Silvaco to showcase advanced node solutions at DAC 2017

SANTA CLARA, Calif., – June 6, 2017

Silvaco, Inc. today announced that it plans to showcase the company’s full TCAD-to-signoff tools with emphasis on advanced node capabilities at Design Automation Conference (DAC) 2017.


  • June 19, 2017 – June 21, 2017
  • Exhibit Hours: 10:00 AM – 6:00 PM

Visit Silvaco in booth #1447 at the Austin Convention Center
500 E Cesar Chavez Street
Austin, TX 78701

The Silvaco booth will host Tech talks including customer success stories from Oracle on how Silvaco SmartSpice enables their flow at 7nm. DAC 2017 will also be venue to the announcement of a collaboration between Silvaco and Aldec to provide the design community with a solution for mixed mode co-simulation with Riviera-Pro and SmartSpice.

Silvaco technology experts will be available to discuss and demo our broad portfolio of TCAD-to-signoff solutions with emphasis on new products and capabilities serving advanced process nodes.

  • Victory Process, Victory Device enabling 2D and 3D TCAD process and device simulation for power devices and automotive applications
  • SmartSpice for advance node circuit simulation including co-simulation with Riviera-Pro
  • Expert for schematic driven layout especially for FPD applications
  • Jivaro & Belledonne for extracted netlist optimization and analysis and SPICE simulation acceleration
  • New solution for full Memory variation analysis enabling Spice simulation, effective fail detection and accurate yield estimation from VarMan
  • InVar for EM/IR and thermal analysis for complete sign-off
  • IP – I3C, CAN-FD and cloud based IP management platform Xena

Silvaco will also be co-hosting the Stars of IP party, a Premier Semiconductor IP social event, on Tuesday, June 20, 2017 at Speak Easy off of Congress Avenue.