{"id":26162,"date":"2020-04-21T19:38:15","date_gmt":"2020-04-21T19:38:15","guid":{"rendered":"https:\/\/silvaco.com\/tcad-blogs-2\/"},"modified":"2021-06-24T00:58:21","modified_gmt":"2021-06-24T07:58:21","slug":"tcad-blogs-2","status":"publish","type":"page","link":"https:\/\/silvaco.com\/ja\/tcad-blogs-2\/","title":{"rendered":"TCAD Blogs"},"content":{"rendered":"<div id='template_slider'  class='avia-fullwidth-slider main_color avia-shadow   avia-builder-el-0  el_before_av_three_fourth  avia-builder-el-first   container_wrap fullsize' style=' '  ><div   data-size='no scaling'  data-lightbox_size='large'  data-animation='slide'  data-conditional_play=''  data-ids='6282'  data-video_counter='0'  data-autoplay='false'  data-bg_slider='false'  data-slide_height=''  data-handle='av_slideshow_full'  data-interval='5'  data-class=' '  data-el_id=''  data-css_id=''  data-scroll_down=''  data-control_layout='av-control-default'  data-custom_markup=''  data-perma_caption=''  data-autoplay_stopper=''  data-image_attachment=''  data-min_height='110px'  data-lazy_loading='disabled'  data-src=''  data-position='top left'  data-repeat='no-repeat'  data-attach='scroll'  data-stretch=''  class='avia-slideshow avia-slideshow-1  av-control-default av-default-height-applied avia-slideshow-no scaling av_slideshow_full   avia-slide-slider '  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" ><ul class='avia-slideshow-inner ' style='padding-bottom: 10.46875%;' ><li  class=' av-single-slide slide-1 ' ><div data-rel='slideshow-1' class='avia-slide-wrap '   ><div class = \"caption_fullwidth av-slideshow-caption caption_bottom\"><div class = \"container caption_container\"><div class = \"slideshow_caption\"><div class = \"slideshow_inner_caption\"><div class = \"slideshow_align_caption\"><h2  style='font-size:50px; ' class='avia-caption-title   av-medium-font-size-overwrite av-medium-font-size-50 av-small-font-size-overwrite av-small-font-size-30 av-mini-font-size-overwrite av-mini-font-size-18'  itemprop=\"name\" >TCAD Blogs<\/h2><\/div><\/div><\/div><\/div><\/div><img decoding=\"async\" class=\"wp-image-19934 avia-img-lazy-loading-not-19934\"  src=\"https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03.jpg\" width=\"1920\" height=\"201\" title='Blogs03' alt=''  itemprop=\"thumbnailUrl\"  style='min-height:110px; min-width:1051px; ' srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03.jpg 1920w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-300x31.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-1030x108.jpg 1030w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-768x80.jpg 768w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-1536x161.jpg 1536w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-1500x157.jpg 1500w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-705x74.jpg 705w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-43x5.jpg 43w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-63x7.jpg 63w, https:\/\/silvaco.com\/wp-content\/uploads\/_Banners\/Blogs03-48x5.jpg 48w\" sizes=\"(max-width: 1920px) 100vw, 1920px\" \/><\/div><\/li><\/ul><\/div><\/div><div id='after_full_slider_1'  class='main_color av_default_container_wrap container_wrap fullsize' style=' '  ><div class='container' ><div class='template-page content  av-content-full alpha units'><div class='post-entry post-entry-type-page post-entry-26162'><div class='entry-content-wrapper clearfix'>\n<div class=\"flex_column av_three_fourth  flex_column_div av-zero-column-padding first  avia-builder-el-1  el_after_av_slideshow_full  el_before_av_one_fourth  avia-builder-el-first  \" style='border-radius:0px; ' id=\"corporate_blogs\" ><div   data-autoplay=''  data-interval='5'  data-animation='fade'  data-show_slide_delay='90'  class='avia-content-slider avia-content-grid-active avia-content-slider1 avia-content-slider-odd  avia-builder-el-2  avia-builder-el-no-sibling  '  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Blog\" ><div class='avia-content-slider-inner'><div class='slide-entry-wrap'><article class='slide-entry flex_column  post-entry post-entry-29831 slide-entry-overview slide-loop-1 slide-parity-odd  av_fullwidth first real-thumbnail post-format-standard'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><a href='https:\/\/silvaco.com\/ja\/blog\/silvaco-at-upcoming-solid-state-conferences-essderc-2020-and-sispad-2020\/' data-rel='slide-1' class='slide-image' title='Silvaco at Upcoming Solid-State Conferences &#8211; ESSDERC 2020 and SISPAD 2020'><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg\" class=\"wp-image-20264 avia-img-lazy-loading-not-20264 attachment-large size-large wp-post-image\" alt=\"\" srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg 500w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-300x300.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-80x80.jpg 80w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-36x36.jpg 36w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-180x180.jpg 180w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-37x37.jpg 37w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-55x55.jpg 55w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-48x48.jpg 48w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><div class='slide-content'><header class=\"entry-content-header\"><h3 class='slide-entry-title entry-title '  itemprop=\"headline\" ><a href='https:\/\/silvaco.com\/ja\/blog\/silvaco-at-upcoming-solid-state-conferences-essderc-2020-and-sispad-2020\/' title='Silvaco at Upcoming Solid-State Conferences &#8211; ESSDERC 2020 and SISPAD 2020'>Silvaco at Upcoming Solid-State Conferences &#8211; ESSDERC 2020 and SISPAD 2020<\/a><\/h3><span class=\"av-vertical-delimiter\"><\/span><\/header><div class='slide-meta'><time class='slide-meta-time updated'  itemprop=\"datePublished\" datetime=\"2020-09-02T17:59:25-07:00\" >9\u6708 2, 2020<\/time><\/div><div class='slide-entry-excerpt entry-content'  itemprop=\"text\" >Silvaco technologists and research partners will be participating in the ESSDERC\/ESSCIRC 2020 joint conference for solid-state devices and circuits.\u00a0 Tutorial #8, Ab-initio simulations supporting new materials & process developments, chaired by Denis Rideau (STMicroelectronics) and Philippe Blaise (Silvaco), includes a presentation by Dr. Tillmann Kubis of Purdue University. Dr. Kubis is working with Silvaco in the area of atomistic simulation.\u00a0 He will present on \u00a0Atomistic Green\u2019s functions: the beauty of self-energies.<\/div><\/div><footer class=\"entry-footer\"><\/footer><span class='hidden'>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" >\n\t\t\t\t\t\t<span itemprop='url'>https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg<\/span>\n\t\t\t\t\t\t<span itemprop='height'>500<\/span>\n\t\t\t\t\t\t<span itemprop='width'>500<\/span>\n\t\t\t\t<\/span>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"publisher\" itemtype=\"https:\/\/schema.org\/Organization\" itemscope=\"itemscope\" >\n\t\t\t\t\t\t<span itemprop='name'>Graham Bell<\/span>\n\t\t\t\t\t\t<span itemprop='logo' itemscope itemtype='https:\/\/schema.org\/ImageObject'>\n\t\t\t\t\t\t\t<span itemprop='url'>\/wp-content\/uploads\/2019\/11\/silvaco-logo.png<\/span>\n\t\t\t\t\t\t <\/span>\n\t\t\t\t<\/span><span class='av-structured-data'  itemprop=\"author\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Person\" ><span itemprop='name'>Graham Bell<\/span><\/span><span class='av-structured-data'  itemprop=\"datePublished\" datetime=\"2020-04-21T19:38:15-07:00\" >2020-09-02 17:59:25<\/span><span class='av-structured-data'  itemprop=\"dateModified\" itemtype=\"https:\/\/schema.org\/dateModified\" >2020-09-02 17:59:25<\/span><span class='av-structured-data'  itemprop=\"mainEntityOfPage\" itemtype=\"https:\/\/schema.org\/mainEntityOfPage\" ><span itemprop='name'>Silvaco at Upcoming Solid-State Conferences &#8211; ESSDERC 2020 and SISPAD 2020<\/span><\/span><\/span><\/article><\/div><div class='slide-entry-wrap'><article class='slide-entry flex_column  post-entry post-entry-29832 slide-entry-overview slide-loop-2 slide-parity-odd  av_fullwidth first real-thumbnail post-format-standard'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><a href='https:\/\/silvaco.com\/ja\/blog\/accelerating-design-with-the-victory-tcad-suite' data-rel='slide-1' class='slide-image' title='Accelerating Design with the Victory TCAD Suite'><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg\" class=\"wp-image-20264 avia-img-lazy-loading-not-20264 attachment-large size-large wp-post-image\" alt=\"\" srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg 500w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-300x300.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-80x80.jpg 80w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-36x36.jpg 36w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-180x180.jpg 180w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-37x37.jpg 37w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-55x55.jpg 55w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-48x48.jpg 48w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><div class='slide-content'><header class=\"entry-content-header\"><h3 class='slide-entry-title entry-title '  itemprop=\"headline\" ><a href='https:\/\/silvaco.com\/ja\/blog\/accelerating-design-with-the-victory-tcad-suite' title='Accelerating Design with the Victory TCAD Suite'>Accelerating Design with the Victory TCAD Suite<\/a><\/h3><span class=\"av-vertical-delimiter\"><\/span><\/header><div class='slide-meta'><time class='slide-meta-time updated'  itemprop=\"datePublished\" datetime=\"2020-03-30T14:50:35-07:00\" >3\u6708 30, 2020<\/time><\/div><div class='slide-entry-excerpt entry-content'  itemprop=\"text\" >The Simulation Standard, Silvaco\u2019s technical journal for semiconductor process and device engineers is beginning its 30th year of publication. The latest issue  has just been released and it outlines a complete power device design flow using the Victory suite of TCAD simulation solutions \u2013 Victory Process, Victory Mesh, and Victory Device.<\/div><\/div><footer class=\"entry-footer\"><\/footer><span class='hidden'>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" >\n\t\t\t\t\t\t<span itemprop='url'>https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg<\/span>\n\t\t\t\t\t\t<span itemprop='height'>500<\/span>\n\t\t\t\t\t\t<span itemprop='width'>500<\/span>\n\t\t\t\t<\/span>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"publisher\" itemtype=\"https:\/\/schema.org\/Organization\" itemscope=\"itemscope\" >\n\t\t\t\t\t\t<span itemprop='name'>Ingrid Schwarz<\/span>\n\t\t\t\t\t\t<span itemprop='logo' itemscope itemtype='https:\/\/schema.org\/ImageObject'>\n\t\t\t\t\t\t\t<span itemprop='url'>\/wp-content\/uploads\/2019\/11\/silvaco-logo.png<\/span>\n\t\t\t\t\t\t <\/span>\n\t\t\t\t<\/span><span class='av-structured-data'  itemprop=\"author\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Person\" ><span itemprop='name'>Ingrid Schwarz<\/span><\/span><span class='av-structured-data'  itemprop=\"datePublished\" datetime=\"2020-04-21T19:38:15-07:00\" >2020-03-30 14:50:35<\/span><span class='av-structured-data'  itemprop=\"dateModified\" itemtype=\"https:\/\/schema.org\/dateModified\" >2021-08-04 22:21:49<\/span><span class='av-structured-data'  itemprop=\"mainEntityOfPage\" itemtype=\"https:\/\/schema.org\/mainEntityOfPage\" ><span itemprop='name'>Accelerating Design with the Victory TCAD Suite<\/span><\/span><\/span><\/article><\/div><div class='slide-entry-wrap'><article class='slide-entry flex_column  post-entry post-entry-29833 slide-entry-overview slide-loop-3 slide-parity-odd  av_fullwidth first real-thumbnail post-format-standard'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><a href='https:\/\/silvaco.com\/ja\/blog\/tcad-simulations-of-rf-soi-switches-with-trap-rich-substrate\/' data-rel='slide-1' class='slide-image' title='TCAD Simulations of RF-SOI Switches with Trap-Rich Substrate'><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg\" class=\"wp-image-18659 avia-img-lazy-loading-not-18659 attachment-large size-large wp-post-image\" alt=\"\" srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg 500w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-300x300.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-80x80.jpg 80w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-36x36.jpg 36w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-180x180.jpg 180w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-37x37.jpg 37w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-55x55.jpg 55w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-48x48.jpg 48w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><div class='slide-content'><header class=\"entry-content-header\"><h3 class='slide-entry-title entry-title '  itemprop=\"headline\" ><a href='https:\/\/silvaco.com\/ja\/blog\/tcad-simulations-of-rf-soi-switches-with-trap-rich-substrate\/' title='TCAD Simulations of RF-SOI Switches with Trap-Rich Substrate'>TCAD Simulations of RF-SOI Switches with Trap-Rich Substrate<\/a><\/h3><span class=\"av-vertical-delimiter\"><\/span><\/header><div class='slide-meta'><time class='slide-meta-time updated'  itemprop=\"datePublished\" datetime=\"2020-03-02T23:01:41-08:00\" >3\u6708 2, 2020<\/time><\/div><div class='slide-entry-excerpt entry-content'  itemprop=\"text\" >The market for cellular components has been shifting rapidly from GaAs pHEMT or silicon-on-sapphire (SOS) to silicon-based technology. CMOS (silicon-on-insulator) SOI antenna switches which are compatible with multimode GSM\/EDGE, TD\/WCDMA, and LTE systems exhibit higher integration levels and have become the fastest growing mobile phone submarket. CMOS-SOI processes, especially with thin silicon, have the potential to rival the FoM that was traditionally feasible only with GaAs technologies.<\/div><\/div><footer class=\"entry-footer\"><\/footer><span class='hidden'>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" >\n\t\t\t\t\t\t<span itemprop='url'>https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg<\/span>\n\t\t\t\t\t\t<span itemprop='height'>500<\/span>\n\t\t\t\t\t\t<span itemprop='width'>500<\/span>\n\t\t\t\t<\/span>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"publisher\" itemtype=\"https:\/\/schema.org\/Organization\" itemscope=\"itemscope\" >\n\t\t\t\t\t\t<span itemprop='name'>Graham Bell<\/span>\n\t\t\t\t\t\t<span itemprop='logo' itemscope itemtype='https:\/\/schema.org\/ImageObject'>\n\t\t\t\t\t\t\t<span itemprop='url'>\/wp-content\/uploads\/2019\/11\/silvaco-logo.png<\/span>\n\t\t\t\t\t\t <\/span>\n\t\t\t\t<\/span><span class='av-structured-data'  itemprop=\"author\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Person\" ><span itemprop='name'>Graham Bell<\/span><\/span><span class='av-structured-data'  itemprop=\"datePublished\" datetime=\"2020-04-21T19:38:15-07:00\" >2020-03-02 23:01:41<\/span><span class='av-structured-data'  itemprop=\"dateModified\" itemtype=\"https:\/\/schema.org\/dateModified\" >2021-08-04 22:22:23<\/span><span class='av-structured-data'  itemprop=\"mainEntityOfPage\" itemtype=\"https:\/\/schema.org\/mainEntityOfPage\" ><span itemprop='name'>TCAD Simulations of RF-SOI Switches with Trap-Rich Substrate<\/span><\/span><\/span><\/article><\/div><div class='slide-entry-wrap'><article class='slide-entry flex_column  post-entry post-entry-29834 slide-entry-overview slide-loop-4 slide-parity-odd  av_fullwidth first real-thumbnail post-format-standard'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><a href='https:\/\/silvaco.com\/ja\/blog\/for-next-generation-nanowires-simulation-from-atoms-to-spice\/' data-rel='slide-1' class='slide-image' title='For Next Generation Nanowires, Simulation from Atoms to SPICE'><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg\" class=\"wp-image-20264 avia-img-lazy-loading-not-20264 attachment-large size-large wp-post-image\" alt=\"\" srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg 500w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-300x300.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-80x80.jpg 80w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-36x36.jpg 36w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-180x180.jpg 180w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-37x37.jpg 37w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-55x55.jpg 55w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-48x48.jpg 48w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><div class='slide-content'><header class=\"entry-content-header\"><h3 class='slide-entry-title entry-title '  itemprop=\"headline\" ><a href='https:\/\/silvaco.com\/ja\/blog\/for-next-generation-nanowires-simulation-from-atoms-to-spice\/' title='For Next Generation Nanowires, Simulation from Atoms to SPICE'>For Next Generation Nanowires, Simulation from Atoms to SPICE<\/a><\/h3><span class=\"av-vertical-delimiter\"><\/span><\/header><div class='slide-meta'><time class='slide-meta-time updated'  itemprop=\"datePublished\" datetime=\"2020-01-07T15:26:01-08:00\" >1\u6708 7, 2020<\/time><\/div><div class='slide-entry-excerpt entry-content'  itemprop=\"text\" >As process nodes continue to shrink, the requirement for additional physics-based simulation is gradually creeping into each stage of the design process. By way of illustration, Technology Computer Aided Design (TCAD) simulations are becoming more atomistic in nature, SPICE models are becoming process aware to take account of localized strain effects, and back or middle end of line (BEOL or MEOL) parasitics are moving from exclusively two-dimensional (2D) rule-based solutions to full 3D structure field solvers for numerous critical sections of the layout.<\/div><\/div><footer class=\"entry-footer\"><\/footer><span class='hidden'>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" >\n\t\t\t\t\t\t<span itemprop='url'>https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg<\/span>\n\t\t\t\t\t\t<span itemprop='height'>500<\/span>\n\t\t\t\t\t\t<span itemprop='width'>500<\/span>\n\t\t\t\t<\/span>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"publisher\" itemtype=\"https:\/\/schema.org\/Organization\" itemscope=\"itemscope\" >\n\t\t\t\t\t\t<span itemprop='name'>Ingrid Schwarz<\/span>\n\t\t\t\t\t\t<span itemprop='logo' itemscope itemtype='https:\/\/schema.org\/ImageObject'>\n\t\t\t\t\t\t\t<span itemprop='url'>\/wp-content\/uploads\/2019\/11\/silvaco-logo.png<\/span>\n\t\t\t\t\t\t <\/span>\n\t\t\t\t<\/span><span class='av-structured-data'  itemprop=\"author\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Person\" ><span itemprop='name'>Ingrid Schwarz<\/span><\/span><span class='av-structured-data'  itemprop=\"datePublished\" datetime=\"2020-04-21T19:38:15-07:00\" >2020-01-07 15:26:01<\/span><span class='av-structured-data'  itemprop=\"dateModified\" itemtype=\"https:\/\/schema.org\/dateModified\" >2021-08-04 22:30:19<\/span><span class='av-structured-data'  itemprop=\"mainEntityOfPage\" itemtype=\"https:\/\/schema.org\/mainEntityOfPage\" ><span itemprop='name'>For Next Generation Nanowires, Simulation from Atoms to SPICE<\/span><\/span><\/span><\/article><\/div><div class='slide-entry-wrap'><article class='slide-entry flex_column  post-entry post-entry-29835 slide-entry-overview slide-loop-5 slide-parity-odd  av_fullwidth first real-thumbnail post-format-standard'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><a href='https:\/\/silvaco.com\/ja\/blogs\/atomistic-analysis-and-next-generation-computing-at-iedm-2019\/' data-rel='slide-1' class='slide-image' title='Atomistic Analysis and Next Generation Computing at IEDM 2019'><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg\" class=\"wp-image-18659 avia-img-lazy-loading-not-18659 attachment-large size-large wp-post-image\" alt=\"\" srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg 500w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-300x300.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-80x80.jpg 80w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-36x36.jpg 36w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-180x180.jpg 180w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-37x37.jpg 37w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-55x55.jpg 55w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-48x48.jpg 48w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><div class='slide-content'><header class=\"entry-content-header\"><h3 class='slide-entry-title entry-title '  itemprop=\"headline\" ><a href='https:\/\/silvaco.com\/ja\/blogs\/atomistic-analysis-and-next-generation-computing-at-iedm-2019\/' title='Atomistic Analysis and Next Generation Computing at IEDM 2019'>Atomistic Analysis and Next Generation Computing at IEDM 2019<\/a><\/h3><span class=\"av-vertical-delimiter\"><\/span><\/header><div class='slide-meta'><time class='slide-meta-time updated'  itemprop=\"datePublished\" datetime=\"2019-12-18T19:26:55-08:00\" >12\u6708 18, 2019<\/time><\/div><div class='slide-entry-excerpt entry-content'  itemprop=\"text\" >IEDM is THE device conference with more than a thousand participants from major companies and R&D institutes. Many talks were dedicated to new memory devices and circuits, including Ferroelectrics, MRAM, RRAM, driven by the requirements of AI processing. EUV is definitely there for 3nm and beyond. 3D integration was shown for LP-HP logic and RF. Gate-All-Around devices, with nanowires or nanosheets are mature versus FinFET.<\/div><\/div><footer class=\"entry-footer\"><\/footer><span class='hidden'>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" >\n\t\t\t\t\t\t<span itemprop='url'>https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg<\/span>\n\t\t\t\t\t\t<span itemprop='height'>500<\/span>\n\t\t\t\t\t\t<span itemprop='width'>500<\/span>\n\t\t\t\t<\/span>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"publisher\" itemtype=\"https:\/\/schema.org\/Organization\" itemscope=\"itemscope\" >\n\t\t\t\t\t\t<span itemprop='name'>Erick Castellon<\/span>\n\t\t\t\t\t\t<span itemprop='logo' itemscope itemtype='https:\/\/schema.org\/ImageObject'>\n\t\t\t\t\t\t\t<span itemprop='url'>\/wp-content\/uploads\/2019\/11\/silvaco-logo.png<\/span>\n\t\t\t\t\t\t <\/span>\n\t\t\t\t<\/span><span class='av-structured-data'  itemprop=\"author\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Person\" ><span itemprop='name'>Erick Castellon<\/span><\/span><span class='av-structured-data'  itemprop=\"datePublished\" datetime=\"2020-04-21T19:38:15-07:00\" >2019-12-18 19:26:55<\/span><span class='av-structured-data'  itemprop=\"dateModified\" itemtype=\"https:\/\/schema.org\/dateModified\" >2021-08-04 22:30:43<\/span><span class='av-structured-data'  itemprop=\"mainEntityOfPage\" itemtype=\"https:\/\/schema.org\/mainEntityOfPage\" ><span itemprop='name'>Atomistic Analysis and Next Generation Computing at IEDM 2019<\/span><\/span><\/span><\/article><\/div><div class='slide-entry-wrap'><article class='slide-entry flex_column  post-entry post-entry-29836 slide-entry-overview slide-loop-6 slide-parity-odd  av_fullwidth first real-thumbnail post-format-standard'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><a href='https:\/\/silvaco.com\/ja\/blogs\/silvaco-exhibits-and-presents-invited-paper-on-atomistic-simulation-at-iedm-2019\/' data-rel='slide-1' class='slide-image' title='Silvaco Exhibits and Presents Invited Paper on Atomistic Simulation at IEDM 2019'><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg\" class=\"wp-image-18659 avia-img-lazy-loading-not-18659 attachment-large size-large wp-post-image\" alt=\"\" srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg 500w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-300x300.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-80x80.jpg 80w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-36x36.jpg 36w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-180x180.jpg 180w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-37x37.jpg 37w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-55x55.jpg 55w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device-48x48.jpg 48w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><div class='slide-content'><header class=\"entry-content-header\"><h3 class='slide-entry-title entry-title '  itemprop=\"headline\" ><a href='https:\/\/silvaco.com\/ja\/blogs\/silvaco-exhibits-and-presents-invited-paper-on-atomistic-simulation-at-iedm-2019\/' title='Silvaco Exhibits and Presents Invited Paper on Atomistic Simulation at IEDM 2019'>Silvaco Exhibits and Presents Invited Paper on Atomistic Simulation at IEDM 2019<\/a><\/h3><span class=\"av-vertical-delimiter\"><\/span><\/header><div class='slide-meta'><time class='slide-meta-time updated'  itemprop=\"datePublished\" datetime=\"2019-11-19T00:00:05-08:00\" >11\u6708 19, 2019<\/time><\/div><div class='slide-entry-excerpt entry-content'  itemprop=\"text\" >The IEEE International Electron Devices Meeting (IEDM) is the world\u2019s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. It is the flagship conference for\r\n\r\nNanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices\r\nNovel quantum and nano-scale devices and phenomenology\r\nOptoelectronics, devices for power and energy harvesting, high-speed devices\r\nProcess technology and device modeling and simulation<\/div><\/div><footer class=\"entry-footer\"><\/footer><span class='hidden'>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" >\n\t\t\t\t\t\t<span itemprop='url'>https:\/\/silvaco.com\/wp-content\/uploads\/2020\/02\/tcad_process_device.jpg<\/span>\n\t\t\t\t\t\t<span itemprop='height'>500<\/span>\n\t\t\t\t\t\t<span itemprop='width'>500<\/span>\n\t\t\t\t<\/span>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"publisher\" itemtype=\"https:\/\/schema.org\/Organization\" itemscope=\"itemscope\" >\n\t\t\t\t\t\t<span itemprop='name'>Erick Castellon<\/span>\n\t\t\t\t\t\t<span itemprop='logo' itemscope itemtype='https:\/\/schema.org\/ImageObject'>\n\t\t\t\t\t\t\t<span itemprop='url'>\/wp-content\/uploads\/2019\/11\/silvaco-logo.png<\/span>\n\t\t\t\t\t\t <\/span>\n\t\t\t\t<\/span><span class='av-structured-data'  itemprop=\"author\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Person\" ><span itemprop='name'>Erick Castellon<\/span><\/span><span class='av-structured-data'  itemprop=\"datePublished\" datetime=\"2020-04-21T19:38:15-07:00\" >2019-11-19 00:00:05<\/span><span class='av-structured-data'  itemprop=\"dateModified\" itemtype=\"https:\/\/schema.org\/dateModified\" >2021-08-04 22:33:40<\/span><span class='av-structured-data'  itemprop=\"mainEntityOfPage\" itemtype=\"https:\/\/schema.org\/mainEntityOfPage\" ><span itemprop='name'>Silvaco Exhibits and Presents Invited Paper on Atomistic Simulation at IEDM 2019<\/span><\/span><\/span><\/article><\/div><div class='slide-entry-wrap'><article class='slide-entry flex_column  post-entry post-entry-29837 slide-entry-overview slide-loop-7 slide-parity-odd  av_fullwidth first real-thumbnail post-format-standard'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><a href='https:\/\/silvaco.com\/ja\/blog\/how-tcad-can-optimize-power-electronics\/' data-rel='slide-1' class='slide-image' title='How TCAD Can Optimize Power Electronics'><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg\" class=\"wp-image-20264 avia-img-lazy-loading-not-20264 attachment-large size-large wp-post-image\" alt=\"\" srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg 500w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-300x300.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-80x80.jpg 80w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-36x36.jpg 36w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-180x180.jpg 180w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-37x37.jpg 37w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-55x55.jpg 55w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-48x48.jpg 48w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><div class='slide-content'><header class=\"entry-content-header\"><h3 class='slide-entry-title entry-title '  itemprop=\"headline\" ><a href='https:\/\/silvaco.com\/ja\/blog\/how-tcad-can-optimize-power-electronics\/' title='How TCAD Can Optimize Power Electronics'>How TCAD Can Optimize Power Electronics<\/a><\/h3><span class=\"av-vertical-delimiter\"><\/span><\/header><div class='slide-meta'><time class='slide-meta-time updated'  itemprop=\"datePublished\" datetime=\"2019-10-25T16:13:23-07:00\" >10\u6708 25, 2019<\/time><\/div><div class='slide-entry-excerpt entry-content'  itemprop=\"text\" >The power electronics (PE) market is growing rapidly, driven by the accelerating demand of EV and HEV vehicles. Power devices lend themselves to design and manufacturing innovations at the transistor-level to improve device performance and reduce development and production costs. Silicon-carbide (SiC), gallium-nitride (GaN), and other wide bandgap materials have started to replace silicon in high-voltage power devices.<\/div><\/div><footer class=\"entry-footer\"><\/footer><span class='hidden'>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" >\n\t\t\t\t\t\t<span itemprop='url'>https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg<\/span>\n\t\t\t\t\t\t<span itemprop='height'>500<\/span>\n\t\t\t\t\t\t<span itemprop='width'>500<\/span>\n\t\t\t\t<\/span>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"publisher\" itemtype=\"https:\/\/schema.org\/Organization\" itemscope=\"itemscope\" >\n\t\t\t\t\t\t<span itemprop='name'>Ingrid Schwarz<\/span>\n\t\t\t\t\t\t<span itemprop='logo' itemscope itemtype='https:\/\/schema.org\/ImageObject'>\n\t\t\t\t\t\t\t<span itemprop='url'>\/wp-content\/uploads\/2019\/11\/silvaco-logo.png<\/span>\n\t\t\t\t\t\t <\/span>\n\t\t\t\t<\/span><span class='av-structured-data'  itemprop=\"author\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Person\" ><span itemprop='name'>Ingrid Schwarz<\/span><\/span><span class='av-structured-data'  itemprop=\"datePublished\" datetime=\"2020-04-21T19:38:15-07:00\" >2019-10-25 16:13:23<\/span><span class='av-structured-data'  itemprop=\"dateModified\" itemtype=\"https:\/\/schema.org\/dateModified\" >2021-08-04 22:34:09<\/span><span class='av-structured-data'  itemprop=\"mainEntityOfPage\" itemtype=\"https:\/\/schema.org\/mainEntityOfPage\" ><span itemprop='name'>How TCAD Can Optimize Power Electronics<\/span><\/span><\/span><\/article><\/div><div class='slide-entry-wrap'><article class='slide-entry flex_column  post-entry post-entry-29838 slide-entry-overview slide-loop-8 slide-parity-odd  post-entry-last  av_fullwidth first real-thumbnail post-format-standard'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><a href='https:\/\/silvaco.com\/ja\/blog\/the-need-for-advanced-wide-bandgap-power-electronics\/' data-rel='slide-1' class='slide-image' title='The Need for Advanced Wide Bandgap Power Electronics'><img decoding=\"async\" width=\"500\" height=\"500\" src=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg\" class=\"wp-image-20264 avia-img-lazy-loading-not-20264 attachment-large size-large wp-post-image\" alt=\"\" srcset=\"https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg 500w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-300x300.jpg 300w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-80x80.jpg 80w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-36x36.jpg 36w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-180x180.jpg 180w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-37x37.jpg 37w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-55x55.jpg 55w, https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11-48x48.jpg 48w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><div class='slide-content'><header class=\"entry-content-header\"><h3 class='slide-entry-title entry-title '  itemprop=\"headline\" ><a href='https:\/\/silvaco.com\/ja\/blog\/the-need-for-advanced-wide-bandgap-power-electronics\/' title='The Need for Advanced Wide Bandgap Power Electronics'>The Need for Advanced Wide Bandgap Power Electronics<\/a><\/h3><span class=\"av-vertical-delimiter\"><\/span><\/header><div class='slide-meta'><time class='slide-meta-time updated'  itemprop=\"datePublished\" datetime=\"2019-09-09T16:29:52-07:00\" >9\u6708 9, 2019<\/time><\/div><div class='slide-entry-excerpt entry-content'  itemprop=\"text\" >PowerAmerica\u2019s strategic roadmap for next generation wide bandgap (WBG) power electronics (PE) came out earlier this year. The public version of the roadmap includes a background\/introduction and market forecast pertaining to silicon carbide (SiC) and gallium nitride (GaN) PE. I learned a great deal about SiC & GaN PE in this roadmap and I have copied the relevant sections below.<\/div><\/div><footer class=\"entry-footer\"><\/footer><span class='hidden'>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\" >\n\t\t\t\t\t\t<span itemprop='url'>https:\/\/silvaco.com\/wp-content\/uploads\/2020\/04\/tcad_process_device-11.jpg<\/span>\n\t\t\t\t\t\t<span itemprop='height'>500<\/span>\n\t\t\t\t\t\t<span itemprop='width'>500<\/span>\n\t\t\t\t<\/span>\n\t\t\t\t<span class='av-structured-data'  itemprop=\"publisher\" itemtype=\"https:\/\/schema.org\/Organization\" itemscope=\"itemscope\" >\n\t\t\t\t\t\t<span itemprop='name'>Ingrid Schwarz<\/span>\n\t\t\t\t\t\t<span itemprop='logo' itemscope itemtype='https:\/\/schema.org\/ImageObject'>\n\t\t\t\t\t\t\t<span itemprop='url'>\/wp-content\/uploads\/2019\/11\/silvaco-logo.png<\/span>\n\t\t\t\t\t\t <\/span>\n\t\t\t\t<\/span><span class='av-structured-data'  itemprop=\"author\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/Person\" ><span itemprop='name'>Ingrid Schwarz<\/span><\/span><span class='av-structured-data'  itemprop=\"datePublished\" datetime=\"2020-04-21T19:38:15-07:00\" >2019-09-09 16:29:52<\/span><span class='av-structured-data'  itemprop=\"dateModified\" itemtype=\"https:\/\/schema.org\/dateModified\" >2021-08-04 22:39:54<\/span><span class='av-structured-data'  itemprop=\"mainEntityOfPage\" itemtype=\"https:\/\/schema.org\/mainEntityOfPage\" ><span itemprop='name'>The Need for Advanced Wide Bandgap Power Electronics<\/span><\/span><\/span><\/article><\/div><\/div><div class='pagination-wrap pagination-slider'><nav class='pagination'><span class='pagination-meta'>Page 1 of 3<\/span><span class='current'>1<\/span><a href='https:\/\/silvaco.com\/ja\/wp-json\/wp\/v2\/pages\/26162\/?avia-element-paging=2' class='inactive next_page' >2<\/a><a href='https:\/\/silvaco.com\/ja\/wp-json\/wp\/v2\/pages\/26162\/?avia-element-paging=3' class='inactive' >3<\/a><\/nav>\n<\/div><\/div><\/div>\n<div class=\"flex_column av_one_fourth  flex_column_div av-zero-column-padding   avia-builder-el-3  el_after_av_three_fourth  avia-builder-el-last  \" style='border-radius:0px; '><div  class='avia-builder-widget-area clearfix  avia-builder-el-4  avia-builder-el-no-sibling '><div id=\"nav_menu-27\" class=\"widget clearfix widget_nav_menu\"><div class=\"menu-blog-side-menu-japanese-container\"><ul id=\"menu-blog-side-menu-japanese\" class=\"menu\"><li id=\"menu-item-26248\" class=\"menu-item menu-item-type-post_type menu-item-object-page menu-item-has-children menu-item-26248\"><a href=\"https:\/\/silvaco.com\/ja\/blog\/\">Blogs<\/a>\n<ul class=\"sub-menu\">\n\t<li id=\"menu-item-26249\" class=\"menu-item menu-item-type-post_type menu-item-object-page menu-item-26249\"><a href=\"https:\/\/silvaco.com\/ja\/corporate\/blogs\/analog-custom-ic-design-blogs\/\">Analog Custom IC Design Blogs<\/a><\/li>\n\t<li id=\"menu-item-26250\" class=\"menu-item menu-item-type-post_type menu-item-object-page menu-item-26250\"><a href=\"https:\/\/silvaco.com\/ja\/blogs\/design-ip\/\">Design IP Blogs<\/a><\/li>\n\t<li id=\"menu-item-26251\" class=\"menu-item menu-item-type-post_type menu-item-object-page menu-item-26251\"><a href=\"https:\/\/silvaco.com\/ja\/meet-silvaco-blogs\/\">Meet Silvaco Blogs<\/a><\/li>\n\t<li id=\"menu-item-26252\" class=\"menu-item menu-item-type-post_type menu-item-object-page menu-item-26252\"><a href=\"https:\/\/silvaco.com\/ja\/tcad-blogs-2\/\">TCAD Blogs<\/a><\/li>\n<\/ul>\n<\/li>\n<\/ul><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":3,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"categories":[],"tags":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v24.0 (Yoast SEO v24.0) - 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