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anelex16.in : Intermetal Dielectric Formation
Requires: ELITE Minimum Versions: ATHENA 5.20.0.R
This example shows the use of two conductors (poly and aluminum) that come close together. The narrow gap between them can form voids as demonstrated in this example for atmospheric pressure CVD. The type of inter-metal dielectric material, the thickness of this dielectric, and the method of insulation can have an impact on design rules for ICs with multi-level metalization.
To load and run this example, select the Load example button. This action will copy all associated files to your current working directory. Select the DeckBuild run button to execute the example.