tcad-published-papers-ja\\\/mems\\\/\",\"name\":\"MEMS - 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