• TCAD Examples

    TCAD Examples

mos2ex13.in : SiGe PMOS Id/Vds with NEB Model

Requires: Blaze/Giga
Minimum Versions: Atlas 5.32.0.R

This example demonstrates a comparison of Id/Vds analyses including second breakdown of a short PMOS structure with a SiGe channel using the non-isothermal Energy Balance (NEB) models. It shows:

  • Specification of PMOS structure using Atlas syntax
  • Specification of abrupt SiGe heterojunctions
  • Selection of the energy balance model, lattice heat flow solution and coupled solver
  • Simulation of Id/Vds characteristic for Vgs=-1.0V

Many of the models and methods required for Id/Vds and breakdown simulation are described in the snapback and second breakdown examples in the MOS examples section. Some tips in defining SiGe structures are also given in the HBT examples section. Users should consult both these sections for more details on these two areas.

Submicron devices should be simulated using the energy balance model due to velocity overshoot, and nonlocal impact ionization effects, which could substantially influence device characteristics. For high current levels the thermal self-heating effects could also play an important role decreasing mobility and impact ionization rate. This example demonstrates comparison of Id/Vds curves obtained with energy balance and nonisothermal energy balance models. The curve tracing algorithm is used to obtain these curves.

The example contains two Atlas runs. The first uses non-isothermal energy balance simulation of an Id/Vds curve and the second repeats this simulation without the lattice heating model.

The device is described in the first part of the input file, including mesh, regions locations, electrodes locations, and doping distribution. The region statements are used to define SiO2, Si and SiGe regions. The Ge composition fraction is defined using x.composition=<num> Since no grad.* parameters were used on the region statement the Ge composition fraction has an abrupt change from 0.25 to zero at the region boundary. This constitutes the abrupt heterojunction. Discontinuities in band potentials will be seen at the SiGe/Si region boundaries.

After the device description the material statements are used to specify the electron and hole lifetimes, hole energy relaxation times both in Si and SiGe, and Nc and Nv in SiGe. The model hcte.ho lat.temp statement is used to specify solution of the hole energy balance and lattice heating equations respectively. Other carrier and lattice temperature physical models are also set on the same statement. The impact statement is used to assign the energy relaxation length for Selberherr model.

Thermal boundary conditions are defined in the thermcontact statement. A value of the thermal resistance is specified at the thermocontact located along the substrate, and thermal isolation conditions are assumed on the all other surfaces.

Then the gate voltage is ramped to -2V, and then the curve tracing algorithm is used for ramping the drain voltage. The curvetrace statement is used to initialize parameters for the curve tracing algorithm. The contr.name parameter specifies the name of the electrode for which the load line technique will be applied (drain in this case). The curr.cont parameter means that value of current will be monitored, and the simulation will be stopped when the current exceeds the value specified by end.val parameter. The mincur parameter defines the minimum current value after which the load line technique will actually be applied (before that voltage boundary conditions are used). The nextst.ratio parameter defines the factor which to use to increase voltage step on the smooth parts of the IV curve. The command solve curvetrace is used to activate the curve tracing algorithm.

The second Atlas run uses the same syntax, except that the solution of the lattice energy balance equation is turned off in the models statement. The Id/Vds curves from both runs can be overlaid using TonyPlot. In plotting the drain voltage the quantity: drain int. bias should be used in TonyPlot. This is the value of the voltage on the metal/semiconductor interface at the drain as opposed to 'drain bias' which includes the load resistor used in the curve trace algorithm.

To load and run this example, select the Load button in DeckBuild > Examples. This will copy the input file and any support files to your current working directory. Select the Run button in DeckBuild to execute the example.

Input Files
Output Results
These examples are for reference only. Every software package contains a full set of examples suitable for that version and are installed with the software. If you see examples here that are not in your installation you should consider updating to a later version of the software.
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