Amorphous silicon Thin-Film Transistors (a-Si TFTs) are widely used as the switching device of liquid crystal display (LCD) technology. For development and analysis of a-Si TFTs, many research groups are trying to understand the physical mechanisms of a-Si TFTs. In particular, leakage current behavior is a major consideration for switching devices like a-Si TFTs. To analyze the leakage current mechanisms, calibration with numerical simulation is required.

In 1975, screen printing was first applied to solar cells for the formation of the front and rear contacts replacing expensive vacuum metallization [1]. The encapsulate used in a photovoltaic (PV) module has many requirements. It must be optically transparent, electrically insulating, mechanically compliant, adherent to both glass and cells, and sufficiently robust to withstand 20–30 years in the field. Since the early 1980s, the encapsulate in all PV modules has been ethylene vinyl acetate (EVA) [2, 3].

In this paper, a two dimensional (2-D) generic model of quantum well light emitting diode (LED) based on ZnO, II-VI compound semiconductors has been reported. The structure has been designed and analyzed using ATLAS in conjuction with the BLAZE and LED modules of SILVACO software. A closed model has been developed for electrical and optical characterization of the device. The model includes all the relevant material physics and solutions of non-linear decoupled semiconductor transport and Poisson’s equations. All the radiative and non radiative recombination mechanisms have been given their due consideration in this analysis. The results obtained on the basis of numerical simulation exhibits the potential advantages of wide band gap ZnO material based LEDs over its competitive GaN material based LEDs.

The analysis and characterization of stress effects have become an integral part of semiconductor technology and device design. In a typical semiconductor process flow the stresses are generated primarily due to volume expansion or contraction of the adjacent materials during temperature variations. Stresses could also be generated during oxidation, silicidation, etching, and deposition processes or due to lattice expansion or contraction after introducing large doses of dopants. Simulation of process induced stresses is an important component of traditional TCAD analysis since these stresses could have adverse or positive effect on individual process steps or on final device characteristics.

Since lighting is estimated to account for 20% of the world’s electricity consumption, the search for reliable and efficient lighting technologies to replace incandescent and fluorescent modules is intense.